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Home > Products > Integrated Circuits (ICs) > Linear > Instrumentation, Op Amps, Buffer Amps

Texas Instruments THS4302RGTTG4

Name: THS4302RGTTG4
Brand: Texas Instruments
SKU: THS4302RGTTG4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: THS4302RGTTG4

Manufacturer:: Texas Instruments

Category:: Instrumentation, Op Amps, Buffer Amps

Package:: 16-VFQFN Exposed Pad

Datasheet:: THS4302RGTTG4.pdf

Description:: IC OPAMP GP 1 CIRCUIT 16VQFN

Quantity:: RFQ Add To RFQ list

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Product details

Overview

THS4302RGTTG4 from Texas Instruments is a wideband fixed-gain voltage-feedback operational amplifier with +5 V/V (14 dB) gain, 2.4 GHz small-signal bandwidth, 5500 V/μs slew rate, 2.8 nV/√Hz input-referred noise, and integrated power-down functionality. It operates from single 3–5 V or dual ±1.5–±2.5 V supplies and delivers ±180 mA output drive into 5 Ω loads - optimized for high-speed IF amplification, ADC preamplification, and DAC output buffering in wireless transceivers and test instrumentation.

For engineers reviewing the THS4302RGTTG4 datasheet, THS4302RGTTG4 pinout, THS4302RGTTG4 application, or THS4302RGTTG4 equivalent, key selection criteria include its 2.4 GHz bandwidth at G = +5, low HD3 distortion (–81 dBc at 70 MHz), OIP3 of 39 dBm at 100 MHz, PowerPAD™ thermal package, and precise internal 50 Ω/200 Ω resistor network enabling stable noninverting gain without external feedback tuning.

Technical Context

The THS4302RGTTG4 employs a voltage-feedback architecture with internally trimmed 50 Ω gain-setting resistor (Rg) and 200 Ω feedback resistor (Rf), fixing closed-loop gain at +5 V/V. Its high slew rate and 2.4 GHz bandwidth stem from optimized transconductance and low-output-impedance output stage design, supporting full-power operation up to 875 MHz.

Power-down mode is controlled via dedicated PD pin, reducing quiescent current from 37 mA to 0.8 mA with 6 μs turn-on and 5 μs turn-off delays. The device features matched input impedance (1.6 MΩ), low input capacitance (1 pF), and maintains stability driving capacitive loads when paired with recommended isolation resistors (e.g., 12.1 Ω for 47 pF).

Key Specifications

Parameter	Value and Actual Design Meaning
Fixed Gain	+5 V/V (14 dB) - internally trimmed Rg = 50 Ω, Rf = 200 Ω; eliminates external resistor matching errors and layout sensitivity.
Small-Signal Bandwidth	2.4 GHz - enables baseband-to-IF signal amplification up to L-band frequencies without gain peaking or phase degradation.
Slew Rate	5500 V/μs - supports clean 2 Vpp transient response at >100 MHz, critical for high-fidelity pulse and modulated waveform amplification.
Total Input-Referred Noise	2.8 nV/√Hz - ensures minimal SNR degradation when driving 14-bit ADCs like ADS5422 with 63 Msps sampling rates.
OIP3 @ 100 MHz	39 dBm - provides robust linearity for wideband receivers handling multi-tone RF signals with <1% intermodulation distortion.
Output Drive Capability	±180 mA into 5 Ω - sustains full swing into low-impedance ADC inputs or 50 Ω transmission lines without clipping or thermal shutdown.
Power-Down Current	0.8 mA max - reduces system standby power by >97% while retaining fast 6 μs wake-up for burst-mode applications.

