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Texas Instruments THS4271MDGNREP
- Part No.:
- THS4271MDGNREP
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
THS4271MDGNREP.pdf
- Description:
- IC OPAMP VFB 1 CIRCUIT 8HVSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,853
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Product details
Overview
THS4271MDGNREP from Texas Instruments is a low-noise, high-slew-rate, unity-gain-stable voltage-feedback amplifier in an 8-pin MSOP PowerPAD™ package. It delivers 1.4 GHz small-signal bandwidth, 1000 V/µs slew rate (±5 V), –92 dBc harmonic distortion at 30 MHz, 3 nV/√Hz input voltage noise, and operates from ±2.5 V to ±5 V dual supplies or 5–10 V single supply - optimized for high-linearity ADC preamplification in defense-grade signal chains.
For engineers reviewing the THS4271MDGNREP datasheet, THS4271MDGNREP pinout, THS4271MDGNREP application, or THS4271MDGNREP equivalent, this page provides verified electrical specifications, thermal derating constraints (max +60°C junction to prevent oscillation), DGN-8 package layout, and validated alternatives for high-frequency analog front-end design where stability, noise, and distortion performance are critical.
Technical Context
The THS4271MDGNREP uses a voltage-feedback architecture with internal compensation enabling stable operation at unity gain - unlike decompensated amplifiers requiring external feedback tuning. Its wide 1.4 GHz bandwidth and 1000 V/µs slew rate support fast transient response in high-speed data acquisition systems without peaking or ringing under capacitive loads up to 100 pF.
Designed for extended product life cycle and military temperature range (–55°C to +125°C), it incorporates PowerPAD™ thermal enhancement requiring PCB thermal plane connection. Junction temperature must be limited to +60°C continuous to avoid low-level oscillation - a hard design constraint confirmed in TI's Application Information section.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | 1.4 GHz at G = 1 (±5 V) - enables baseband-to-UHF signal conditioning without gain-dependent bandwidth collapse. |
| Slew rate | 1000 V/µs (G = –1, ±5 V) - supports full-scale step response of >2 V within 25 ns to 0.1%, critical for ADC driver settling. |
| Input voltage noise | 3 nV/√Hz at 1 MHz - preserves SNR in low-amplitude sensor or RF IF chain amplification stages. |
| Harmonic distortion | –92 dBc HD3 at 30 MHz, 1 VPP (RL = 150 Ω) - meets LTE/WiMAX receiver linearity requirements for adjacent-channel rejection. |
| Supply range | ±2.5 V to ±5 V dual or 5–10 V single - allows direct interfacing with 3.3 V/5 V logic and mixed-supply FPGAs/ADCs. |
| Max junction temp (oscillation limit) | +60°C continuous - mandates thermal design with PowerPAD™ soldered to copper plane; exceeding causes instability, not just reliability loss. |
| Quiescent current | 22–34 mA (±5 V) - balances speed and power in battery-constrained portable test equipment. |
Pinout & Package
THS4271MDGNREP is housed in an 8-pin MSOP PowerPAD™ (DGN) package with exposed thermal pad on underside. The PowerPAD™ must be soldered to a PCB thermal plane for safe operation; failure risks exceeding +60°C junction temperature and oscillation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No internal connection | Unused pin; must remain unconnected or grounded per layout best practice to minimize parasitic coupling. |
| 2 (IN−) | Inverting input | Differential input node; high-impedance (5 MΩ), low-capacitance (0.4 pF CM) for minimal loading of source. |
| 3 (IN+) | Non-inverting input | High-impedance input with 0.8 pF differential capacitance; matched to Pin 2 for balanced layout routing. |
| 4 (VS−) | Negative supply rail | Connect to ground (single supply) or negative rail; decoupling capacitor required within 5 mm. |
| 5 (NC) | No internal connection | Unused pin; no internal bond wire; leave floating or tie to VS− for symmetry. |
| 6 (VS+) | Positive supply rail | Accepts +5 V (single) or +5 V (dual); requires local 0.1 µF ceramic + 4.7 µF tantalum decoupling. |
