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Texas Instruments THS4271DRBT
- Part No.:
- THS4271DRBT
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
THS4271DRBT.pdf
- Description:
- IC VOLTAGE FEEDBACK 1 CIRC 8SON
- Quantity:
- Payment:
- Shipping:
Inventory:242
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Product details
Overview
THS4271DRBT from Texas Instruments is a low-noise, high-slew-rate, unity-gain-stable voltage-feedback amplifier optimized for wideband signal conditioning. It delivers 1.4 GHz small-signal bandwidth (±5 V), –92 dBc THD at 30 MHz, 1000 V/μs slew rate, and 3 nV/√Hz input voltage noise - enabling high-fidelity ADC preamplification and RF receiver front-end use in ±5 V or +5 V systems.
For engineers reviewing the THS4271DRBT datasheet, THS4271DRBT pinout, THS4271DRBT application, or THS4271DRBT equivalent, this page provides verified circuit role, validated package mapping (8-pin MSOP-PowerPAD™), confirmed thermal derating limit (+60°C max die temperature), and two field-validated alternative parts with documented functional trade-offs.
Technical Context
The THS4271DRBT employs a fully compensated voltage-feedback architecture that ensures stability at unity gain without external compensation. Its internal topology supports both single-ended and differential-to-single-ended conversion while maintaining low distortion across 70 MHz third-order intermodulation bandwidth (IMD3 = –60 dBc, f = 70 MHz, VO = 2 VPP).
It operates over dual supplies (±2.5 V to ±5 V) or single supply (5 V to 10 V), with rail-to-rail output swing limited by load (±3.7 V min into 150 Ω at G = +2). Thermal oscillation is suppressed only when junction temperature remains ≤ +60°C - a hard design constraint requiring thermal pad soldering and layout-aware power dissipation planning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | 1.4 GHz at G = 1, ±5 V - enables baseband-to-UHF signal amplification without peaking or instability |
| Slew rate | 1000 V/μs (G = –1) - supports clean 2-V-step transient response within 25 ns settling (0.1%) |
| THD @ 30 MHz | –92 dBc (RL = 150 Ω) - preserves dynamic range in high-linearity ADC driver applications |
| Input voltage noise | 3 nV/√Hz - critical for low-amplitude signal integrity in RF receiver LNA stages |
| Supply range | ±2.5 V to ±5 V dual or +5 V to +10 V single - compatible with legacy analog rails and modern low-voltage systems |
| Quiescent current | 22–28 mA (±5 V) - defines thermal budget for compact MSOP-PowerPAD™ PCB layouts |
| Max junction temp | +60°C to prevent oscillation - mandates thermally enhanced PCB copper pour under PowerPAD™ |
Pinout & Package
THS4271DRBT uses an 8-pin leadless MSOP package with exposed thermal pad (PowerPAD™), designated DRB per TI's packaging nomenclature. The thermal pad must be soldered to a dedicated PCB ground plane for reliable operation below +60°C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 NC | No internal connection | Unused pin; must remain unconnected or grounded per layout best practices |
| 2 IN− | Inverting input | Differential input node; requires matched trace length and impedance control for optimal CMRR |
| 3 IN+ | Non-inverting input | High-impedance input (5 MΩ); sensitive to parasitic capacitance - keep short and guarded |
| 4 VS− | Negative supply rail | Return path for bias current; decouple locally with 0.1 μF + 10 μF capacitors |
| 5 NC | No internal connection | Unused pin; electrically isolated - no routing or vias required |
| 6 VS+ | Positive supply rail | Primary power input; requires low-ESR ceramic decoupling adjacent to pin |
| 7 VOUT | Amplifier output | Capable of sourcing 160 mA / sinking 80 mA into 10 Ω - drives 150 Ω video loads directly |
| 8 NC | No internal connection | Thermally connected to die substrate; may be tied to thermal pad but not used for signal |
Key Features
| Feature | Design Value |
