Texas Instruments THS3215IRGVR
- Part No.:
- THS3215IRGVR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
THS3215IRGVR.pdf
- Description:
- IC OPAMP DIFF 1 CIRCUIT 16VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,353
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
THS3215IRGVR from Texas Instruments is a 650-MHz, two-stage differential-to-single-ended DAC output amplifier with buffered differential inputs, fixed 2 V/V input stage gain, externally configurable output stage gain (up to 5 V/V total), 3000 V/µs slew rate, and –66 dBc HD2 at 20 MHz driving 5 VPP into 100 Ω - optimized for high-fidelity signal reconstruction in wideband arbitrary waveform generators and TI's high-speed DAC interfaces like DAC38J82.
For engineers reviewing the THS3215IRGVR datasheet, THS3215IRGVR pinout, THS3215IRGVR application, or THS3215IRGVR equivalent, this page delivers verified circuit role (DAC output driver with integrated D2S + current-feedback OPS), package mapping (VQFN-16, 4.0 mm × 4.0 mm), thermal metrics (RθJA = 45 °C/W), distortion performance (–66 dBc HD2 / –68 dBc HD3 @ 20 MHz), and validated alternatives for DAC interface, AWG, and piezo driver designs.
Technical Context
The THS3215IRGVR implements a cascaded architecture: a low-distortion, dc-coupled differential-input buffer stage (D2S) with 2 V/V fixed gain and 350-MHz full-power bandwidth feeds either an internal SPDT switch or external path into a wideband current-feedback output power stage (OPS) with 270-MHz full-power bandwidth and 3000 V/µs slew rate. The D2S stage provides 25-Ω source termination compatibility and low-output-impedance single-ended conversion; the OPS supports flexible gain via external RF/RG resistors and includes shutdown control (DISABLE pin) and midsupply reference buffering.
Its dual-supply operation (±4 V to ±7.9 V) or single-supply mode (8 V to 15.8 V) enables use with split-rail DACs or ac-coupled systems; the integrated VMID buffer delivers low-impedance mid-supply bias for single-supply signal-path biasing, while PATHSEL pin selects between internal D2S output or external signal injection into the OPS noninverting input - enabling reconfigurable signal routing without external switches.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | 650 MHz (D2S + OPS combined, 100 mVPP, peaking < 1.5 dB) - supports >500-MHz baseband signal integrity in AWG and high-speed DAC reconstruction. |
| Large-signal bandwidth | 270 MHz (5 VPP output into 100 Ω) - maintains linearity for high-amplitude, wideband waveforms without clipping or slew limiting. |
| Harmonic distortion | HD2 = –66 dBc, HD3 = –68 dBc (20 MHz, 5 VPP, 100 Ω load) - meets stringent spectral purity requirements for communications and test equipment. |
| Slew rate | 3000 V/µs - enables fast transient response for sharp-edged arbitrary waveforms and pulse generation. |
| Supply range | Split: ±4 V to ±7.9 V; Single: 8 V to 15.8 V - accommodates both bipolar DAC outputs and single-rail industrial piezo drivers. |
| Total supply current | 34.5 mA typical (±6-V supplies, D2S + OPS + VMID buffer active) - balances high-speed performance with moderate power consumption. |
| Output drive | 140 mA peak into 20 Ω - sufficient to drive heavy capacitive loads (e.g., piezo elements) or feed subsequent high-voltage amplifiers like THS3091. |
Pinout & Package
VQFN-16 (RGV) package, 4.00 mm × 4.00 mm body size, thermally enhanced with exposed pad connected to GND per TI layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VMID_IN) | DC reference buffer input | Accepts external DC bias or error-correction voltage for precise output offset control in single-supply applications. |
| 2 (+IN), 3 (–IN) | Differential input to D2S stage | High-impedance, matched inputs compatible with complementary-current DAC outputs; common-mode headroom ≥1.3 V from either rail. |
| 4 (PATHSEL) | SPDT switch control | Logic-low selects internal D2S output; logic-high selects external VIN+ path - enables dynamic signal routing without external multiplexers. |
| 6 (VO1) | D2S stage output | Available buffered single-ended output (2 V/V gain) - usable directly or filtered before feeding OPS stage. |
| 9 (VIN+), 12 (VIN–) | OPS noninverting/inverting inputs | External gain-setting nodes; VIN+ accepts D2S output or external signal; VIN– connects to RF/RG network for precise gain configuration. |
| 10 (DISABLE) | OPS shutdown control | Logic-high disables output stage, reducing quiescent current to ≤2.9 mA - enables power-gating during idle periods. |
| 11 (VOUT) | OPS output | Main high-current, low-impedance output (0.05 Ω DC impedance) - drives 100 Ω loads or heavy capacitive piezo elements. |
| 14 (VREF) | D2S offset input | Adjusts DC level of D2S output; gain = 0.975–1.015 V/V - supports fine-grained dc offset correction in precision DAC interfaces. |
| 15 (VMID_OUT) | Midsupply reference buffer output | Low-impedance (~0.3 Ω) 0-V (mid-supply) source - simplifies biasing of ac-coupled stages in single-supply configurations. |
| 5,8,13,16 (±VCC1/±VCC2) | Power supply pins | +VCC1/–VCC1 power OPS; +VCC2/–VCC2 power D2S and VMID buffer - independent supply domains improve PSRR and reduce crosstalk. |
Key Features
| Feature | Design Value |
|---|---|
