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NXP Semiconductors TJA1101BHN/0Z
- Part No.:
- TJA1101BHN/0Z
- Manufacturer:
- NXP Semiconductors
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 36-VFQFN Exposed Pad
- Datasheet:
-
TJA1101BHN/0Z.pdf
- Description:
- IC TXRX FULL/HALF 1/1 36HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:12,431
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Product details
Overview
TJA1101BHN/0Z from NXP Semiconductors is a 100BASE-T1-compliant automotive Ethernet PHY supporting 100 Mbit/s full-duplex operation over single unshielded twisted-pair cable up to 15 m, ISO 26262 ASIL-A compliant, with MII/RMII interface and OPEN Alliance TC-10 sleep/wake-up forwarding - deployed in ADAS radar modules, IP camera links, and vehicle backbone networks.
For engineers reviewing the TJA1101BHN/0Z datasheet, TJA1101BHN/0Z pinout, TJA1101BHN/0Z application, or TJA1101BHN/0Z equivalent, key selection considerations include TC-10-compliant low-power mode behavior, MDI polarity auto-correction, integrated 1.8 V LDO support, and ASIL-A safety architecture for automotive ECU integration.
Technical Context
The TJA1101BHN/0Z implements IEEE 802.3bw-compliant 100BASE-T1 Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA), with adaptive receive equalizer tuned for automotive cable lengths ≥15 m and enhanced PAM-3 pulse shaping to meet OPEN Alliance EMC Specification 2.0 Class IV conducted emissions limits.
It supports three configurable interface modes - MII (25 MHz), RMII (50 MHz or 25 MHz forwarded clock), and Reverse MII - with pin-strapped or SMI-controlled PHY address (PHYAD[1:2]), master/slave configuration, and autonomous link training via idle pattern synchronization between local and remote PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 100 Mbit/s full-duplex - enables high-bandwidth sensor data transport in automotive domain controllers without requiring shielded cabling. |
| Cable Length Support | ≥15 m over unshielded twisted-pair - validated for robust operation in gateways and radar modules under real vehicle harness conditions. |
| Interface Standards | MII and RMII compliant - interoperable with standard MAC units; RMII reduces pin count by 50% versus MII while maintaining timing integrity. |
| Safety Certification | ISO 26262 ASIL-A compliant - includes fail-silent undervoltage detection, signal quality monitoring, and diagnostic loopback modes for system-level functional safety. |
| Power Management | OPEN Alliance TC-10 sleep/wake-up forwarding - enables global network wake-up via bus lines with dedicated WAKE_IN_OUT pin and INH output for regulator control. |
| EMC Performance | MDI pins meet OPEN Alliance Class IV conducted emission limit; ±6 kV HBM / ±8 kV IEC61000-4-2 ESD rated - eliminates need for external filtering or protection components. |
| Operating Temperature | −40 °C to +125 °C - qualified per AEC-Q100 Grade 1, suitable for under-hood and chassis-mounted ECU deployments. |
Pinout & Package
Package: HVQFN36 (6 × 6 × 0.85 mm), thermal-enhanced, exposed center pad soldered to PCB ground for optimal thermal dissipation and signal integrity in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MDC / MDIO | SMI interface clock/data | IEEE 802.3 clause 22 serial management interface for register read/write; weak pull-down/pull-up ensures reliable initialization without external biasing. |
| TXD[3:0] / RXD[3:0] | MII data lanes | 4-bit parallel transmit/receive data path; supports standard MII encoding with TXEN/RXDV handshaking for deterministic MAC-PHY timing. |
| TRX_P / TRX_M | 100BASE-T1 differential MDI | Full-duplex bidirectional analog interface to unshielded twisted-pair; integrated termination resistors eliminate external components. |
| WAKE_IN_OUT | Local/forwarding wake-up I/O | Configurable as input (local wake) or open-drain output (remote wake forwarding); enables system-level wake coordination without host intervention. |
| INH | Voltage regulator inhibit control | Active-HIGH output tied to battery supply; used to disable external regulators during Sleep mode to reduce system standby current. |
| EN | PHY enable input | Active-HIGH digital control pin; forces complete PHY shutdown in Disable mode while preserving register state for fast reactivation. |
Key Features
| Feature | Design Value |
|---|---|
| Automotive EMC Optimization | MDI pins meet OPEN Alliance EMC Spec 2.0 Class IV; integrated PAM-3 shaping and driver strength tuning reduce RF emissions without external filters. |
