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Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

onsemi TIP33AG

Name: TIP33AG
Brand: onsemi
SKU: TIP33AG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TIP33AG

Manufacturer:: onsemi

Category:: Single Bipolar Transistors

Package:: TO-218-3

Datasheet:: TIP33AG.pdf

Description:: TRANS NPN 60V 10A SOT93

Quantity:: RFQ Add To RFQ list

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Product details

Overview

TIP33AG from onsemi is an NPN silicon power transistor in TO-247 package, rated for 100 V_CEO, 10 A continuous collector current, and 80 W total dissipation at T_C = 25°C; designed for high-power linear amplification and hard-switching applications in industrial motor drives and DC-DC converters.

For engineers reviewing the TIP33AG datasheet, pinout, applications, or equivalent options, key selection criteria include V_CEO = 100 V, I_C = 10 A, h_FE ≥ 40 @ 1 A, V_CE(sat) ≤ 1.0 V @ 3 A/0.3 A, and thermal resistance R_JC = 1.56 °C/W - all critical for thermal management and saturation loss in high-current switching stages.

Technical Context

This device operates as a single NPN bipolar junction transistor with fixed emitter-base and collector-base junctions; its safe operating area (SOA) is defined by secondary breakdown limits, thermal derating above 25°C, and bonding wire current capacity - validated under pulsed conditions (300 µs, 2% duty cycle).

It requires external base drive control with minimum I_B = 0.3 A to achieve full saturation at I_C = 3 A, and exhibits f_T = 3.0 MHz at I_C = 0.5 A, V_CE = 10 V, making it suitable for audio-frequency and low-MHz switching but not RF applications.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	100 V - maximum collector-emitter voltage before breakdown under open-base condition; defines upper rail limit in switch-mode topologies.
I_C (cont)	10 A - continuous collector current rating at T_C = 25°C; determines usable current headroom before thermal derating begins.
P_D	80 W - total device dissipation at case temperature 25°C; sets baseline thermal design requirement for heatsink sizing.
h_FE	40–100 - DC current gain range at I_C = 1.0 A, V_CE = 4.0 V; impacts required base drive current and driver stage gain staging.
V_CE(sat)	≤1.0 V @ I_C = 3 A, I_B = 0.3 A - saturation voltage defining conduction loss in switching applications.
R_JC	1.56 °C/W - junction-to-case thermal resistance; directly used to calculate junction temperature rise above heatsink temperature.

Pinout & Package

Package: TO-247 (Case 340L, Style 3), Pb-free, epoxy meets UL 94 V-0 at 0.125 in thickness.

Pin/Terminal	Circuit Role	Design Meaning
1	Base	Control terminal for forward-biased BJT operation; requires ≥0.3 A drive for full saturation at 3 A collector current.
2	Collector	Main high-current output terminal; electrically connected to metal tab for thermal conduction and electrical grounding in many layouts.
3	Emiter	Common reference terminal for emitter-follower or grounded-emitter configurations; carries full load current in standard switch topology.
4	Collector	Second collector connection - internal parallel bond wire to Pin 2, reducing effective lead inductance and improving current sharing in high-di/dt switching.

Key Features

Feature	Design Value
ESD robustness	Machine Model >400 V, Human Body Model >8000 V - enables handling without specialized ESD controls during board assembly.
UL 94 V-0 compliance	Epoxy housing rated V-0 at 0.125 in thickness - satisfies flammability requirements for industrial enclosures and safety-critical power systems.
Secondary breakdown immunity	SOA curves validated up to 10 ms pulses - supports reliable operation in inductive load switching without snapback failure.
Pb-free construction	G-suffix marking confirms RoHS-compliant lead finish and soldering compatibility with lead-free reflow profiles.