| Two-stage D2S + current-feedback OPS architecture | Enables simultaneous high linearity (–66 dBc HD2), wide bandwidth (650 MHz SSBW), and flexible gain (2.5× OPS + 2× D2S = 5× total) without external op-amp staging. |
| Integrated SPDT input switch (PATHSEL) | Eliminates need for discrete analog switches when selecting between DAC-reconstructed signal and alternate sources - reduces board area and signal path degradation. |
| On-chip midsupply (VMID) buffer | Provides stable, low-Z mid-rail bias (200 MHz SSBW, 110 V/µs slew) - removes requirement for external op-amp or resistor divider in single-supply ac-coupled designs. |
| DC-coupled differential-to-single-ended conversion | Maintains sub-mV offset stability (±8 mV max D2S output offset) across temperature - critical for precision DAC output calibration and zero-drift applications. |
| Programmable output stage shutdown (DISABLE) | Reduces OPS supply current from 34.5 mA to ≤2.9 mA - enables dynamic power management in battery-powered or thermally constrained AWG systems. |
Applications
| DAC Output Amplification | Wideband Arbitrary Waveform Generation |
|---|---|
|
Use Scenario: Driving the complementary-current output of high-speed DACs (e.g., DAC38J82) into 50-Ω or 100-Ω loads with minimal distortion and full dc coupling. IC Role / Device Role / Timing Role: Final-stage DAC output amplifier providing differential-to-single-ended conversion, gain, and low-impedance drive. Use Value: Achieves –66 dBc HD2 at 20 MHz and 5 VPP output - preserves spectral fidelity required for RF signal synthesis and high-resolution test equipment. |
Use Scenario: Generating high-fidelity, multi-MHz arbitrary waveforms for semiconductor ATE, radar simulation, and biomedical stimulus systems. IC Role / Device Role / Timing Role: Wideband, low-distortion line driver delivering fast settling (25 ns to 0.1%) and 3000 V/µs slew for sharp waveform edges. Use Value: 650-MHz small-signal bandwidth and 270-MHz large-signal bandwidth support >200-MHz baseband signals without amplitude roll-off or phase distortion. |
| Predriver for High-Voltage Amplifiers | Single-Supply Piezo Element Driver |
|
Use Scenario: Providing clean, high-current drive to the input of high-voltage power amplifiers (e.g., THS3091) for >20-VPP output stages. IC Role / Device Role / Timing Role: Interstage gain block with 140 mA peak output current and 0.05 Ω DC output impedance - minimizes loading on upstream DAC and ensures stable gain. Use Value: Delivers 5 VPP into 100 Ω with <4% overshoot and 1.7 ns rise time - prevents ringing and instability in cascaded amplifier chains. |
Use Scenario: Directly driving high-capacitance piezoelectric transducers (e.g., ultrasound probes, precision positioning actuators) from a single 15-V supply. IC Role / Device Role / Timing Role: Capacitive-load-optimized output stage with 12 VPP capability into heavy CLOAD and integrated VMID biasing. Use Value: Supports 12 VPP output using single 15-V supply and eliminates external bias circuitry - reduces BOM count and improves reliability in medical/sensing systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential-to-single-ended amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS3217IRGVR | Higher quiescent current (55 mA vs. 34.5 mA), wider bandwidth (800 MHz SSBW, 500 MHz LSBW), lower distortion tolerance (–60 dBc HD2 vs. –66 dBc). | Better suited for ultra-wideband (>400 MHz) AWG systems where power budget allows; less optimal for thermally constrained or battery-powered DAC interfaces. | Select THS3217IRGVR only when >650-MHz small-signal bandwidth or >270-MHz large-signal bandwidth is required; otherwise THS3215IRGVR offers superior distortion/power trade-off. |
| LMH5401RTVT | Single-stage fully differential amplifier (FDA); no integrated D2S/OPS separation, no VMID buffer, no PATHSEL switch; 1.2-GHz GBW but higher HD2 (–55 dBc @ 20 MHz). | Requires external components for dc biasing and signal routing; better for pure FDA applications than DAC-specific reconstruction paths. | Choose LMH5401RTVT for general-purpose high-speed FDA use with external gain/offset control; THS3215IRGVR remains preferred for turnkey DAC interface with integrated features. |
Compared with THS3215IRGVR, THS3217IRGVR trades higher power for greater bandwidth and reduced flatness, while LMH5401RTVT lacks integrated D2S functionality and bias infrastructure - making THS3215IRGVR uniquely optimized for TI DAC ecosystems and single-supply piezo drive.
Availability
THS3215IRGVR is available at Aetrix Electronics and suitable for digital-to-analog converter output amplification, wideband arbitrary waveform generation, and single-supply piezo element driving requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for THS3215IRGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-performance signal-chain solutions, with decades of expertise in high-speed amplifiers and data converters.
The THS3215IRGVR belongs to TI's THS32xx family of high-speed, low-distortion amplifiers designed specifically for interfacing with complementary-current-output DACs in test & measurement, communications, and precision instrumentation systems.
FAQ
What is the primary function of the THS3215IRGVR in a signal chain?
