NXP Semiconductors TJA1042TK/3,118

Overview

TJA1042TK/3,118 from NXP Semiconductors is a high-speed CAN transceiver with Standby mode, implementing ISO 11898-2:2016 and SAE J2284-1 to J2284-5 for CAN FD fast-phase operation up to 5 Mbit/s. It features VIO pin for direct 3.3 V microcontroller interfacing, 10–15 μA Standby current, ±58 V bus fault tolerance, and AEC-Q100 qualification for automotive body control modules.

For engineers reviewing the TJA1042TK/3,118 datasheet, TJA1042TK/3,118 pinout, TJA1042TK/3,118 application, or TJA1042TK/3,118 equivalent, this page delivers verified electrical parameters, HVSON8 package details, fail-safe timing behavior (e.g., 0.3–5 ms TXD dominant time-out), bus wake-up filter (0.5–5 μs), and real-world design implications for low-power automotive node integration.

Technical Context

The TJA1042TK/3,118 operates in Normal and Standby modes controlled by STB pin, with Standby mode enabling bus wake-up detection using only VIO supply while drawing ≤14 μA. Its differential receiver remains active in Standby, filtering bus activity via tfltr(wake)bus (0.5–5 μs) to avoid false triggers.

It implements slope-controlled drivers compliant with EMC standards IEC 62228-3 and SAE J2962-2, supports 12 V/24 V systems, and provides undervoltage detection on both VCC (3.5–4.5 V threshold) and VIO (1.3–2.7 V threshold) to ensure predictable fail-safe disengagement from the bus.

Key Specifications

Pinout & Package

HVSON8 package (SOT782-1): 3.0 mm × 3.0 mm × 0.85 mm, leadless thermal-enhanced outline with exposed center pad for improved thermal dissipation (Rth(j-a) = 53 K/W) and AOI-friendly solder joint inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed CAN transceiver applications.

Compared with MCP2551-I/P, TJA1042TK/3,118 delivers automotive-grade reliability, 100× lower standby current, and integrated fail-safes; versus TJA1043T/3, it omits Silent Mode but retains identical power efficiency and bus wake-up capability-making it ideal for standard transmit/receive ECU nodes.

Availability

TJA1042TK/3,118 is available at Aetrix Electronics and suitable for automotive body control modules, ADAS sensor hubs, electric power steering ECUs, and OBD-II diagnostic interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TJA1042TK/3,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in CAN protocol stacks and automotive-grade analog front-ends.

The TJA1042 product line was designed specifically for next-generation automotive HS-CAN networks requiring ultra-low-power Standby operation, enhanced EMC/ESD robustness, and seamless integration with mixed-voltage microcontrollers.

FAQ

What is the function of the VIO pin on the TJA1042TK/3,118?

The VIO pin on the TJA1042TK/3,118 supplies the I/O level reference for TXD, RXD, and STB pins, enabling direct interfacing with 3.3 V microcontrollers without external level shifters. It also powers the low-power differential receiver in Standby mode, allowing bus wake-up detection even when VCC is off. The VIO operating range is 2.8–5.5 V, and undervoltage detection (1.3–2.7 V) ensures safe disengagement if VIO drops too low. This pin is exclusive to TJA1042TK/3,118 and other VIO variants-not present on SPLIT-pin versions like TJA1042T.

How does the TJA1042TK/3,118 enter and exit Standby mode?

The TJA1042TK/3,118 enters Standby mode when STB is driven HIGH, reducing supply current to ≤14 μA while keeping the low-power receiver active for bus wake-up detection. Exit requires two conditions: STB must be pulled LOW *and* VCC must be above its undervoltage threshold (3.5–4.5 V). If VCC recovers first, the device remains in Standby until STB transitions; if STB goes LOW before VCC stabilizes, the transceiver waits for VCC to rise. RXD reflects wake-up events as LOW pulses, but Normal mode activation is gated by STB state and VCC validity-ensuring deterministic, fail-safe behavior.

What is the significance of the TXD dominant time-out function in the TJA1042TK/3,118?

The TXD dominant time-out function in the TJA1042TK/3,118 is a hardware safety mechanism that disables the transmitter if TXD remains LOW longer than 0.3–5 ms, forcing the bus back to recessive. This prevents a locked-up MCU or faulty firmware from holding the bus dominant indefinitely-blocking all network communication. The timer resets automatically when TXD goes HIGH, and its minimum value (0.3 ms) complies with ISO 11898-2:2016 for legacy compatibility, while the upper bound (5 ms) ensures robustness against transient noise. This eliminates reliance on software watchdogs and enhances system-level fault containment.

Does the TJA1042TK/3,118 support CAN FD, and what are its timing guarantees?

Yes, the TJA1042TK/3,118 fully supports CAN FD fast-phase operation up to 5 Mbit/s, complying with ISO 11898-2:2016 and SAE J2284-1 to J2284-5. Its timing is guaranteed across temperature and voltage: td(TXD-busdom) is 65–100 ns, td(busrec-RXD) is 65–155 ns, and receiver timing symmetry Δtrec is ±40 ns at 500 ns bit time. These values enable reliable high-speed communication in large network topologies and meet strict timing budgets for ADAS and powertrain applications. Propagation delay consistency ensures deterministic latency critical for closed-loop control systems.

What package type and thermal characteristics apply to the TJA1042TK/3,118?

The TJA1042TK/3,118 uses the HVSON8 package (SOT782-1): 3.0 mm × 3.0 mm × 0.85 mm, leadless with an exposed center pad. Its thermal resistance from junction to ambient (Rth(j-a)) is 53 K/W under free-air conditions-significantly lower than SO8 alternatives (92 K/W)-enabling higher power density and sustained operation at +125 °C ambient. The exposed pad must be soldered to PCB ground for optimal thermal and electrical performance. This package also supports automated optical inspection (AOI), improving manufacturing yield in high-volume automotive production.