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Texas Instruments THS4502IDGN

Part No.:
THS4502IDGN
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixTHS4502IDGN.pdf
Description:
IC OPAMP DIFF 1 CIRCUIT 8HVSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,667

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Product details

Overview

THS4502IDGN from Texas Instruments is a high-performance, fully differential amplifier with power-down capability, designed for precision signal conditioning in high-speed data acquisition systems. It delivers 370 MHz small-signal bandwidth, 2800 V/µs slew rate, and -95 dBc third-order intermodulation distortion at 30 MHz - enabling clean 14-bit ADC preamplification up to 40 MHz in wireless receiver chains and active filtering applications.

For engineers reviewing the THS4502IDGN datasheet, THS4502IDGN pinout, THS4502IDGN application, or THS4502IDGN equivalent, key selection criteria include its centered input common-mode range (±3.4 V at ±5 V supply), VOCM-controlled output common-mode voltage, thermal oscillation limit at +60°C junction temperature, and MSOP-8 PowerPAD™ package for enhanced thermal dissipation in space-constrained layouts.

Technical Context

The THS4502IDGN employs a fully differential architecture optimized for single-ended-to-differential conversion and high-linearity analog front-ends. Its internal feedback network supports gain configurations from +1 to +10, with 300 MHz gain-bandwidth product and 0.1 dB flatness up to 150 MHz under ±5 V operation.

Power-down functionality is implemented via a dedicated PD pin with defined enable/disable thresholds (≥2.1 V ON / ≤0.7 V OFF under 5 V supply), reducing quiescent current to ≤1.2 mA while maintaining input bias current <140 µA and turnoff delay <800 ns - critical for burst-mode RF receivers and energy-aware instrumentation.

Key Specifications

Parameter Value and Actual Design Meaning
Small-signal bandwidth 370 MHz at G = +1, ±5 V supply - supports wideband IF sampling without gain peaking or phase distortion.
Slew rate 2800 V/µs - enables full-scale transient response for 14-bit, 80 MSPS ADC drivers without slewing-induced harmonic distortion.
IMD3 -95 dBc at 30 MHz, 2 VPP output - ensures minimal spectral regrowth in LTE/WiMAX baseband receivers.
OIP3 52 dBm at 30 MHz - provides robust linearity margin for high-dynamic-range signal chains driving 50 Ω loads.
Input common-mode range ±3.4 V (min) at ±5 V supply - accommodates rail-to-rail input signals while maintaining CMRR ≥70 dB.
Power-down quiescent current ≤1200 µA - reduces system standby power by >90% versus active mode (23–34 mA), enabling low-duty-cycle sensing.
Output balance error -58 dB at 100 kHz - minimizes even-order distortion and common-mode noise coupling into differential ADC inputs.

Pinout & Package

The THS4502IDGN is housed in an 8-pin MSOP PowerPAD™ package (DGN), featuring exposed thermal pad on underside for PCB-level heat sinking. Pin 1 is VIN−, pin 2 is VIN+, pin 3 is VOCM, pin 4 is VS+, pin 5 is VOUT+, pin 6 is PD, pin 7 is VS−, and pin 8 is VOUT−.

Pin/Terminal Circuit Role Design Meaning
VIN− Inverting input Differential input node; accepts single-ended or differential source with centered common-mode range.
VIN+ Non-inverting input Differential input node; matched impedance and offset to VIN− for optimal CMRR.
VOCM Output common-mode control Programs DC offset of differential outputs; 1.3–3.7 V input range sets 2.5 V default when floating (5 V supply).
VS+ Positive supply Accepts 4.5–15 V single supply or ±5 V to ±7.5 V dual supply; decoupling required per TI SLMA002.
VOUT+ Positive differential output Delivers amplified, balanced signal; drives 20 Ω load with ≥100 mA sink/source capability.
PD Power-down enable Active-high logic input; disables amplifier core while preserving input bias path for fast wake-up (<1 µs).
VS− Negative supply Required for dual-supply operation; tied to ground for single-supply use with proper VOCM biasing.
VOUT− Negative differential output Complementary output to VOUT+; maintains tight amplitude/phase matching for ADC clock-domain rejection.

