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Texas Instruments THS4303RGTTG4
- Part No.:
- THS4303RGTTG4
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
THS4303RGTTG4.pdf
- Description:
- IC OPAMP GP 1 CIRCUIT 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,011
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Product details
Overview
THS4303RGTTG4 from Texas Instruments is a wideband, fixed-gain voltage-feedback operational amplifier with noninverting +10 V/V (20 dB) gain, 1.8 GHz small-signal bandwidth, 5500 V/µs slew rate, and 2.5 nV/√Hz input-referred noise. It operates from single 3–5 V or dual ±1.5–±2.5 V supplies and delivers ±180 mA output drive into 5 Ω loads - optimized for high-speed IF amplification, ADC preamplification, and wireless transceiver signal chains.
For engineers reviewing the THS4303RGTTG4 datasheet, THS4303RGTTG4 pinout, THS4303RGTTG4 application, or THS4303RGTTG4 equivalent, key selection criteria include its fixed +10 gain architecture, PowerPAD™ thermally enhanced RGT-16 package, power-down functionality (1.4 mA quiescent current), and RF-grade distortion performance (–76 dBc HD3 at 70 MHz, 34 dBm OIP3 at 100 MHz).
Technical Context
The THS4303RGTTG4 implements a voltage-feedback topology with internal fixed 450 Ω Rf and 50 Ω Rg resistors, enabling stable +10 V/V closed-loop gain without external components. Its architecture supports wideband operation up to 1.8 GHz while maintaining low harmonic distortion through optimized input stage biasing and output stage current limiting.
Power-down control is implemented via a dedicated PD pin with 1.1 V threshold; activation reduces quiescent current from 48 mA to 1.4 mA in 42 ns turn-on time. The device incorporates a thermal pad (PowerPAD™) requiring PCB copper plane connection to maintain junction temperature ≤125°C under full load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain | +10 V/V (20 dB) - fixed internal resistor ratio (Rf = 450 Ω, Rg = 50 Ω); eliminates gain-setting component tolerance errors |
| Small-signal bandwidth | 1.8 GHz - enables baseband-to-IF signal processing up to L-band frequencies without external compensation |
| Slew rate | 5500 V/µs - supports clean 2 VPP step response at >100 MHz; critical for fast-settling ADC driver applications |
| Input noise density | 2.5 nV/√Hz - ensures minimal SNR degradation when amplifying low-level RF/IF signals before digitization |
| OIP3 @ 100 MHz | 34 dBm - provides high linearity for wide dynamic range receivers handling multi-tone interferers |
| Output drive | ±180 mA into 5 Ω - drives heavy capacitive loads (e.g., ADC inputs with 10–100 pF) with isolation resistor buffering |
| Supply voltage | 3–5 V single supply or ±1.5–±2.5 V dual supply - compatible with modern low-voltage RF subsystems and portable instrumentation |
Pinout & Package
The THS4303RGTTG4 is housed in a 16-pin QFN package (RGT-16) with exposed thermal pad (PowerPAD™) on the underside, requiring solder connection to a PCB copper pour for thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | No-connect / Thermal pad interface | Pins 1–8 are NC except for thermal pad contact; must be connected to ground plane for heat dissipation |
| 9 (VS−) | Negative supply rail | Accepts 0 V (single-supply) or negative rail (dual-supply); referenced to GND in most RF applications |
| 10 (VS+) | Positive supply rail | Accepts 3–5 V; requires local 0.1 µF + 47 pF decoupling per datasheet layout guidelines |
| 11 (VOUT) | Amplifier output | Capable of ±180 mA drive; requires series isolation resistor (RISO) when driving >2 pF capacitive loads |
| 12 (VIN+) | Noninverting input | High-impedance node (1.6 MΩ||1 pF); matched with 49.9 Ω source termination for 50 Ω systems |
| 13 (NC) | No-connect | Not internally bonded; must remain unconnected per TI design rules |
