Texas Instruments THS770012IRGER
- Part No.:
- THS770012IRGER
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Amplifiers
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
THS770012IRGER.pdf
- Description:
- IC ADC DRIVER 24VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,499
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Product details
Overview
THS770012IRGER from Texas Instruments is a broadband, fully-differential ADC driver amplifier optimized for 14-/16-bit analog-to-digital converters, delivering +12dB gain, 680MHz small-signal bandwidth at 2VPP, –100dBc third-order intermodulation distortion at 100MHz, and 3300V/µs slew rate. It operates on a +5V single supply and drives differential inputs of high-speed data acquisition systems in wireless base stations and test equipment.
For engineers reviewing the THS770012IRGER datasheet, THS770012IRGER pinout, THS770012IRGER application, or THS770012IRGER equivalent, key selection criteria include its 130MHz 0.1dB flatness bandwidth, VOCM-controlled output common-mode voltage, 10.7dB noise figure at 100MHz, and QFN-24 thermal-enhanced package with integrated ground pad.
Technical Context
The THS770012IRGER employs a fully-differential architecture with independent VOCM input for precise output common-mode control and external gain-setting resistors (GS+/GS–) enabling adjustable gain from +10dB to +13.7dB. Its high slew rate and fast 7.5ns overdrive recovery support clean transient response in wideband sampling systems.
Designed specifically for driving 16-bit ADCs up to 130MHz input frequency and 14-bit ADCs up to 200MHz, it maintains low harmonic distortion (–84dBc HD3 at 100MHz) and high OIP3 (47dBm at 100MHz) under 400Ω differential load conditions with 2VPP output swing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | 680 MHz at G = +12dB, 200mVPP - enables stable amplification of multi-hundred-MHz signals without peaking |
| Large-signal bandwidth | 680 MHz at G = +12dB, 2VPP - preserves fidelity for full-scale ADC input swings |
| IMD3 distortion | –100 dBc at f = 100MHz, 10MHz spacing - critical for high-dynamic-range RF digitization |
| OIP3 | 47 dBm at f = 100MHz - supports strong interferer rejection in dense signal environments |
| Noise figure | 10.7 dB at f = 100MHz, 100Ω differential source - minimizes degradation of ADC effective resolution |
| Slew rate | 3300 V/µs at VOUT = 2V step - ensures sub-nanosecond settling for high-MSPS sampling |
| Power-down quiescent current | 0.8–3 mA - reduces system power during idle cycles without sacrificing wake-up speed |
Pinout & Package
VQFN-24 (RGE) thermally enhanced package with exposed thermal pad tied to GND; 4mm × 4mm body, 0.5mm pitch, 24-pin layout optimized for RF signal integrity and thermal dissipation in high-density PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 6, 7, 12, 19, 24 | No-connect (NC) | Internally unconnected; must be left floating or grounded per layout best practice |
| 2 | Power-down (PD) | Active-high digital control: >2.0V disables amplifier, <0.5V enables operation |
| 3, 4 | VIN– / VIN+ | Differential input pair referenced to midsupply; 100Ω differential input resistance |
| 5 | VOCM | Output common-mode voltage control input; sets DC level of differential outputs (2.25–2.75V range) |
| 8–11, 20–23 | GND / VS+ | Multiple ground and +5V supply pins reduce impedance and improve PSRR and thermal performance |
| 13, 18 | GS– / GS+ | Gain-setting terminals; external resistor networks configure gain from +10dB to +13.7dB |
| 15, 16 | VOUT– / VOUT+ | Fully-differential outputs; 4Ω output impedance at 100MHz supports direct drive into 400Ω ADC inputs |
| 14, 17 | Unused | Bonded but inactive die connections; TI recommends tying to GND for mechanical stability |
| Thermal pad | Ground / Heat sink | Exposed bottom pad must be soldered to large GND plane for θJA = 44.1°C/W thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Adjustable gain architecture | +10dB to +13.7dB via external resistors - enables optimization for specific ADC input range and SNR target |