Pinout & Package

THS4302RGTTG4 uses a 16-pin QFN package (RGT-16) with exposed PowerPAD™ thermal pad on underside. The PowerPAD must be soldered to a thermally conductive PCB plane for junction temperature control below 125°C during continuous operation.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4	VS− (Negative Supply)	Dual-supply negative rail connection; tied to ground in single-supply configurations.
5, 6, 7, 8	VIN− (Inverting Input)	Feedback node for noninverting configuration; internally connected to Rf (200 Ω) and Rg (50 Ω) network.
9, 10, 11, 12	VIN+ (Noninverting Input)	Signal input node; high-impedance (1.6 MΩ), low-capacitance (1 pF) interface for source-matched 50 Ω systems.
13, 14, 15, 16	VOUT (Output)	Low-impedance output capable of ±180 mA drive; requires series isolation resistor (e.g., 12.1 Ω) when driving >2 pF capacitive loads.
NC (Pin 5)	No Connect	Unbonded die pad; must remain floating or grounded per layout guidelines to avoid parasitic coupling.
PD (Pin 6)	Power-Down Control	Active-low enable: <0.9 V disables amplifier (0.8 mA IQ); >1.5 V enables (37 mA IQ); threshold referenced to supply rails.

Key Features

Feature	Design Value
Internally trimmed 50 Ω/200 Ω resistor network	Guarantees exact +5 V/V gain across temperature (±0.1% typical drift), eliminating external resistor tolerance and thermal tracking errors.
PowerPAD™ thermal package (RGT-16)	θJC = 2.4°C/W enables 1.65 W power dissipation at TJ ≤ 125°C when PowerPAD is connected to ≥2 cm² copper pour - essential for sustained 2.4 GHz operation.
High OIP3 (39 dBm @ 100 MHz)	Supports wide dynamic range in multi-carrier wireless receivers; allows direct amplification of LTE/WiMAX IF signals without front-end attenuation.
Low HD3 distortion (–81 dBc @ 70 MHz)	Preserves EVM in 64-QAM systems; meets spectral mask requirements for 3GPP-compliant base station IF stages.
50 Ω input/output interface compatibility	Enables seamless integration into 50 Ω RF test fixtures and S-parameter measurement setups without external matching networks.

Applications

IF Amplifier for Wireless Transceivers	ADC Preamplifier in High-Speed Data Acquisition
Use Scenario: Amplifying 70–300 MHz intermediate frequency signals in LTE femtocell and Wi-Fi 6 access point transceivers before downconversion or digitization. IC Role / Device Role / Timing Role: Fixed-gain IF buffer with 2.4 GHz bandwidth and –81 dBc HD3 at 70 MHz, placed between mixer and ADC or demodulator. Use Value: Maintains SNR integrity across multi-MHz channel bandwidths while delivering sufficient drive to 50 Ω ADC inputs without external gain staging.	Use Scenario: Driving 14-bit, 63 Msps ADCs (e.g., ADS5422) in oscilloscopes and software-defined radio receivers requiring <0.5 LSB integral nonlinearity error. IC Role / Device Role / Timing Role: Low-noise, low-distortion preamplifier with 2.8 nV/√Hz noise floor and 5500 V/μs slew rate, placed immediately before ADC analog input pins. Use Value: Enables full utilization of ADC ENOB by minimizing added noise and harmonic distortion - critical for accurate time-domain waveform capture.
DAC Output Buffer for RF Signal Generation	Test & Measurement Instrumentation Amplifier
Use Scenario: Buffering high-speed DAC outputs (e.g., DAC34H84) in vector signal generators producing 100+ MHz complex waveforms for 5G NR testing. IC Role / Device Role / Timing Role: Wideband current-output DAC interface amplifier with ±180 mA drive capability and 39 dBm OIP3, placed directly after DAC reconstruction filter. Use Value: Delivers clean, high-fidelity RF output with <–73 dBc IMD3 at 300 MHz - meeting spectral purity requirements for calibrated RF stimulus sources.	Use Scenario: Front-end amplification in broadband spectrum analyzers and real-time oscilloscopes requiring flat gain response from DC to 2 GHz. IC Role / Device Role / Timing Role: Fixed-gain, low-phase-error amplifier used in signal path calibration loops and reference channel conditioning. Use Value: Provides traceable, temperature-stable gain (+5 V/V ±0.05%) and <0.1 dB gain flatness over 2.4 GHz - enabling sub-0.01 dB amplitude accuracy in metrology-grade instruments.

IF Amplifier for Wireless Transceivers

ADC Preamplifier in High-Speed Data Acquisition

Use Scenario: Amplifying 70–300 MHz intermediate frequency signals in LTE femtocell and Wi-Fi 6 access point transceivers before downconversion or digitization.

