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Texas Instruments THS4271DGK
- Part No.:
- THS4271DGK
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
THS4271DGK.pdf
- Description:
- IC OPAMP VFB 1 CIRCUIT 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,144
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Product details
Overview
THS4271DGK from Texas Instruments is a low-noise, high-slew-rate, unity-gain-stable voltage-feedback amplifier in an 8-pin MSOP PowerPAD™ package. It delivers 1.4 GHz small-signal bandwidth, 1000 V/μs slew rate, and –92 dBc THD at 30 MHz under ±5 V supply, serving as a high-fidelity ADC preamplifier or DAC output buffer in wideband signal chains.
For engineers reviewing the THS4271DGK datasheet, THS4271DGK pinout, THS4271DGK application, or THS4271DGK equivalent, this page provides verified electrical specs, thermal derating guidance (max +60°C die temperature to prevent oscillation), package thermal resistance (θJA = 260°C/W), and validated alternatives for RF receiver front-ends, active filtering, and differential-to-single-ended conversion.
Technical Context
The THS4271DGK employs a voltage-feedback architecture optimized for stability at G = 1 with no external compensation required. Its 3 nV/√Hz input voltage noise and 3 pA/√Hz current noise enable high-dynamic-range acquisition in precision analog front-ends.
It operates across dual supplies (±2.5 V to ±5 V) or single supply (5 V to 10 V), with rail-to-rail output swing limited by load (±3.7 V min into 150 Ω at G = +2) and strict junction temperature control mandated below +60°C continuous operation to avoid low-level oscillation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | 1.4 GHz at G = 1, RL = 150 Ω - supports baseband-to-UHF signal conditioning without gain peaking |
| Slew rate | 1000 V/μs at G = –1 - enables clean 2-V step response with 25 ns settling to 0.1% |
| Input voltage noise | 3 nV/√Hz at 1 MHz - preserves SNR in high-gain, low-amplitude sensor interfaces |
| THD @ 30 MHz | –92 dBc at VO = 1 VPP, RL = 150 Ω - meets LTE/WiMAX spectral mask requirements |
| Supply range | ±2.5 V to ±5 V dual or 5 V to 10 V single - compatible with FPGA I/O banks and mixed-signal SoCs |
| Quiescent current | 22–28 mA max - balances speed and power in thermally constrained layouts |
| Max junction temp | +60°C continuous - requires thermal pad soldering and PCB copper pour per SLMA002/SLMA004 |
Pinout & Package
The THS4271DGK uses an 8-pin MSOP PowerPAD™ (DGK) package with exposed thermal pad on underside; thermal pad must be soldered to PCB ground plane for θJA = 260°C/W performance and junction temperature control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 NC | No internal connection | Not bonded; leave unconnected or tie to ground for mechanical stability |
| 2 IN− | Inverting input | Differential input node; 0.4 pF common-mode capacitance affects high-Z source matching |
| 3 IN+ | Non-inverting input | High-impedance (5 MΩ) input; matched layout critical for CMRR > 65 dB |
| 4 VS− | Negative supply rail | Return path for bias current; decouple locally with 0.1 μF + 10 μF capacitors |
| 5 NC | No internal connection | Not bonded; avoid routing signals beneath this pin |
| 6 VS+ | Positive supply rail | Primary power entry; connect thermal pad directly to VS− or ground plane |
| 7 VOUT | Amplifier output | Capable of ±3.7 V swing into 150 Ω; 0.1 Ω output impedance aids driving coaxial loads |
| 8 NC | No internal connection | Not bonded; no electrical function; may be grounded for EMI shielding |
Key Features
| Feature | Design Value |
|---|---|
| Unity-gain stability | No external compensation needed - eliminates risk of instability in G = 1 configurations used in ADC driver loops |
| Low-noise architecture | 3 nV/√Hz input voltage noise + 3 pA/√Hz current noise - maintains ENOB in 14-bit+ data acquisition systems |
| High slew rate | 1000 V/μs - supports full-scale transitions in <25 ns without slewing-induced distortion |
| Wide bandwidth | 1.4 GHz small-signal BW - enables direct IF sampling at L-band frequencies without intermediate gain stages |
| Thermal oscillation guardband | +60°C max die temperature limit - mandates thermal pad soldering and copper area per TI SLMA002 |
Applications
| High Linearity ADC Preamplifier | Wireless Communication Receivers |
|---|---|
Use Scenario: Driving the input of a 14-bit, 105-MSPS pipeline ADC in a software-defined radio front-end. IC Role / Device Role / Timing Role: Single-ended to differential conversion and gain stage with 0.007% differential gain error. Use Value: Preserves SFDR > 85 dBc up to 70 MHz input due to –95 dBc HD3 at 30 MHz and 1.4 GHz bandwidth. | Use Scenario: Baseband I/Q channel amplification in a 5G NR FR1 receiver with 100-MHz instantaneous bandwidth. IC Role / Device Role / Timing Role: Low-distortion gain block after quadrature demodulator, operating at G = 2 with 249-Ω feedback. Use Value: Achieves OIP3 = 35 dBm at 70 MHz, enabling high-order modulation (256-QAM) without adjacent-channel interference. |
| Differential to Single-Ended Conversion | DAC Output Buffer |
Use Scenario: Converting differential LVDS outputs from a high-speed DAC to single-ended 50-Ω terminated signals for test equipment inputs. IC Role / Device Role / Timing Role: Precision gain-of-1 buffer with matched input impedances minimizing common-mode feedthrough. Use Value: Delivers 0.004° differential phase error and 200-MHz 0.1-dB flat bandwidth for video and imaging applications. | Use Scenario: Buffering the output of a 16-bit, 500-MSPS RF DAC in a radar waveform generator. IC Role / Device Role / Timing Role: High-slew-rate output stage delivering 2-VPP signals into 50-Ω loads with minimal settling overshoot. Use Value: 25 ns 0.1% settling time and 1000 V/μs slew rate ensure accurate pulse fidelity for chirp-based radar pulses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS4275DGK | Identical AC/DC specs plus power-down pin (PD); quiescent current drops to ≤1.2 mA in shutdown | Required where dynamic power gating is needed (e.g., battery-powered portable receivers) | Select THS4275DGK only if system-level power sequencing and PD pin control are implemented |
| LMH6629MA/NOPB | Lower noise (1.9 nV/√Hz), lower bandwidth (1.5 GHz), no thermal oscillation limit; θJA = 168°C/W in 8-pin SOIC | Better suited for ultra-low-noise DC-coupled applications where thermal management is less constrained | Choose LMH6629MA/NOPB when noise dominates over thermal design complexity and no +60°C die limit applies |
Compared with THS4275DGK, THS4271DGK offers identical performance without power-down overhead, simplifying layout and control logic; versus LMH6629MA/NOPB, it trades 1.1 nV/√Hz higher noise for guaranteed oscillation-free operation below +60°C die temperature - critical in compact RF modules.