| VOCM-controlled output common-mode | 300MHz small-signal bandwidth and 150V/µs slew rate on VOCM path - allows dynamic common-mode adjustment without disturbing signal integrity |
| High linearity at RF frequencies | –100dBc IMD3 at 100MHz - meets LTE/WCDMA adjacent channel leakage ratio (ACLR) requirements for direct RF sampling |
| Fast overdrive recovery | 7.5ns maximum - prevents sampling errors when ADC input exceeds full scale momentarily |
| Thermally robust packaging | θJC(bottom) = 8.9°C/W - enables sustained 100mA differential output current without junction overheating |
Applications
| GSM/WCDMA Base Station Receiver | High-Speed Test Equipment Front-End |
|---|---|
Use Scenario: Digitizing IF signals from dual-conversion receivers operating at 130MHz with 16-bit resolution. IC Role / Device Role / Timing Role: Fully-differential ADC driver providing gain, common-mode level shifting, and distortion-limited signal conditioning before ADS5485 sampling. Use Value: 680MHz bandwidth and –100dBc IMD3 ensure >90dB SFDR across 100MHz instantaneous bandwidth, meeting 3GPP receiver sensitivity specs. | Use Scenario: Driving 14-bit, 250MSPS ADC (ADS6149) in real-time spectrum analyzers requiring >70dB spurious-free dynamic range. IC Role / Device Role / Timing Role: High-fidelity signal chain amplifier with 3300V/µs slew rate and 2.2ns 0.1% settling time to support accurate pulse capture. Use Value: 130MHz 0.1dB flatness and 10.7dB noise figure preserve ENOB >13.2 bits at Nyquist, enabling sub-0.1dB amplitude accuracy. |
| LTE Massive MIMO Channel Emulator | High-Dynamic-Range Data Acquisition System |
Use Scenario: Conditioning multi-channel baseband I/Q signals prior to simultaneous sampling in phased-array test platforms. IC Role / Device Role / Timing Role: Differential driver with matched output balance (<–60dB at 200MHz) minimizing quadrature error in complex signal paths. Use Value: Output balance error <–60dB and CMRR >35dB up to 100MHz suppress image artifacts and maintain EVM <1.5% at 20MHz LTE bandwidth. | Use Scenario: Amplifying low-level sensor outputs (e.g., precision strain gauges) before 16-bit ADC conversion in industrial DAQ modules. IC Role / Device Role / Timing Role: Low-noise, high-PSRR (+5V supply) amplifier with 60dB PSRR at 100kHz rejecting switching regulator noise. Use Value: 1.5nV/√Hz input voltage noise and 60dB PSRR enable <10µV RMS noise floor in 10kHz bandwidth, supporting 1ppm measurement resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ADC driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS4509IRGTR | Fixed +12dB gain, 2GHz GBW, higher 1.6nV/√Hz input noise, no VOCM pin | Requires external common-mode bias network; less flexible for variable ADC reference levels | Preferred when ultra-wide bandwidth (>1GHz) is required and VOCM control is unnecessary |
| PGA870IRHPT | Digitally programmable gain (0–24dB), integrated SPI interface, lower 700MHz bandwidth at G=+12dB | Enables dynamic gain adjustment in closed-loop systems; adds digital control overhead | Chosen when adaptive gain staging or calibration sequencing is needed in automated test equipment |
Compared with THS4509IRGTR and PGA870IRHPT, the THS770012IRGER uniquely combines externally adjustable gain, analog VOCM control, and optimized 130MHz flatness for fixed-gain, high-SFDR ADC interfacing-making it ideal for cost-sensitive, high-volume wireless infrastructure front-ends where design simplicity and RF linearity are prioritized.
Availability
THS770012IRGER is available at Aetrix Electronics and suitable for GSM/WCDMA base station receivers, high-speed test equipment front-ends, and LTE massive MIMO channel emulators requiring stable component supply with guaranteed long-term availability.
Supply support for THS770012IRGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in high-performance signal chain solutions.