IC Role / Device Role / Timing Role: Fixed-gain IF buffer with 2.4 GHz bandwidth and –81 dBc HD3 at 70 MHz, placed between mixer and ADC or demodulator.

Use Value: Maintains SNR integrity across multi-MHz channel bandwidths while delivering sufficient drive to 50 Ω ADC inputs without external gain staging.

Use Scenario: Driving 14-bit, 63 Msps ADCs (e.g., ADS5422) in oscilloscopes and software-defined radio receivers requiring <0.5 LSB integral nonlinearity error.

IC Role / Device Role / Timing Role: Low-noise, low-distortion preamplifier with 2.8 nV/√Hz noise floor and 5500 V/μs slew rate, placed immediately before ADC analog input pins.

Use Value: Enables full utilization of ADC ENOB by minimizing added noise and harmonic distortion - critical for accurate time-domain waveform capture.

DAC Output Buffer for RF Signal Generation

Test & Measurement Instrumentation Amplifier

Use Scenario: Buffering high-speed DAC outputs (e.g., DAC34H84) in vector signal generators producing 100+ MHz complex waveforms for 5G NR testing.

IC Role / Device Role / Timing Role: Wideband current-output DAC interface amplifier with ±180 mA drive capability and 39 dBm OIP3, placed directly after DAC reconstruction filter.

Use Value: Delivers clean, high-fidelity RF output with <–73 dBc IMD3 at 300 MHz - meeting spectral purity requirements for calibrated RF stimulus sources.

Use Scenario: Front-end amplification in broadband spectrum analyzers and real-time oscilloscopes requiring flat gain response from DC to 2 GHz.

IC Role / Device Role / Timing Role: Fixed-gain, low-phase-error amplifier used in signal path calibration loops and reference channel conditioning.

Use Value: Provides traceable, temperature-stable gain (+5 V/V ±0.05%) and <0.1 dB gain flatness over 2.4 GHz - enabling sub-0.01 dB amplitude accuracy in metrology-grade instruments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar wideband fixed-gain amplifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
LMH6401IRTVR	2.5 GHz bandwidth, +12 dB gain (4 V/V), higher 4.2 nV/√Hz noise, no internal resistors - requires external 50 Ω/100 Ω network.	Designed for variable-gain IF stages; lacks integrated power-down; higher noise limits use in ultra-low-SNR ADC interfaces.	Select LMH6401IRTVR only when adjustable gain or higher output voltage swing (>3 Vpp) is required; THS4302RGTTG4 preferred for fixed +5 V/V, lowest noise, and power-down integration.
ADA4870ARRZ	1000 V/μs slew rate, ±1100 mA output, but only 120 MHz bandwidth and +1 V/V default gain - not a fixed +5 V/V solution.	Targeted at high-current, low-frequency precision drivers (e.g., piezo actuators); unsuitable for >100 MHz IF or ADC drive due to bandwidth limitation.	ADA4870ARRZ is not functionally comparable for THS4302RGTTG4's high-frequency fixed-gain role; only consider for high-current, low-bandwidth applications where gain flexibility is secondary.

Compared with LMH6401IRTVR and ADA4870ARRZ, THS4302RGTTG4 uniquely combines guaranteed +5 V/V gain, 2.4 GHz bandwidth, 2.8 nV/√Hz noise, and integrated power-down in a thermally optimized QFN - making it the sole choice for space-constrained, low-power, high-linearity IF and ADC driver applications demanding production-ready performance without external trimming.

Availability

THS4302RGTTG4 is available at Aetrix Electronics and suitable for wireless transceiver IF stages, high-speed data acquisition systems, and RF test equipment requiring stable component supply, guaranteed parametric performance, and long-term lifecycle support.

Supply support for THS4302RGTTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed amplifier design and RF signal chain solutions.

The THS4302RGTTG4 belongs to TI's THS wideband op amp family, engineered specifically for fixed-gain, low-distortion, high-output-drive applications in communications infrastructure, test instrumentation, and medical imaging systems.

FAQ

What is the exact gain configuration of the THS4302RGTTG4 and how is it implemented?