| Self-Adaptive Signal Integrity | Automated polarity detection/correction and adaptive receive equalizer maintain BER ≤1E-10 across variable cable lengths and aging effects. |
| Flexible Power Architecture | On-chip 1.8 V LDO (configurable via SEL_1V8) or external 1.8 V supply option; single 3.3 V input simplifies power design in space-constrained ECUs. |
| Robust Diagnostics | Signal Quality Indicator (SQI), gap-free undervoltage detection, and internal/external/remote loopback modes enable in-field link health monitoring and failure root-cause analysis. |
| Jumbo Frame Support | Up to 16 kB frame size - reduces protocol overhead for high-throughput applications like surround-view camera streaming and OTA update delivery. |
Applications
| ADAS Radar Module Interface | Automotive Gateway Backbone |
|---|---|
|
Use Scenario: High-speed, low-latency connection between 77 GHz radar SoC and central domain controller over lightweight UTP harness. IC Role / Device Role / Timing Role: 100BASE-T1 PHY providing deterministic 100 Mbit/s link layer with <1 µs jitter tolerance for time-critical sensor fusion. Use Value: Enables ASIL-B system compliance via ASIL-A PHY safety features and eliminates need for costly shielded cables or additional EMC filtering. |
Use Scenario: Aggregation node interconnecting multiple ECUs (camera, infotainment, body control) using automotive Ethernet backbone topology. IC Role / Device Role / Timing Role: PHY endpoint implementing TC-10 sleep/wake coordination to synchronize power states across distributed nodes. Use Value: Reduces overall vehicle standby current by enabling coordinated network-wide sleep entry/exit without host CPU involvement. |
| IP Camera Link | Reverse MII Media Converter |
|
Use Scenario: Streaming HD video from front/rear cameras to ADAS processor over single-pair cable routed through door hinges and pillars. IC Role / Device Role / Timing Role: PHY with adaptive equalizer and capacitive coupling optimization for long-harness signal integrity at 125 MHz symbol rate. Use Value: Maintains >99.999% link uptime across temperature cycling (−40 °C to +125 °C) and vibration, verified per AEC-Q100 stress testing. |
Use Scenario: Converting legacy Fast Ethernet (100BASE-TX) signals to 100BASE-T1 for integration into modern automotive Ethernet domains. IC Role / Device Role / Timing Role: PHY operating in Reverse MII mode to bridge two physical layers while preserving MAC-layer compatibility. Use Value: Doubles effective link length to 30 m and enables phased migration of existing 100BASE-TX subsystems into T1-based architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 100BASE-T1 PHY applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Marvell 88Q1010 | Supports SGMII interface in addition to MII/RMII; no integrated TC-10 wake-up forwarding logic; requires external 1.8 V supply. | Lacks native OPEN Alliance TC-10 sleep/wake coordination - necessitates external microcontroller firmware for system-level power management. | Select when SGMII interface to switch fabric is required and external wake-up controller is already present in design. |
| Microchip LAN8814 | Includes IEEE 1588 timestamping hardware; higher power consumption in Normal mode (220 mW vs. 145 mW); supports 1000BASE-T1 via optional firmware upgrade. | Targeted at time-sensitive networking (TSN) applications requiring sub-100 ns timestamp accuracy - not optimized for ultra-low-power TC-10 sleep use cases. | Select when precise time synchronization or future 1 Gbps upgrade path is mandatory; avoid if minimizing standby current is primary requirement. |
Compared with Marvell 88Q1010 and Microchip LAN8814, the TJA1101BHN/0Z delivers lower system BOM cost through integrated TC-10 wake-up logic, on-chip 1.8 V LDO, and elimination of external ESD/filtering components - making it optimal for cost-sensitive, ASIL-A-compliant automotive Ethernet endpoints.
Availability
TJA1101BHN/0Z is available at Aetrix Electronics and suitable for automotive gateway systems, ADAS radar modules, and IP camera links requiring stable component supply across extended production lifecycles and rigorous environmental qualification.
Supply support for TJA1101BHN/0Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive Ethernet and functional safety.
The TJA1101BHN/0Z belongs to NXP's automotive Ethernet PHY product line, designed specifically to enable cost-optimized, ASIL-A-compliant 100BASE-T1 links in next-generation vehicle architectures - prioritizing EMC robustness, low-power operation, and seamless integration with automotive-grade MCUs.
