Texas Instruments THS4082IDGN

Overview

THS4082IDGN from Texas Instruments is a dual-channel, ultralow-power, high-speed voltage-feedback operational amplifier designed for precision video and communication signal conditioning. It delivers 175 MHz bandwidth (−3 dB, G = 1), 230 V/µs slew rate, and 43 ns settling time (0.1%), with 3.4 mA per channel quiescent current and ±15 V supply capability - enabling low-power, high-fidelity analog front-ends in broadcast-grade video routing and DSL line drivers.

For engineers reviewing the THS4082IDGN datasheet, THS4082IDGN pinout, THS4082IDGN application, or THS4082IDGN equivalent, key selection considerations include its dual-channel MSOP-8 PowerPAD™ package, differential gain error of 0.01%, THD of −64 dBc at 1 MHz (RL = 150 Ω), and guaranteed operation from −40°C to +85°C for industrial video infrastructure and high-speed data acquisition systems.

Technical Context

The THS4082IDGN employs a dielectrically isolated complementary bipolar process with GHz f_T transistors, enabling voltage-feedback architecture optimized for wide bandwidth and fast transient response. Its internal compensation targets maximum small-signal bandwidth and slew rate, requiring external series output resistance (>20 Ω) when driving >10 pF capacitive loads to maintain phase margin.

It features rail-to-rail input common-mode range (±13.8 V at ±15 V supplies), 90 dB CMRR, and low-noise design (10 nV/√Hz input voltage noise, 0.7 pA/√Hz input current noise), supporting high dynamic range signal amplification without significant distortion or offset drift across temperature.

Key Specifications

Pinout & Package

The THS4082IDGN is housed in an 8-pin MSOP PowerPAD™ (DGN) package with an exposed thermal pad on the underside, electrically isolated from all terminals. This thermally enhanced construction enables 2.14 W power dissipation at TA = 25°C (θ_JA = 58.4°C/W) and requires PCB-level thermal vias under the pad for optimal junction temperature control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual op-amp applications.

Compared with THS4082CDGN, the THS4082IDGN provides guaranteed −40°C startup and 85°C sustained operation for outdoor broadcast encoders, while LMH6629MA/NOPB offers superior RF bandwidth at the expense of video-specific distortion metrics and thermal efficiency.

Availability

THS4082IDGN is available at Aetrix Electronics and suitable for broadcast video infrastructure, DSL line card development, and high-speed data acquisition systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for THS4082IDGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-performance op-amps and signal chain solutions.

The THS4082IDGN belongs to TI's THS408x family of ultralow-power, high-speed voltage-feedback amplifiers engineered specifically for broadcast-quality video signal conditioning and high-fidelity communication line drivers.

FAQ

What is the maximum capacitive load the THS4082IDGN can drive without instability?

The THS4082IDGN is internally compensated for optimal bandwidth and slew rate, making it sensitive to direct capacitive loading. For loads exceeding 10 pF, a series resistor ≥20 Ω must be placed between the output pin and the load. In 75 Ω video systems, a 75 Ω series resistor provides both isolation and impedance matching. Layout best practices - including minimized trace length and proper grounding - are essential to preserve stability in the THS4082IDGN.

Does the THS4082IDGN PowerPAD™ thermal pad require electrical connection?

No - the THS4082IDGN PowerPAD™ thermal pad is electrically isolated from all pins and serves solely for thermal conduction. It must be soldered to a dedicated copper pour on the PCB with ≥5 thermal vias (13 mil diameter) connecting to an internal ground plane. The pad must remain unconnected to any signal net or supply rail to avoid introducing noise or compromising isolation integrity in the THS4082IDGN.

Can the THS4082IDGN operate from a single 24 V supply?

Yes - the THS4082IDGN supports single-supply operation from 10 V to 30 V. At V_CC = 24 V (with V_CC− = 0 V), the common-mode input range extends to 0.2 V to 23.8 V, and output swing reaches ±11.5 V into 1 kΩ. Input offset voltage remains within 8 mV over temperature, and THD stays at −64 dBc (1 MHz, RL = 150 Ω). This makes the THS4082IDGN suitable for 24 V industrial I/O modules where dual supplies are impractical.

How does channel-to-channel crosstalk affect dual-channel use in THS4082IDGN?

The THS4082IDGN specifies −75 dB crosstalk at 1 MHz, meaning a 1 V signal on Channel 1 induces ≤180 µV on Channel 2. This level of isolation supports independent dual-channel operation in applications like stereo audio line drivers or dual ADC front-ends without measurable interference. Crosstalk remains below −65 dB up to 100 MHz, preserving signal integrity in time-interleaved sampling architectures using the THS4082IDGN.

Is the THS4082IDGN pin-compatible with other THS408x variants?

Yes - the THS4082IDGN shares identical pinout and footprint with all THS4082x variants in the DGN package (e.g., THS4082CDGN, THS4082ID), including 1OUT, 1IN−, 1IN+, VCC−, VCC+, 2OUT, 2IN−, and 2IN+. The I-suffix denotes −40°C to +85°C qualification, while C-suffix is 0°C to 70°C. No PCB redesign is needed when upgrading from THS4082CDGN to THS4082IDGN; only temperature screening and qualification testing differ in the THS4082IDGN.