| 14 (PD) | Power-down control | Active-low enable: <0.9 V disables (1.4 mA IQ), >1.5 V enables (48 mA IQ); no pull-up required |
| 15 (VIN−) | Inverting input | Feedback node tied internally to Rf/Rg network; externally accessible for stability tuning |
| 16 (Rg) | Internal gain resistor tap | Exposed for optional external feedback adjustment; default configuration sets +10 V/V gain |
Key Features
| Feature | Design Value |
|---|---|
| Fixed +10 V/V gain | Eliminates external resistor matching errors and board space; ensures consistent gain across production units |
| 1.8 GHz bandwidth | Supports direct amplification of IF signals up to 900 MHz (–3 dB point), reducing need for cascaded stages |
| Power-down mode | Reduces quiescent current from 48 mA to 1.4 mA in <50 ns, enabling rapid power gating in TDD systems |
| Low distortion at RF | –76 dBc HD3 at 70 MHz and 34 dBm OIP3 at 100 MHz enable high-fidelity signal conditioning in LTE/WiMAX front ends |
| PowerPAD™ thermal package | θJC = 2.4 °C/W enables reliable 2.53 W power dissipation at TA ≤25°C with proper PCB copper area |
Applications
| Wireless IF Amplifier | High-Speed ADC Driver |
|---|---|
Use Scenario: Amplifying 70–300 MHz intermediate frequency signals in LTE base station receivers prior to digitization. IC Role / Device Role / Timing Role: Fixed-gain IF amplifier providing 20 dB gain with minimal group delay variation and phase distortion. Use Value: 1.8 GHz bandwidth preserves signal integrity across multi-MHz channel bandwidths; –70 dBc IMD3 at 300 MHz suppresses adjacent-channel interference. |
Use Scenario: Driving the analog input of a 14-bit, 125 MSPS ADC in test equipment with 2 VPP full-scale range. IC Role / Device Role / Timing Role: High-slew-rate buffer delivering fast-settling, low-noise signals to minimize aperture uncertainty and quantization error. Use Value: 5500 V/µs slew rate achieves <1 ns settling to 0.1% for 2 V steps; 2.5 nV/√Hz noise contributes <0.5 LSB RMS noise at 14-bit resolution. |
| DAC Output Buffer | Medical Ultrasound Beamformer |
Use Scenario: Conditioning high-frequency DAC outputs (e.g., 100–500 MHz) in arbitrary waveform generators for RF stimulus generation. IC Role / Device Role / Timing Role: Wideband output buffer isolating DAC from reactive loads while preserving spectral purity. Use Value: 34 dBm OIP3 prevents harmonic folding into DAC output spectrum; 50 Ω output impedance match minimizes reflections in 50 Ω test fixtures. |
Use Scenario: Amplifying phased-array ultrasound transmit/receive channel signals with 5–15 MHz center frequencies and wide instantaneous bandwidth. IC Role / Device Role / Timing Role: Low-noise, high-linearity gain block in receive beamformer ASIC signal chain. Use Value: 2.5 nV/√Hz input noise maintains system SNR >70 dB; power-down mode enables per-channel gating during non-active scan lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wideband fixed-gain amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LMH6401IRRT | 2.5 GHz bandwidth, +12 dB gain, 6500 V/µs slew rate, but higher 3.5 nV/√Hz noise and no power-down pin | Preferred for >1 GHz IF stages where extra bandwidth justifies higher noise; unsuitable for power-gated systems | Select LMH6401IRRT when bandwidth >2 GHz is required and power-down is not needed |
| ADA4870ARQZ | 1050 V/µs slew rate, ±1000 mA output drive, but only 120 MHz bandwidth and +1 V/V default gain (external feedback required) | Better for high-current, low-frequency pulse amplification (e.g., laser diode drivers); lacks RF linearity specs | Select ADA4870ARQZ when output current >±500 mA is required and bandwidth <200 MHz suffices |
Compared with LMH6401IRRT and ADA4870ARQZ, the THS4303RGTTG4 uniquely balances 1.8 GHz bandwidth, ultra-low 2.5 nV/√Hz noise, integrated +10 gain, and sub-50 ns power-down - making it optimal for battery-sensitive, high-dynamic-range IF and ADC driver roles where precision and speed coexist.