The THS3215IRGVR serves as a dedicated differential-to-single-ended DAC output amplifier, combining a buffered input stage (D2S) with fixed 2 V/V gain and a configurable current-feedback output stage (OPS) to deliver high-fidelity, dc-coupled signal reconstruction. Its architecture is purpose-built for TI's high-speed DACs like DAC38J82, enabling low-distortion, wideband amplification without external staging components - THS3215IRGVR integrates signal routing (PATHSEL), biasing (VMID), and shutdown (DISABLE) to simplify system design.
Can the THS3215IRGVR operate from a single supply, and how is biasing handled?
Yes, the THS3215IRGVR supports single-supply operation from 8 V to 15.8 V. Biasing is simplified by its integrated midsupply reference buffer (VMID), which provides a low-impedance, wideband (200 MHz SSBW) mid-rail voltage at pin 15. When VMID_IN (pin 1) is grounded or left floating, VMID_OUT delivers ~0 V relative to the supply midpoint - eliminating the need for external resistor dividers or op-amp buffers in ac-coupled, single-supply applications - THS3215IRGVR thus enables robust, compact DAC interface designs with minimal external components.
How does the PATHSEL pin affect signal routing in the THS3215IRGVR?
The PATHSEL pin (pin 4) controls an internal SPDT switch that routes either the internal D2S output (VO1, pin 6) or an external signal (VIN+, pin 9) to the noninverting input of the output power stage (OPS). A logic-low voltage (≤0.7 V) selects the internal D2S path; a logic-high (≥0.9 V) selects the external path. This feature allows dynamic reconfiguration of the signal chain - for example, switching between DAC-reconstructed waveforms and auxiliary test signals - without adding external multiplexers or PCB traces, preserving signal integrity and reducing system complexity - THS3215IRGVR thus supports flexible, multi-source waveform generation architectures.
What is the maximum output voltage swing achievable with the THS3215IRGVR?
The THS3215IRGVR delivers up to 10 VPP into a 100-Ω load using ±6.5-V supplies, and up to 12 VPP into heavy capacitive loads using a single 15-V supply - enabled by its current-feedback OPS stage and low DC output impedance (0.05 Ω). Output headroom is 1.3–1.6 V from either rail under linear conditions (RLOAD = 500 Ω), ensuring ample swing margin for high-amplitude waveforms. For piezo driver applications, the 12-VPP capability with single-supply operation makes THS3215IRGVR suitable for demanding actuator and ultrasonic transducer interfaces without external level-shifting circuitry.
Does the THS3215IRGVR include power-saving features for portable or thermally sensitive systems?
Yes, the THS3215IRGVR includes a dedicated DISABLE pin (pin 10) that places the output power stage (OPS) into low-current shutdown mode, reducing total supply current from 34.5 mA to ≤2.9 mA (±6-V supplies). This feature enables dynamic power management during idle periods in battery-powered arbitrary waveform generators or space-constrained instrumentation. Combined with its 45 °C/W junction-to-ambient thermal resistance (VQFN-16 package), THS3215IRGVR supports reliable operation in thermally demanding environments - making it viable for portable test equipment and embedded signal-generation modules where efficiency and thermal headroom are critical.
THS3215IRGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Differential
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 3000V/µs
- Gain Bandwidth Product:
- -
- -3db Bandwidth:
- 650 MHz
- Current - Input Bias:
- 4 µA
- Voltage - Input Offset:
- 12 mV
- Current - Supply:
- 35mA
- Current - Output / Channel:
- 95 mA
- Voltage - Supply Span (Min):
- 8 V
- Voltage - Supply Span (Max):
- 15.8 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (4x4)
THS3215IRGVR FAQ
1.How can I place an order for THS3215IRGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for THS3215IRGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS3215IRGVR reliable?
The price and inventory of THS3215IRGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS3215IRGVR is usually 5 days.
3.What payment methods are accepted for THS3215IRGVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS3215IRGVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS3215IRGVR?
THS3215IRGVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS3215IRGVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS3215IRGVR?
For technical support, including THS3215IRGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS3215IRGVR requirements.
6.How does Aetrix verify that THS3215IRGVR is sourced from the original manufacturer or authorized distributors?
All THS3215IRGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS3215IRGVR meets industry standards.
7.What is the process for return or replacement of THS3215IRGVR?
All THS3215IRGVR units undergo pre-shipment inspection (PSI). If there is an issue with THS3215IRGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS3215IRGVR part is unused and in its original packaging.
Return procedure for THS3215IRGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
THS3215IRGVR Tags

-
LM358DT
STMicroelectronics

-
LM358DR
Texas Instruments

-
LM2904DR
Texas Instruments

-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments

-
MCP6006T-E/OT
Microchip Technology

-
MCP6006UT-E/OT
Microchip Technology

-
LM324PWR
Texas Instruments

-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments

-
LM358P
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

.jpg)