Key Features

Feature Design Value
Fully differential architecture Eliminates second-harmonic generation and common-mode noise pickup in mixed-signal PCB layouts.
Centered input common-mode range Supports direct interface to op-amp buffers or DAC outputs without level-shifting circuitry.
Output common-mode voltage control Enables precise alignment of differential output swing to ADC reference mid-point (e.g., 2.5 V for 5 V supplies).
Power-down capability Reduces system idle power by >95% while retaining input stage readiness for sub-microsecond wake-up.
MSOP-8 PowerPAD™ package Provides 4.7°C/W junction-to-case thermal resistance - essential for sustained 370 MHz operation at ambient >60°C.

Applications

High-Linearity ADC Preamplifier Wireless Receiver Chain

Use Scenario: Driving 14-bit, 80 MSPS analog-to-digital converter in medical ultrasound digitizer.

IC Role / Device Role / Timing Role: Fully differential amplifier configured as single-ended-to-differential converter with gain = +2.

Use Value: -94 dBc IMD3 at 30 MHz preserves SNR >78 dBFS across Nyquist band, meeting IEC 62304 Class C requirements.

Use Scenario: Baseband signal conditioning in LTE femtocell transceiver.

IC Role / Device Role / Timing Role: Differential line driver between IQ demodulator and ADC, operating at 20 MHz IF.

Use Value: 370 MHz bandwidth ensures <0.05 dB gain flatness across 20 MHz channel, minimizing EVM degradation.

Single-Ended to Differential Conversion Active Filtering of Differential Signals

Use Scenario: Interfacing legacy single-ended sensor output to modern differential-input data logger.

IC Role / Device Role / Timing Role: Gain = +1 buffer with VOCM set to 2.5 V for 5 V supply rail.

Use Value: Input common-mode range of 1.6–3.4 V allows direct connection to 0–5 V sensor outputs without external bias resistors.

Use Scenario: 4th-order active anti-alias filter preceding high-speed ADC in test equipment.

IC Role / Device Role / Timing Role: Second-stage differential amplifier in Sallen-Key topology with Rf = Rg = 499 Ω.

Use Value: 2800 V/µs slew rate prevents settling errors during 10 VPP step responses, ensuring <0.1% fidelity at 10 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fully differential amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
THS4503IDGN No power-down pin; identical AC/DC specs and pinout except NC replaces PD on pin 6. Suitable where continuous operation is required and standby power savings are unnecessary. Select THS4503IDGN if system does not require intermittent shutdown or has no GPIO available for PD control.
THS4502ID Same die but in 8-pin SOIC (D) package; θJA = 97.5°C/W vs 58.4°C/W for DGN; no PowerPAD™ thermal enhancement. Preferred for prototyping or low-frequency applications (<100 MHz) where thermal headroom is sufficient. Choose THS4502ID only when board layout cannot accommodate MSOP-8 PowerPAD™ or thermal dissipation <1 W is guaranteed.

Compared with THS4503IDGN, THS4502IDGN adds power-down control at the cost of one pin and slightly higher layout complexity; compared with THS4502ID, it delivers 40% lower thermal resistance for sustained high-frequency operation in compact enclosures.

Availability

THS4502IDGN is available at Aetrix Electronics and suitable for high-speed data acquisition, wireless infrastructure, and precision instrumentation requiring stable component supply across industrial temperature range (-40°C to +85°C).

Supply support for THS4502IDGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 50 years of innovation in high-performance signal chain components.

The THS4502IDGN belongs to TI's high-speed fully differential amplifier product line, engineered specifically for 14-bit+ data converter interfaces demanding ultra-low distortion, wide bandwidth, and flexible power management in communications and test equipment.