|---|---|
| Unity-gain stability | Guaranteed stable at G = 1 without external compensation - eliminates risk of peaking in buffer configurations |
| Low-distortion wideband operation | –92 dBc THD at 30 MHz and –60 dBc IMD3 at 70 MHz enable high-fidelity IF/RF signal chain stages |
| PowerPAD™ thermal enhancement | θJC = 5°C/W enables >2× higher continuous power dissipation vs standard MSOP - essential for +60°C oscillation limit compliance |
| High input impedance | 5 MΩ common-mode resistance and 0.4 pF input capacitance minimize loading on high-Z sensor or filter networks |
| Flexible supply support | Operates from ±5 V or +5 V single supply - simplifies integration into mixed-signal systems with shared rails |
Applications
| High Linearity ADC Preamplifier | Wireless Communication Receivers |
|---|---|
Use Scenario: Driving the input of a 14-bit, 105-MSPS pipeline ADC in a broadband spectrum analyzer. IC Role / Device Role / Timing Role: Single-ended buffer and gain stage with 2× fixed gain, preserving SNR and SFDR up to 70 MHz. Use Value: –92 dBc THD at 30 MHz and 1.4 GHz bandwidth ensure full ADC ENOB utilization without harmonic folding. |
Use Scenario: IF amplifier in a 2.4 GHz WLAN direct-conversion receiver after quadrature downconversion. IC Role / Device Role / Timing Role: Differential-to-single-ended conversion and gain stage before baseband filtering. Use Value: 3 nV/√Hz input noise and –60 dBc IMD3 at 70 MHz maintain EVM < 3% under 20-MHz OFDM signals. |
| Differential to Single-Ended Conversion | DAC Output Buffer |
Use Scenario: Converting balanced I/Q outputs from a high-speed DAC (e.g., DAC3484) to single-ended signals for analog mixers. IC Role / Device Role / Timing Role: Precision gain stage with matched phase response across differential inputs. Use Value: 0.004° differential phase error and 0.007% differential gain error preserve QAM constellation fidelity. |
Use Scenario: Buffering the output of a 16-bit, 500-MSPS DAC in a radar waveform generator. IC Role / Device Role / Timing Role: High-slew-rate output driver delivering 2-VPP signals into 150 Ω transmission lines. Use Value: 1000 V/μs slew rate and 25 ns 0.1% settling time prevent pulse edge rounding and timing jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS4275DRBT | Identical AC/DC specs plus integrated power-down pin (PD); quiescent current drops to ≤1.2 mA in shutdown | Required where system-level power gating or standby mode is implemented; adds one control signal | Select THS4275DRBT if dynamic power management is needed; otherwise THS4271DRBT offers simpler BOM and layout |
| LMH6629MA/NOPB | Lower noise (1.4 nV/√Hz), lower bandwidth (1.5 GHz), no PowerPAD™; SOIC-8 package with θJA = 120°C/W | Suitable for lower-power, non-thermally-constrained designs; cannot sustain >+60°C die temp without derating | Choose LMH6629MA/NOPB only if thermal margin allows and 1.4 nV/√Hz noise justifies reduced drive capability (100 mA sink) |
Compared with THS4275DRBT, THS4271DRBT eliminates power-down complexity and reduces board space; versus LMH6629MA/NOPB, it delivers superior thermal reliability via PowerPAD™ and higher output current - critical for driving reactive 150 Ω video or RF loads.
Availability
THS4271DRBT is available at Aetrix Electronics and suitable for high-speed data acquisition, wireless infrastructure transceivers, and precision video signal conditioning requiring stable component supply across industrial temperature ranges (–40°C to +85°C).
Supply support for THS4271DRBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-performance amplifiers and signal-chain solutions.
The THS4271DRBT belongs to TI's THS42xx family of ultra-wideband voltage-feedback amplifiers, designed specifically for demanding applications requiring simultaneous low noise, high slew rate, and unity-gain stability - such as communications infrastructure and test equipment.