| 7 (VOUT) | Amplifier output | Capable of ±4 V swing into 499 Ω; drives 150 Ω video loads or ADC inputs with <0.01° differential phase error. |
| 8 (NC) | No internal connection | Thermal pad contact point; electrically isolated but thermally tied to die - must be soldered to thermal plane. |
Key Features
| Feature | Design Value |
|---|---|
| Unity-gain stability | Guaranteed stable at G = 1 without external compensation - eliminates risk of oscillation in buffer or gain-of-one configurations. |
| Low-noise architecture | 3 nV/√Hz input voltage noise + 3 pA/√Hz current noise - enables high-resolution measurement of µV-level signals without SNR degradation. |
| High slew rate | 1000 V/µs (±5 V) - ensures faithful reproduction of fast-rising edges in pulse-based radar or time-of-flight systems. |
| Wideband distortion performance | –92 dBc THD at 30 MHz - maintains EVM <1% in 4G/5G IF amplifiers driving 14-bit+ ADCs at Nyquist rates. |
| PowerPAD™ thermal interface | θJA = 58.4°C/W - reduces junction-to-ambient rise by >30°C vs standard MSOP, enabling sustained high-output drive in compact layouts. |
Applications
| High-Linearity ADC Preamplifier | Wireless Communication Receiver |
|---|---|
|
Use Scenario: Driving the input of a 14-bit, 105 MSPS ADC in a software-defined radio front end with 70 MHz IF signal. IC Role / Device Role / Timing Role: Single-ended-to-differential conversion and gain stage with <25 ns 0.1% settling to meet ADC aperture jitter and sampling accuracy requirements. Use Value: –92 dBc harmonic distortion at 30 MHz preserves SFDR >85 dBFS, enabling clean digitization of multi-carrier LTE signals without post-processing correction. |
Use Scenario: Low-noise amplification of 2.4 GHz Wi-Fi IF output (40–80 MHz band) before quadrature demodulation. IC Role / Device Role / Timing Role: Baseband filter driver with 1.4 GHz bandwidth supporting wide instantaneous bandwidth for OFDM symbol capture. Use Value: 3 nV/√Hz input noise contributes <0.5 dB NF increase in cascade, maintaining overall receiver sensitivity below –95 dBm. |
| Differential to Single-Ended Conversion | DAC Output Buffer |
|
Use Scenario: Converting differential I/Q outputs from a wideband DAC (e.g., DAC3484) to single-ended signals for RF mixer LO injection. IC Role / Device Role / Timing Role: Precision gain stage with matched IN+/IN− inputs and <0.004° differential phase error to preserve I/Q orthogonality. Use Value: 0.007% differential gain error prevents amplitude imbalance-induced sideband suppression degradation beyond –50 dBc. |
Use Scenario: Buffering high-speed DAC outputs (e.g., AD9122) feeding a 50 Ω transmission line to an RF modulator. IC Role / Device Role / Timing Role: High-current output driver capable of sourcing 160 mA and sinking 80 mA into 10 Ω loads. Use Value: ±4 V output swing into 499 Ω ensures full-scale DAC codes translate to >3.5 VPP at modulator input, maximizing dynamic range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed voltage-feedback amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS4281DRBT | Higher 1.8 GHz bandwidth but higher 4.5 nV/√Hz noise; no +60°C oscillation limit - rated for full military temp range without derating. | Better suited for >100 MHz IF amplification where bandwidth dominates noise; not drop-in due to different pinout (SON-8 vs DGN-8). | Select when >1.4 GHz bandwidth is mandatory and thermal management is less constrained; verify layout compatibility. |
| LMH6629MA/NOPB | Lower 350 MHz bandwidth but lower 1.9 nV/√Hz noise; no PowerPAD™ - uses SOIC-8; max junction temp unrestricted for oscillation. | Ideal for precision DC-coupled instrumentation where ultra-low noise outweighs speed; lacks THS4271MDGNREP's RF linearity. | Choose for sub-100 MHz applications prioritizing noise floor over slew rate; no thermal pad rework needed. |
Compared with THS4271MDGNREP, THS4281DRBT trades noise for bandwidth and removes the +60°C oscillation constraint but requires PCB redesign, while LMH6629MA/NOPB offers superior noise at lower frequency cost and simpler thermal handling - making THS4271MDGNREP optimal for defense/aerospace IF amplifiers needing balanced speed, noise, and ruggedized packaging.