FAQ

What is the maximum junction temperature limit for reliable operation of the THS4502IDGN?

The THS4502IDGN must not exceed +60°C junction temperature to prevent low-level oscillation, as documented in the "Maximum Die Temperature to Prevent Oscillation" section of the datasheet. Operation above this threshold risks instability and degraded linearity. Thermal design must ensure θJA × (Pdiss + Tambient) ≤ 60°C, especially in MSOP-8 PowerPAD™ layouts with limited copper area.

How does the VOCM pin function in the THS4502IDGN, and what happens if left unconnected?

When the VOCM pin is left floating, the THS4502IDGN defaults to 2.5 V output common-mode voltage under 5 V supply (±0.1 V tolerance). With ±5 V supply, it defaults near 0 V (±0.1 V). This internal default enables immediate operation without external biasing, but precise VOCM control requires driving the pin with a low-impedance source (e.g., DAC or resistor divider) to match ADC reference mid-point.

Can the THS4502IDGN operate from a single 5 V supply, and what are the input/output voltage limitations?

Yes, the THS4502IDGN supports single 5 V supply operation. Input common-mode range is 1.6 V to 3.7 V (min), and differential output swing is ±2.6 V into 1 kΩ (referenced to 2.5 V). To avoid clipping, VIN must stay within that range, and VOCM should be set to 2.5 V. Output swing remains symmetrical around VOCM, making 2.5 V the optimal setting for 0–5 V ADC interfaces.

What is the power-down behavior of the THS4502IDGN, and how quickly can it resume full operation?

The THS4502IDGN enters low-power state when PD pin voltage falls below 0.7 V (max), reducing quiescent current to ≤1200 µA. Turnoff delay is ≤800 ns; turnon delay is ≤1000 ns. During power-down, input bias current drops to ≤140 µA, but the input stage remains functional - enabling rapid wake-up without re-biasing delays typical of fully gated amplifiers.

Why does the THS4502IDGN use an MSOP-8 PowerPAD™ package, and what PCB layout considerations apply?

The MSOP-8 PowerPAD™ package provides 4.7°C/W junction-to-case thermal resistance - critical for dissipating >1 W at full 370 MHz operation. The exposed thermal pad must be soldered to a minimum 100 mm² copper pour with ≥4 thermal vias (0.3 mm diameter) to internal ground plane. Failure to implement this per TI technical brief SLMA002 risks exceeding the +60°C oscillation threshold and premature device failure.

THS4502IDGN Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Bulk
Product Status:
Active
Amplifier Type:
Differential
Number of Circuits:
1
Output Type:
Differential
Slew Rate:
2800V/µs
Gain Bandwidth Product:
300 MHz
-3db Bandwidth:
370 MHz
Current - Input Bias:
4 µA
Voltage - Input Offset:
1 mV
Current - Supply:
23mA
Current - Output / Channel:
120 mA
Voltage - Supply Span (Min):
4.5 V
Voltage - Supply Span (Max):
15 V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HVSSOP

THS4502IDGN FAQ

1.How can I place an order for THS4502IDGN through Aetrix?

Please submit a Request for Quotation (RFQ) for THS4502IDGN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for THS4502IDGN reliable?

The price and inventory of THS4502IDGN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS4502IDGN is usually 5 days.

3.What payment methods are accepted for THS4502IDGN?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS4502IDGN transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for THS4502IDGN?

THS4502IDGN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your THS4502IDGN order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for THS4502IDGN?

For technical support, including THS4502IDGN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS4502IDGN requirements.

6.How does Aetrix verify that THS4502IDGN is sourced from the original manufacturer or authorized distributors?

All THS4502IDGN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS4502IDGN meets industry standards.

7.What is the process for return or replacement of THS4502IDGN?

All THS4502IDGN units undergo pre-shipment inspection (PSI). If there is an issue with THS4502IDGN, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The THS4502IDGN part is unused and in its original packaging.

Return procedure for THS4502IDGN:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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