Availability
THS4303RGTTG4 is available at Aetrix Electronics and suitable for wireless transceivers, high-speed data acquisition systems, and medical imaging equipment requiring stable component supply across extended temperature ranges (–40°C to +85°C).
Supply support for THS4303RGTTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 90 years of innovation in high-performance signal chain solutions.
The THS4303RGTTG4 belongs to TI's high-speed operational amplifier product line, engineered specifically for RF/IF signal conditioning, ADC/DAC interfacing, and wideband instrumentation where gain accuracy, noise, and distortion are critical.
FAQ
What is the operating supply voltage range for the THS4303RGTTG4?
The THS4303RGTTG4 operates from a single 3 V to 5 V supply or dual ±1.5 V to ±2.5 V supplies. At 5 V, it delivers full 1.8 GHz bandwidth and ±180 mA output drive; at 3 V, bandwidth reduces to ~1.5 GHz with slightly increased distortion. The device maintains specified performance across –40°C to +85°C ambient temperature.
Does the THS4303RGTTG4 require external gain-setting resistors?
No - the THS4303RGTTG4 integrates precise 450 Ω Rf and 50 Ω Rg resistors to deliver a fixed +10 V/V (20 dB) gain. Pin 16 (Rg) is exposed for optional external feedback modification, but standard operation uses internal resistors only, eliminating component count and matching errors.
How does the power-down feature of the THS4303RGTTG4 function?
The THS4303RGTTG4's PD pin (Pin 14) enables hardware-controlled power-down: driving it below 0.9 V reduces quiescent current from 48 mA to 1.4 mA in 35 ns, while pulling it above 1.5 V restores full operation in 42 ns. No external pull-up is needed - the pin defaults to VS+ when floating, keeping the device active by default.
Can the THS4303RGTTG4 drive capacitive loads directly?
No - parasitic capacitance >2 pF degrades stability and causes peaking. The THS4303RGTTG4 requires a series isolation resistor (RISO) between VOUT (Pin 11) and the load. Recommended values are 10 Ω for 100 pF, 15 Ω for 47 pF, and 25 Ω for 10 pF, placed as close as possible to the output pin per TI layout guidelines.
What thermal considerations apply to the THS4303RGTTG4's RGT-16 package?
The THS4303RGTTG4 uses a PowerPAD™-equipped RGT-16 QFN package requiring solder connection of the exposed thermal pad to a PCB copper pour. Without this, junction temperature exceeds 125°C under load, causing distortion rise and reliability risk. TI specifies θJC = 2.4 °C/W and recommends ≥3 cm² 2-oz copper area for sustained 2.53 W dissipation at 25°C ambient.
THS4303RGTTG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 5500V/µs
- Gain Bandwidth Product:
- 1.8 GHz
- -3db Bandwidth:
- 1.8 GHz
- Current - Input Bias:
- 7 µA
- Voltage - Input Offset:
- 1.5 mV
- Current - Supply:
- 34mA
- Current - Output / Channel:
- -
- Voltage - Supply Span (Min):
- 3 V
- Voltage - Supply Span (Max):
- 5 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-VQFN (3x3)
THS4303RGTTG4 FAQ
1.How can I place an order for THS4303RGTTG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for THS4303RGTTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS4303RGTTG4 reliable?
The price and inventory of THS4303RGTTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4303RGTTG4 is usually 5 days.
3.What payment methods are accepted for THS4303RGTTG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4303RGTTG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS4303RGTTG4?
THS4303RGTTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS4303RGTTG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS4303RGTTG4?
For technical support, including THS4303RGTTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4303RGTTG4 requirements.
6.How does Aetrix verify that THS4303RGTTG4 is sourced from the original manufacturer or authorized distributors?
All THS4303RGTTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4303RGTTG4 meets industry standards.
7.What is the process for return or replacement of THS4303RGTTG4?
All THS4303RGTTG4 units undergo pre-shipment inspection (PSI). If there is an issue with THS4303RGTTG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS4303RGTTG4 part is unused and in its original packaging.
Return procedure for THS4303RGTTG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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