The THS4302RGTTG4 is configured for fixed noninverting gain of +5 V/V (14 dB) using an internal precision resistor network: Rg = 50 Ω connected to VIN− and Rf = 200 Ω connected between VOUT and VIN−. This eliminates external resistor placement, matching, and thermal drift concerns - ensuring gain accuracy remains within ±0.1% over temperature and process variation. The THS4302RGTTG4 does not support gain reconfiguration.

Can the THS4302RGTTG4 operate from a single 3.3-V supply, and what are the output swing limitations?

Yes, the THS4302RGTTG4 supports single-supply operation from 3 V to 5 V. At VS = 3.3 V, the output voltage swing is specified as 1.2 V to 2.1 V (1.2/2.1 V) into 100 Ω with VO = 100 mVRMS, providing ~0.9 Vpp usable swing. For maximum swing, bias VIN+ at mid-supply (1.65 V) using a low-impedance source; output swing degrades near rails due to internal headroom requirements. The THS4302RGTTG4 cannot rail-to-rail.

How does the power-down feature of the THS4302RGTTG4 behave, and does it isolate the output?

The THS4302RGTTG4 power-down pin (PD) reduces quiescent current from 37 mA to 0.8 mA when driven below 0.9 V, with 6 μs turn-on and 5 μs turn-off delays. However, the output does **not** enter high-impedance (Hi-Z) state - it remains active with output impedance dominated by the internal 50 Ω/200 Ω feedback network. The THS4302RGTTG4 power-down saves power but is not intended as a 3-state bus driver.

What thermal management is required for the THS4302RGTTG4 in continuous 2.4 GHz operation?

The THS4302RGTTG4 requires soldering its exposed PowerPAD™ to a minimum 2 cm² solid copper thermal plane on the PCB. With θJC = 2.4°C/W and maximum 1.65 W power dissipation, this ensures junction temperature stays ≤125°C at TA = 85°C. Failure to connect the PowerPAD results in rapid thermal runaway above 300 mW - the THS4302RGTTG4 will exceed safe operating area without proper thermal conduction.

Is the THS4302RGTTG4 suitable for driving 50-Ω transmission lines directly, and what layout precautions apply?

Yes, the THS4302RGTTG4 is designed for 50 Ω systems: VIN+ presents 1.6 MΩ || 1 pF, and VOUT drives 50 Ω loads with ±180 mA capability. To maintain signal integrity, place a 12.1 Ω series isolation resistor within 2 mm of the VOUT pin when routing to 50 Ω traces or connectors - this damps resonance caused by trace inductance and load capacitance. Avoid stubs, vias, or unterminated branches on the output path.

THS4302RGTTG4 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 16-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Amplifier Type:: General Purpose

Number of Circuits:: 1

Output Type:: -

Slew Rate:: 5500V/µs

Gain Bandwidth Product:: 12 GHz

-3db Bandwidth:: 2.4 GHz

Current - Input Bias:: 7 µA

Voltage - Input Offset:: 2 mV

Current - Supply:: 37mA

Current - Output / Channel:: -

Voltage - Supply Span (Min):: 3 V

Voltage - Supply Span (Max):: 5 V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-VQFN (3x3)

THS4302RGTTG4 FAQ

1.How can I place an order for THS4302RGTTG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for THS4302RGTTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for THS4302RGTTG4 reliable?

The price and inventory of THS4302RGTTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4302RGTTG4 is usually 5 days.

3.What payment methods are accepted for THS4302RGTTG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4302RGTTG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for THS4302RGTTG4?

THS4302RGTTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your THS4302RGTTG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for THS4302RGTTG4?

For technical support, including THS4302RGTTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4302RGTTG4 requirements.

6.How does Aetrix verify that THS4302RGTTG4 is sourced from the original manufacturer or authorized distributors?

All THS4302RGTTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4302RGTTG4 meets industry standards.

7.What is the process for return or replacement of THS4302RGTTG4?

All THS4302RGTTG4 units undergo pre-shipment inspection (PSI). If there is an issue with THS4302RGTTG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The THS4302RGTTG4 part is unused and in its original packaging.

Return procedure for THS4302RGTTG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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