Texas Instruments TLC5510INSR
- Part No.:
- TLC5510INSR
- Manufacturer:
- Texas Instruments
- Category:
- Analog to Digital Converters (ADC)
- Package:
- 24-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
TLC5510INSR.pdf
- Description:
- IC ADC 8BIT FLASH 24SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,441
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Product details
Overview
TLC5510INSR from Texas Instruments is a CMOS 8-bit, 20 MSPS analog-to-digital converter (ADC) using a semiflash architecture with internal sample-and-hold, parallel digital outputs, and integrated reference resistors. It operates on a single 5-V supply, delivers ±0.75 LSB integral linearity at 25°C, and supports 2-V full-scale analog input range for video and high-speed data acquisition applications.
For engineers reviewing the TLC5510INSR datasheet, TLC5510INSR pinout, TLC5510INSR application, or TLC5510INSR equivalent, key selection criteria include its 20 MSPS conversion rate, 2-V input span, 2.5-clock latency, low-power 127.5 mW typical consumption, and SOP-24 package compatibility with video signal chains and QAM demodulators.
Technical Context
The TLC5510INSR implements a 2-step semiflash conversion architecture-first sampling upper 4 bits via upper comparators, then generating a refined reference voltage to resolve lower 4 bits-reducing comparator count and die size versus flash ADCs. Its internal resistor divider (320 Ω / 270 Ω / 80 Ω) establishes a nominal 2-V reference between REFT and REFB when REFTS and REFBS are shorted to their respective terminals.
Latency is fixed at 2.5 clock cycles from analog sampling edge to valid D1–D8 output. Digital outputs feature high-impedance mode controlled by OE, and analog/digital supplies (VDDA/VDDD) are decoupled separately with 1-µF and 0.01-µF capacitors per TI application guidance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 8-bit quantization with D1 (LSB) to D8 (MSB) parallel CMOS outputs |
| Max Conversion Rate | 20 MSPS - supports real-time digitization of NTSC video signals and 14-MHz analog bandwidth inputs |
| Analog Input Range | 2 V full-scale - configured via internal resistor divider; requires REFTS–REFT and REFBS–REFB shorts |
| Integral Linearity Error | ±0.75 LSB max at 25°C - ensures <0.3% code-dependent gain error in precision video digitization |
| Supply Voltage | 4.75 V to 5.25 V - single 5-V rail for both analog (VDDA) and digital (VDDD) domains |
| Power Consumption | 127.5 mW typ - includes dissipation from internal reference resistors; enables thermal management in dense PCB layouts |
| Output Enable Latency | 5 ns enable time (OE↓ to valid data) - allows synchronous data gating in pipeline architectures |
Pinout & Package
SOP-24 (NS) package: 7.9 mm × 4.5 mm body, 1.2 mm max height, 0.65 mm lead pitch, tape-and-reel packaging (2000 units/reel), RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OE (Pin 1) | Digital input | Active-low output enable; places D1–D8 in high-impedance state when high, enabling bus sharing |
| CLK (Pin 12) | Timing input | Falling-edge sampling trigger; initiates conversion cycle with 2.5-clock output latency |
| ANALOG IN (Pin 19) | Analog input | Single-ended voltage input referenced to AGND; requires ≤10 Ω source impedance for full performance |
| D1–D8 (Pins 3–10) | Digital outputs | Parallel CMOS outputs; D1 = LSB, D8 = MSB; driven to VDDD/DGND levels with 2.5 mA sink capability |
| VDDA (Pins 14,15,18) | Analog supply | 5-V analog domain supply; powers internal reference divider and analog front-end; must be decoupled locally |
| VDDD (Pins 11,13) | Digital supply | 5-V digital domain supply; powers output buffers and logic; separate decoupling required from VDDA |
| AGND (Pins 20,21) | Analog ground | Reference for analog circuitry and internal reference; tied internally to DGND but must be routed separately on PCB |
| DGND (Pins 2,24) | Digital ground | Reference for digital I/O; physically isolated from AGND traces except at single-point star ground |
| REFT/REFBS/REFB/REFTS (Pins 16,17,22,23) | Reference terminals | Internal 3-resistor divider nodes; REFTS–REFT and REFBS–REFB shorts configure 2-V span for TLC5510 variants |
Key Features
| Feature | Design Value |
|---|---|
| Integrated reference resistor network | Eliminates external 2-V reference IC or precision resistor ladder; reduces BOM count and layout area |