Availability
THS4271MDGNREP is available at Aetrix Electronics and suitable for high-reliability defense electronics, aerospace telemetry receivers, and medical imaging signal chains requiring stable component supply across extended product lifecycles and military temperature ranges.
Supply support for THS4271MDGNREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies with decades of high-reliability component development for mission-critical systems.
The THS4271MDGNREP belongs to TI's high-speed amplifier product line, engineered specifically for defense, aerospace, and medical applications demanding extended temperature operation, controlled baseline manufacturing, and long-term product lifecycle support.
FAQ
What is the maximum junction temperature for stable operation of the THS4271MDGNREP?
The THS4271MDGNREP must be operated with junction temperature ≤ +60°C to prevent low-level oscillation - a hard functional limit, not a reliability threshold. This requires thermal design using the PowerPAD™ soldered to a ≥1 in² copper plane. At +125°C ambient, power dissipation must be limited to ~250 mW to stay within this bound, per θJA = 58.4°C/W.
Does the THS4271MDGNREP support single-supply operation?
Yes, the THS4271MDGNREP operates from a single 5–10 V supply. Input common-mode range extends from VS− + 1.4 V to VS+ − 1.4 V, allowing rail-to-rail input capability when biased at mid-supply. Output swing reaches 1.2–3.8 V (min) with 5 V supply, sufficient for driving 12-bit ADCs directly without level-shifting circuitry.
Why does the THS4271MDGNREP have three NC pins in its DGN-8 package?
The THS4271MDGNREP's DGN-8 package has NC pins at positions 1, 5, and 8 to accommodate die size, bonding constraints, and thermal pad isolation. Pin 8 is the PowerPAD™ thermal pad - electrically isolated but thermally critical. Pins 1 and 5 are unused bond pads; they may be left floating or tied to VS− for symmetry, but must never be connected to active signals to avoid parasitic coupling.
How does the THS4271MDGNREP compare to standard commercial op-amps in RF applications?
Unlike general-purpose op-amps, the THS4271MDGNREP delivers 1.4 GHz bandwidth, –92 dBc distortion at 30 MHz, and 1000 V/µs slew rate - performance aligned with RF amplifier specifications. Its unity-gain stability, low 3 nV/√Hz noise, and PowerPAD™ thermal design make it suitable for IF amplification, DAC buffering, and ADC driving where commercial op-amps fail due to bandwidth collapse or instability.
Is the THS4271MDGNREP pin-compatible with other THS42xx family members?
No - the THS4271MDGNREP is not pin-compatible with THS4211, THS4221, or THS4281. Each uses distinct packages (SOIC, MSOP, SON) and pinouts. For example, THS4281DRBT uses SON-8 with different terminal assignments. Migration requires PCB layout revision; only functional equivalency (not mechanical) can be claimed.
THS4271MDGNREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Voltage Feedback
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 1000V/µs
- Gain Bandwidth Product:
- 400 MHz
- -3db Bandwidth:
- 1.4 GHz
- Current - Input Bias:
- 6 µA
- Voltage - Input Offset:
- 5 mV
- Current - Supply:
- 22mA
- Current - Output / Channel:
- 160 mA
- Voltage - Supply Span (Min):
- 5 V
- Voltage - Supply Span (Max):
- 15 V
- Operating Temperature:
- -55°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
THS4271MDGNREP FAQ
1.How can I place an order for THS4271MDGNREP through Aetrix?
Please submit a Request for Quotation (RFQ) for THS4271MDGNREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS4271MDGNREP reliable?
The price and inventory of THS4271MDGNREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4271MDGNREP is usually 5 days.
3.What payment methods are accepted for THS4271MDGNREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4271MDGNREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS4271MDGNREP?
THS4271MDGNREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS4271MDGNREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS4271MDGNREP?
For technical support, including THS4271MDGNREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4271MDGNREP requirements.
6.How does Aetrix verify that THS4271MDGNREP is sourced from the original manufacturer or authorized distributors?
All THS4271MDGNREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4271MDGNREP meets industry standards.
7.What is the process for return or replacement of THS4271MDGNREP?
All THS4271MDGNREP units undergo pre-shipment inspection (PSI). If there is an issue with THS4271MDGNREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS4271MDGNREP part is unused and in its original packaging.
Return procedure for THS4271MDGNREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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