The THS770012IRGER belongs to TI's high-speed differential amplifier product line, engineered for ultra-low distortion and wide bandwidth in ADC interface applications demanding >90dB SFDR and sub-nanosecond timing accuracy.
FAQ
What is the recommended power supply configuration for THS770012IRGER?
The THS770012IRGER operates on a nominal +5V single supply (4.75V to 5.25V). Multiple VS+ pins (20–23) and GND pins (8–11, thermal pad) must be decoupled with 100nF ceramic capacitors placed close to the package. The thermal pad must be soldered to a solid GND plane to achieve θJA = 44.1°C/W and prevent thermal shutdown during sustained 100mA output current. THS770012IRGER draws 85–115mA quiescent current at +25°C.
How does the VOCM pin function in THS770012IRGER?
The VOCM pin on THS770012IRGER sets the DC common-mode voltage of the differential outputs (VOUT+ and VOUT–). With VOCM = 2.5V, outputs center at 2.5V; the device supports 2.25V to 2.75V input range and provides 0.98–1.02V/V gain from VOCM to output common-mode. VOCM has 300MHz bandwidth and 150V/µs slew rate, allowing dynamic adjustment without signal corruption. THS770012IRGER maintains <±12mV output offset from VOCM under all conditions.
Can THS770012IRGER drive a 100Ω differential ADC input directly?
Yes, THS770012IRGER can drive 100Ω differential loads, though gain accuracy shifts slightly (11.4–11.85dB vs. 11.65–12.15dB at 400Ω). Output voltage swing reduces to 4.4–4.8VPP, and harmonic distortion increases marginally. For optimal SFDR, TI recommends using 400Ω loads with series termination; THS770012IRGER's 4Ω output impedance at 100MHz ensures good match. THS770012IRGER maintains –97dBc IMD3 at 100MHz into 100Ω, sufficient for most 14-bit applications.
What is the minimum recommended PCB layout practice for THS770012IRGER?
THS770012IRGER requires symmetric, 50Ω-controlled differential traces from VIN+ to VIN– and VOUT+ to VOUT–, with ground vias adjacent to each GND pin (8–11, thermal pad). The thermal pad must be connected to a solid internal GND plane using ≥4 thermal vias (0.3mm diameter). Gain-setting resistors (GS+/GS–) should be placed within 2mm of their respective pins, and VOCM routing must avoid noisy digital traces. THS770012IRGER's RF performance degrades if input/output return loss falls below –16dB (s22) or –18dB (s11).
Does THS770012IRGER support power-down mode, and how is it controlled?
Yes, THS770012IRGER features an active-high power-down mode controlled by the PD pin (Pin 2). Driving PD >2.0V places the device in sleep mode, reducing quiescent current to 0.8–3mA. Turn-off delay is 0.15µs; turn-on delay is 10µs to reach 90% of final output. During power-down, outputs enter high-impedance state. THS770012IRGER resumes full performance immediately upon PD falling below 0.5V, with no initialization sequence required.
THS770012IRGER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- ADC Driver
- Applications:
- Data Acquisition
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 24-VQFN (4x4)
THS770012IRGER FAQ
1.How can I place an order for THS770012IRGER through Aetrix?
Please submit a Request for Quotation (RFQ) for THS770012IRGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS770012IRGER reliable?
The price and inventory of THS770012IRGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS770012IRGER is usually 5 days.
3.What payment methods are accepted for THS770012IRGER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS770012IRGER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS770012IRGER?
THS770012IRGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS770012IRGER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS770012IRGER?
For technical support, including THS770012IRGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS770012IRGER requirements.
6.How does Aetrix verify that THS770012IRGER is sourced from the original manufacturer or authorized distributors?
All THS770012IRGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS770012IRGER meets industry standards.
7.What is the process for return or replacement of THS770012IRGER?
All THS770012IRGER units undergo pre-shipment inspection (PSI). If there is an issue with THS770012IRGER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS770012IRGER part is unused and in its original packaging.
Return procedure for THS770012IRGER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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