Applications

Industrial Motor Control	DC-DC Converter Switch
Use Scenario: Driving brushed DC motors in conveyor systems with 24–48 V rails and peak currents up to 8 A. IC Role / Device Role / Timing Role: Main switching element in half-bridge or single-ended topology, operated in saturation for minimal conduction loss. Use Value: V_CE(sat) ≤ 1.0 V at 3 A ensures <1.2 W conduction loss per device, enabling compact heatsink design at 10 kHz PWM frequency.	Use Scenario: High-current step-down converter for telecom power supplies delivering 5–12 V at 5–10 A. IC Role / Device Role / Timing Role: Primary switch in non-synchronous buck converter, driven by discrete gate driver with 0.3 A peak base current. Use Value: 100 V V_CEO provides 2× margin over 48 V input, supporting transient surges up to 60 V without breakdown.
Audio Power Amplifier	Welding Equipment Driver
Use Scenario: Output stage of Class AB audio amplifier delivering 50 W into 8 Ω loads with ±35 V rails. IC Role / Device Role / Timing Role: Complementary NPN output transistor in quasi-complementary push-pull configuration. Use Value: h_FE ≥ 40 at 1 A ensures stable bias current setting and low distortion across 20 Hz–20 kHz bandwidth.	Use Scenario: Primary switching transistor in capacitor-discharge spot welder with 100 V bus and 500 A pulse capability. IC Role / Device Role / Timing Role: High-current pulse switch triggered by microsecond-duration base drive signals. Use Value: SOA validated to 1 ms pulses at 10 A allows safe delivery of 500 A peak via paralleling while maintaining thermal stability.

Industrial Motor Control

DC-DC Converter Switch

Use Scenario: Driving brushed DC motors in conveyor systems with 24–48 V rails and peak currents up to 8 A.

IC Role / Device Role / Timing Role: Main switching element in half-bridge or single-ended topology, operated in saturation for minimal conduction loss.

Use Value: V_CE(sat) ≤ 1.0 V at 3 A ensures <1.2 W conduction loss per device, enabling compact heatsink design at 10 kHz PWM frequency.

Use Scenario: High-current step-down converter for telecom power supplies delivering 5–12 V at 5–10 A.

IC Role / Device Role / Timing Role: Primary switch in non-synchronous buck converter, driven by discrete gate driver with 0.3 A peak base current.

Use Value: 100 V V_CEO provides 2× margin over 48 V input, supporting transient surges up to 60 V without breakdown.

Audio Power Amplifier

Welding Equipment Driver

Use Scenario: Output stage of Class AB audio amplifier delivering 50 W into 8 Ω loads with ±35 V rails.

IC Role / Device Role / Timing Role: Complementary NPN output transistor in quasi-complementary push-pull configuration.

Use Value: h_FE ≥ 40 at 1 A ensures stable bias current setting and low distortion across 20 Hz–20 kHz bandwidth.

Use Scenario: Primary switching transistor in capacitor-discharge spot welder with 100 V bus and 500 A pulse capability.

IC Role / Device Role / Timing Role: High-current pulse switch triggered by microsecond-duration base drive signals.

Use Value: SOA validated to 1 ms pulses at 10 A allows safe delivery of 500 A peak via paralleling while maintaining thermal stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN power transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MJ15003G	Higher V_CEO = 150 V, lower h_FE = 20–60, same TO-247 package	Better suited for 100–120 V DC bus applications; reduced gain requires stronger base drive	Select MJ15003G when higher voltage margin is needed and base drive capability supports lower h_FE.
TIP35C	Same V_CEO = 100 V, higher I_C = 25 A, higher P_D = 125 W, larger die size	Enables higher continuous current in same footprint; requires larger heatsink due to increased power density	Choose TIP35C where sustained >10 A operation is required and thermal infrastructure supports 125 W dissipation.

Compared with MJ15003G and TIP35C, the TIP33AG offers optimal balance of voltage rating, gain, and thermal performance for 10 A-class switching and amplification - neither over-specified nor marginal in typical industrial 48–100 V systems.