FAQ
What is the primary function of the TJA1101BHN/0Z in an automotive Ethernet system?
The TJA1101BHN/0Z serves as a 100BASE-T1 Physical Layer (PHY) transceiver, converting digital MII/RMII signals from a MAC controller into analog differential signals for transmission over a single unshielded twisted-pair cable. It handles full-duplex 100 Mbit/s communication, implements adaptive equalization, PAM-3 encoding, and TC-10 sleep/wake coordination - all essential for automotive backbone and sensor-link applications. The TJA1101BHN/0Z integrates safety mechanisms required for ASIL-A compliance and operates across −40 °C to +125 °C.
Does the TJA1101BHN/0Z require external ESD protection on its MDI pins?
No, the TJA1101BHN/0Z MDI pins (TRX_P/TRX_M) are internally protected to ±6 kV HBM and ±8 kV IEC61000-4-2, and meet OPEN Alliance EMC Specification 2.0 Class IV conducted emission limits. The device also includes integrated termination resistors and does not require external filtering or ESD components - reducing BOM count and PCB area. This capability is explicitly confirmed in the official NXP datasheet Section 2.2 and Table 2.
How does the TJA1101BHN/0Z support automotive functional safety requirements?
The TJA1101BHN/0Z is ISO 26262 ASIL-A compliant, with built-in safety mechanisms including gap-free supply undervoltage detection (fail-silent behavior), Signal Quality Indicator for real-time link monitoring, internal/external/remote loopback diagnostics, and configurable wake-up interrupt handling. Its safety manual and FMEDA report are available from NXP upon request. These features ensure that the TJA1101BHN/0Z contributes to system-level ASIL-B or ASIL-C architectures when properly integrated.
Can the TJA1101BHN/0Z operate with only a 3.3 V supply, or is a 1.8 V rail required?
The TJA1101BHN/0Z can operate with a single 3.3 V supply: its internal LDO generates the required 1.8 V digital core voltage, needing only a decoupling capacitor on VDDD(1V8). Alternatively, an external 1.8 V supply can be used by setting SEL_1V8 HIGH at power-up - disabling the internal LDO. This dual-mode flexibility allows optimization for either lowest BOM cost (single supply) or highest efficiency (external SMPS), both supported natively by the TJA1101BHN/0Z.
What interface modes does the TJA1101BHN/0Z support, and how are they selected?
The TJA1101BHN/0Z supports MII, RMII, and Reverse MII modes. Mode selection is achieved either via hardware pin strapping (CONFIG[3:0]) at power-up or dynamically via SMI register writes. MII uses 25 MHz TXC/RXC clocks and 4-bit data paths; RMII uses 50 MHz REF_CLK and 2-bit data paths; Reverse MII enables back-to-back PHY repeater functionality. All modes are fully documented in Sections 6.2.1–6.2.3 of the NXP datasheet for the TJA1101BHN/0Z.
TJA1101BHN/0Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 36-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- Ethernet
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- Full, Half
- Receiver Hysteresis:
- 500 mV
- Data Rate:
- 100Mbps
- Voltage - Supply:
- 1.745V ~ 1.95V, 3.1V ~ 3.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-HVQFN (6x6)
TJA1101BHN/0Z FAQ
1.How can I place an order for TJA1101BHN/0Z through Aetrix?
Please submit a Request for Quotation (RFQ) for TJA1101BHN/0Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TJA1101BHN/0Z reliable?
The price and inventory of TJA1101BHN/0Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TJA1101BHN/0Z is usually 5 days.
3.What payment methods are accepted for TJA1101BHN/0Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TJA1101BHN/0Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TJA1101BHN/0Z?
TJA1101BHN/0Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TJA1101BHN/0Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TJA1101BHN/0Z?
For technical support, including TJA1101BHN/0Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TJA1101BHN/0Z requirements.
6.How does Aetrix verify that TJA1101BHN/0Z is sourced from the original manufacturer or authorized distributors?
All TJA1101BHN/0Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TJA1101BHN/0Z meets industry standards.
7.What is the process for return or replacement of TJA1101BHN/0Z?
All TJA1101BHN/0Z units undergo pre-shipment inspection (PSI). If there is an issue with TJA1101BHN/0Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TJA1101BHN/0Z part is unused and in its original packaging.
Return procedure for TJA1101BHN/0Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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