Availability
THS4271DGK is available at Aetrix Electronics and suitable for high-frequency test equipment, broadband communications infrastructure, and precision instrumentation requiring stable component supply, consistent parametric performance across temperature, and long-term manufacturability.
Supply support for THS4271DGK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed amplifier design and manufacturing.
The THS4271DGK belongs to TI's precision high-speed amplifier product line, engineered specifically for wideband, low-distortion signal conditioning in communications, test & measurement, and medical imaging systems.
FAQ
What is the maximum safe junction temperature for continuous operation of the THS4271DGK?
The THS4271DGK must not exceed +60°C junction temperature during continuous operation to prevent low-level oscillation. This is stricter than the +125°C reliability limit and requires proper thermal pad soldering and PCB copper pour per TI technical briefs SLMA002 and SLMA004. The THS4271DGK datasheet specifies this as the "maximum die temperature to prevent oscillation" - a hard operational constraint, not a reliability guideline.
Does the THS4271DGK require external compensation for unity-gain stability?
No, the THS4271DGK is internally compensated for unity-gain stability and operates stably at G = 1 without any external components. Its voltage-feedback architecture and compensation network are designed to maintain ≥45° phase margin across process, voltage, and temperature variations - confirmed in the SLOS397F datasheet Figure 25 (open-loop gain/phase plots).
What is the recommended power supply decoupling for the THS4271DGK?
TI recommends local decoupling at each supply pin: a 0.1-μF ceramic capacitor placed as close as possible to pins 4 (VS−) and 6 (VS+), plus a 10-μF bulk capacitor within 1 inch. The THS4271DGK's high slew rate demands low-inductance paths; avoid shared vias between decoupling caps and use separate traces to the power planes. The application circuit on page 1 explicitly notes "power supply decoupling capacitors not shown" - meaning they are mandatory but omitted for schematic clarity.
Can the THS4271DGK be used with single-supply operation?
Yes, the THS4271DGK supports single-supply operation from 5 V to 10 V. At VS = 5 V, its input common-mode range is 1.3 V to 3.7 V (min), output swing is 1.2 V to 3.8 V (min into 150 Ω at G = +2), and small-signal bandwidth reduces to 1.2 GHz. Designers must bias the IN+ input within the valid common-mode window and verify headroom for the required output swing - unlike dual-supply mode, rail-to-rail input/output is not supported.
How does the THS4271DGK's thermal pad affect PCB layout?
The THS4271DGK's exposed thermal pad (PowerPAD™) must be soldered to a dedicated PCB copper pour tied to VS− or ground; failure to do so raises θJA from 260°C/W to >300°C/W and risks exceeding the +60°C oscillation threshold. TI's SLMA002 specifies minimum 4×4 mm² copper area with ≥4 thermal vias (0.3-mm diameter) to an inner ground plane. This is not optional - it is a functional requirement for stable operation, not just thermal reliability.
THS4271DGK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Amplifier Type:
- Voltage Feedback
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 1000V/µs
- Gain Bandwidth Product:
- 400 MHz
- -3db Bandwidth:
- 1.4 GHz
- Current - Input Bias:
- 6 µA
- Voltage - Input Offset:
- 5 mV
- Current - Supply:
- 22mA
- Current - Output / Channel:
- 160 mA
- Voltage - Supply Span (Min):
- 5 V
- Voltage - Supply Span (Max):
- 15 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
THS4271DGK FAQ
1.How can I place an order for THS4271DGK through Aetrix?
Please submit a Request for Quotation (RFQ) for THS4271DGK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS4271DGK reliable?
The price and inventory of THS4271DGK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4271DGK is usually 5 days.
3.What payment methods are accepted for THS4271DGK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4271DGK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS4271DGK?
THS4271DGK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS4271DGK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS4271DGK?
For technical support, including THS4271DGK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4271DGK requirements.
6.How does Aetrix verify that THS4271DGK is sourced from the original manufacturer or authorized distributors?
All THS4271DGK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4271DGK meets industry standards.
7.What is the process for return or replacement of THS4271DGK?
All THS4271DGK units undergo pre-shipment inspection (PSI). If there is an issue with THS4271DGK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS4271DGK part is unused and in its original packaging.
Return procedure for THS4271DGK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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