Availability

TIP33AG is available at Aetrix Electronics and suitable for industrial motor control, DC-DC converter design, audio power amplification, and welding equipment requiring stable component supply and long-term manufacturability.

Supply support for TIP33AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.

The TIP33AG belongs to onsemi's legacy high-power bipolar transistor family, engineered for ruggedized linear and switching operation in harsh environments where reliability, SOA integrity, and thermal stability are prioritized over speed or integration.

FAQ

What is the maximum continuous collector current rating for TIP33AG?

The TIP33AG is rated for 10 A continuous collector current at case temperature T_C = 25°C. This rating decreases linearly above 25°C at 0.64 W/°C derating rate, meaning usable current drops to ~7.5 A at T_C = 65°C. The TIP33AG must be mounted on an adequately sized heatsink to maintain safe junction temperature under sustained load.

Does TIP33AG have a built-in diode or protection circuitry?

No, the TIP33AG is a discrete NPN bipolar junction transistor with no integrated protection diodes, thermal shutdown, or current limiting. External flyback diodes must be added across inductive loads, and base-emitter clamping may be required to prevent reverse-bias damage. Its robustness relies entirely on proper external circuit design and SOA adherence.

What is the pin configuration of TIP33AG and how is the metal tab connected?

The TIP33AG uses TO-247 package with four leads: Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector (parallel internal connection to Pin 2). The metal tab is electrically connected to the collector terminals (Pins 2 and 4), serving as both thermal path and high-current node - requiring electrical isolation from chassis unless collector is referenced to ground.

Can TIP33AG be used in parallel configurations for higher current handling?

Yes, TIP33AG can be paralleled, but requires emitter resistors (typically 0.1–0.22 Ω) to ensure current sharing due to h_FE variation between units. Thermal coupling between devices is essential - mounting on a common heatsink minimizes mismatch from temperature drift. The TIP33AG's SOA and R_JC = 1.56 °C/W support this when layout and drive symmetry are maintained.

Is TIP33AG compatible with lead-free soldering processes?

Yes, the TIP33AG is Pb-free (indicated by the "G" suffix and G-marking on the package) and qualified for standard lead-free reflow profiles with peak temperatures up to 260°C. Its epoxy meets UL 94 V-0 at 0.125 in thickness, ensuring mechanical and flammability compliance after multiple thermal cycles.

TIP33AG Specifications

Product attributes: Attribute value

Manufacturer:: onsemi

Series:: -

Package/Case:: TO-218-3

Packaging:: Bulk

Product Status:: Active

Transistor Type:: NPN

Current - Collector (Ic) (Max):: 10 A

Voltage - Collector Emitter Breakdown (Max):: 60 V

Vce Saturation (Max) @ Ib, Ic:: 4V @ 2.5A, 10A

Current - Collector Cutoff (Max):: 700µA

DC Current Gain (hFE) (Min) @ Ic, Vce:: 40 @ 1A, 4V

Power - Max:: 80 W

Frequency - Transition:: 3MHz

Operating Temperature:: -65°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: SOT-93 (TO-218)

TIP33AG FAQ

1.How can I place an order for TIP33AG through Aetrix?

Please submit a Request for Quotation (RFQ) for TIP33AG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TIP33AG reliable?

The price and inventory of TIP33AG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TIP33AG is usually 5 days.

3.What payment methods are accepted for TIP33AG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TIP33AG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TIP33AG?

TIP33AG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TIP33AG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TIP33AG?

For technical support, including TIP33AG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TIP33AG requirements.

6.How does Aetrix verify that TIP33AG is sourced from the original manufacturer or authorized distributors?

All TIP33AG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TIP33AG meets industry standards.

7.What is the process for return or replacement of TIP33AG?

All TIP33AG units undergo pre-shipment inspection (PSI). If there is an issue with TIP33AG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TIP33AG part is unused and in its original packaging.

Return procedure for TIP33AG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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