Texas Instruments THS4131IDGNG4

Overview

THS4131IDGNG4 from Texas Instruments is a fully differential input/output amplifier in the THS413x family, fabricated on a high-voltage complementary bipolar process. It delivers 170 MHz small-signal bandwidth (±15 V), 51 V/µs slew rate, –102 dBc THD at 2 VPP/250 kHz, and 1.25 nV/√Hz input voltage noise - enabling high-fidelity differential signal conditioning in ultrasound front-ends and precision ADC driver stages.

For engineers reviewing the THS4131IDGNG4 datasheet, THS4131IDGNG4 pinout, THS4131IDGNG4 application, or THS4131IDGNG4 equivalent, key selection criteria include its ±15 V supply capability, 95 dB CMRR at 800 kHz, absence of power-down functionality (vs. THS4130), HVSSOP-8 PowerPAD™ thermal performance, and differential gain stability across 5 V to 30 V single-supply operation.

Technical Context

The THS4131IDGNG4 implements a true fully differential signal path with matched internal output buffers and a dedicated VOCM input for precise common-mode level control. Its architecture supports both single-ended-to-differential conversion and differential-in/differential-out configurations without external phase-matching components.

Unlike the THS4130, the THS4131 lacks a power-down pin (PD = NC), eliminating shutdown sequencing complexity but requiring continuous bias current management. The HVSSOP-8 package integrates an electrically isolated thermal pad optimized for PCB copper plane attachment, delivering R_θJB = 30.0 °C/W for sustained high-output swing operation.

Key Specifications

Pinout & Package

HVSSOP-8 PowerPAD™ package (DGN) with exposed thermal pad electrically isolated from die; requires solder connection to large PCB copper pour for R_θJB = 30.0 °C/W thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fully differential amplifier applications.

Compared with THS4131IDGNG4, THS4131IDGNR offers identical performance in optimized packaging for production, while THS4561IRGET trades pin compatibility for enhanced noise and bandwidth - requiring layout changes and power budget reassessment.

Availability

THS4131IDGNG4 is available at Aetrix Electronics and suitable for medical ultrasound systems, high-speed data acquisition, and industrial instrumentation requiring stable component supply with guaranteed long-term sourcing.

Supply support for THS4131IDGNG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed amplifier design and manufacturing.

The THS413x product line was engineered specifically for high-fidelity differential signal conditioning in medical imaging, test equipment, and communications infrastructure - emphasizing bandwidth, noise, and common-mode rejection.

FAQ

What is the function of the NC pin on the THS4131IDGNG4?

The NC (No Connect) pin on the THS4131IDGNG4 is Pin 7, explicitly left unconnected internally per Texas Instruments' design. It must remain floating on the PCB - no routing, pull-up, or grounding is permitted. This distinguishes the THS4131IDGNG4 from the THS4130IDGNG4, which uses Pin 7 as an active-low power-down input. Using Pin 7 as a control signal would violate the device's operational specification.

Does the THS4131IDGNG4 support single-supply operation?

Yes, the THS4131IDGNG4 supports single-supply operation from 5 V to 30 V. When operated on a single supply, the VOCM pin sets the output common-mode voltage - typically tied to mid-rail (e.g., 2.5 V for 5 V supply) via a low-impedance source or bypassed with 0.1 µF. Input common-mode range extends from –3.77 V to 4.3 V (at 5 V supply), allowing direct interfacing with ground-referenced sensors when VOCM is appropriately biased.

How does the THS4131IDGNG4 differ from the THS4130IDGNG4?

The THS4131IDGNG4 omits the power-down (PD) functionality present in the THS4130IDGNG4: Pin 7 is NC instead of PD, and quiescent current remains fixed at ~13 mA (±15 V). This simplifies biasing in always-on systems like ultrasound receivers but removes dynamic power gating. Both share identical AC performance (170 MHz BW, –102 dBc THD), pinout, and HVSSOP-8 package - making them footprint-compatible with software/hardware design changes limited to PD pin handling.

What thermal considerations apply to the THS4131IDGNG4 HVSSOP-8 package?

The THS4131IDGNG4 in HVSSOP-8 (DGN) features an electrically isolated thermal pad requiring solder connection to a large PCB copper plane. With proper thermal land design, it achieves R_θJB = 30.0 °C/W - critical for sustaining 65–85 mA output drive at ±15 V without junction temperature exceedance. Failure to connect the thermal pad risks exceeding 125°C junction limit under load, triggering permanent reliability degradation per TI SLMA002/SLMA004 guidelines.

Can the THS4131IDGNG4 drive heavy capacitive loads directly?

No - the THS4131IDGNG4 must not drive capacitive loads >10 pF directly due to reduced phase margin causing ringing or oscillation. For such loads (e.g., ADC input capacitance, long traces), a minimum 20 Ω series resistor must be placed at each output (VOUT+, VOUT−) per TI Figure 9-1. This isolates capacitance while maintaining signal integrity; 50 Ω is recommended for 50 Ω transmission line matching in RF-sensitive applications.