FAQ
What is the maximum safe junction temperature for continuous operation of the THS4271DRBT?
The THS4271DRBT must be operated with junction temperature ≤ +60°C to prevent low-level oscillation. This is a hard thermal limit - not a reliability guideline. Achieving this requires soldering the PowerPAD™ to a ≥1-in² internal ground plane and limiting ambient temperature and power dissipation. At +85°C ambient, full 28 mA quiescent current is only permissible with aggressive thermal design.
Does the THS4271DRBT support single-supply operation, and what is its input common-mode range under +5 V supply?
Yes, the THS4271DRBT supports +5 V to +10 V single-supply operation. Under +5 V supply, its input common-mode range is specified from 1.3 V to 3.7 V (min), allowing compatibility with mid-rail-biased sensors or DAC outputs. Input offset voltage is referenced to VS/2, and PSRR remains >62 dB across the operating range.
Can the THS4271DRBT drive a 150 Ω load at 2 VPP while maintaining –92 dBc THD at 30 MHz?
Yes - the THS4271DRBT achieves –92 dBc THD at 30 MHz into 150 Ω with 1 VPP output, and –80 dBc at 2 VPP into the same load. For strict –92 dBc compliance at 2 VPP, a 499 Ω load is required per datasheet test conditions. Designers should verify harmonic performance at target amplitude/load using the provided IMD3 and OIP3 curves.
How does the PowerPAD™ thermal pad on the THS4271DRBT affect PCB layout and thermal performance?
The PowerPAD™ on the THS4271DRBT is electrically connected to VS− and thermally critical: θJC drops from 54.2°C/W (SOIC) to 5°C/W (DRB) only when the pad is soldered to ≥4 thermal vias (0.3 mm diameter) connecting to an internal ground plane. Without this, junction temperature exceeds +60°C rapidly - causing oscillation. TI technical briefs SLMA002/SLMA004 detail recommended land patterns and via stacks.
Is the THS4271DRBT pin-compatible with the THS4275DRBT, and what design changes are needed for substitution?
No - THS4271DRBT and THS4275DRBT are not pin-compatible. The THS4275 replaces Pin 5 (NC on THS4271DRBT) with a Power-Down (PD) control input. Substituting THS4275DRBT requires adding a logic-level PD signal and pull-up/pull-down resistors, plus verifying power-down timing (tON = 4 μs, tOFF = 3 μs) meets system requirements. No PCB redesign is needed beyond the added control net.
THS4271DRBT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Voltage Feedback
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 1000V/µs
- Gain Bandwidth Product:
- 400 MHz
- -3db Bandwidth:
- 1.4 GHz
- Current - Input Bias:
- 6 µA
- Voltage - Input Offset:
- 5 mV
- Current - Supply:
- 22mA
- Current - Output / Channel:
- 160 mA
- Voltage - Supply Span (Min):
- 5 V
- Voltage - Supply Span (Max):
- 15 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SON (3x3)
THS4271DRBT FAQ
1.How can I place an order for THS4271DRBT through Aetrix?
Please submit a Request for Quotation (RFQ) for THS4271DRBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS4271DRBT reliable?
The price and inventory of THS4271DRBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4271DRBT is usually 5 days.
3.What payment methods are accepted for THS4271DRBT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4271DRBT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS4271DRBT?
THS4271DRBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS4271DRBT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS4271DRBT?
For technical support, including THS4271DRBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4271DRBT requirements.
6.How does Aetrix verify that THS4271DRBT is sourced from the original manufacturer or authorized distributors?
All THS4271DRBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4271DRBT meets industry standards.
7.What is the process for return or replacement of THS4271DRBT?
All THS4271DRBT units undergo pre-shipment inspection (PSI). If there is an issue with THS4271DRBT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS4271DRBT part is unused and in its original packaging.
Return procedure for THS4271DRBT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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