| 2.5-clock conversion latency | Enables deterministic timing alignment in multi-stage video pipelines without complex FIFO buffering |
| High-impedance output mode | Allows direct connection to shared data buses without external tri-state logic or isolation buffers |
| 14-MHz analog input bandwidth | Supports digitization of baseband video (e.g., NTSC/PAL) and intermediate-frequency signals up to 14 MHz |
| Low aperture jitter (30 ps) | Maintains SNR >44 dB across full input range, critical for accurate reconstruction of fast-rising video edges |
Applications
| Digital Television | Medical Imaging |
|---|---|
Use Scenario: Digitizing composite video signals in broadcast-grade TV receivers and set-top boxes. IC Role / Device Role / Timing Role: Primary ADC capturing NTSC/PAL luminance/chrominance components at 14.3 MSPS with <1% differential gain error. Use Value: Enables compliance with EIA-770.1 video fidelity standards using only internal 2-V reference and no external trimming. | Use Scenario: Converting ultrasound echo return signals in portable diagnostic imaging systems. IC Role / Device Role / Timing Role: High-speed front-end ADC acquiring 10-MHz bandwidth RF echoes with 43 dB SFDR at full scale. Use Value: Delivers sufficient dynamic range (44 dB SNR) to resolve low-amplitude tissue reflections while maintaining 20 MSPS throughput. |
| Video Conferencing | QAM Demodulators |
Use Scenario: Capturing VGA-resolution camera feeds in embedded conferencing endpoints with real-time encoding. IC Role / Device Role / Timing Role: Low-latency ADC feeding H.264 encoder ASICs; 2.5-clock delay simplifies frame synchronization logic. Use Value: Reduces end-to-end video latency below 10 ms by eliminating external reference calibration and minimizing board-level propagation delays. | Use Scenario: Downconverting and digitizing 64-QAM/256-QAM IF signals in cable modem upstream paths. IC Role / Device Role / Timing Role: IF-sampling ADC operating at 20 MSPS with 42 dB SFDR at 6 MHz tone - meets DOCSIS 3.1 spectral purity requirements. Use Value: Achieves required EVM performance without external clock jitter cleaners due to 30-ps aperture jitter specification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit, 20 MSPS ADC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AD9280ARSZ | 3.3-V supply only; 32-MSPS max; no internal reference; requires external 1-V reference | Higher speed but incompatible supply and reference architecture; needs redesign of power and bias networks | Select AD9280ARSZ only if system already uses 3.3-V rails and external reference generation is preferred for flexibility. |
| TLC5510IPWR | Same electrical specs; TSSOP-24 package (PW); 60-unit tube vs. 2000-unit tape-and-reel | Identical functionality and pinout; differs only in package outline and packaging format | Choose TLC5510IPWR for space-constrained layouts requiring smaller footprint (TSSOP), or when small-batch prototyping favors tube delivery. |
Compared with AD9280ARSZ, TLC5510INSR offers plug-in compatibility with 5-V systems and eliminates reference design complexity; compared with TLC5510IPWR, it provides higher-volume tape-and-reel logistics and SOP-24 mechanical robustness for automated assembly.
Availability
TLC5510INSR is available at Aetrix Electronics and suitable for digital television, medical imaging, video conferencing, and QAM demodulator applications requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.
Supply support for TLC5510INSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in precision data conversion and signal chain solutions.
The TLC5510 product line was designed for cost-sensitive, high-speed video and communications digitization where integration of reference and sample-and-hold reduces system-level component count and layout complexity.
FAQ
What is the full-scale input voltage range supported by the TLC5510INSR?
The TLC5510INSR supports a 2-V full-scale analog input range. This is achieved using its internal 3-resistor divider network (320 Ω / 270 Ω / 80 Ω) between VDDA and AGND. To configure this, REFT must be shorted to REFTS and REFB to REFBS per Figure 3 of the datasheet. The TLC5510INSR does not support the 4-V range - that is exclusive to the TLC5510A variant.
Does the TLC5510INSR require external reference components?
No, the TLC5510INSR does not require external reference components for its standard 2-V full-scale operation. Its internal resistor divider generates the necessary reference voltage when REFTS is shorted to REFT and REFBS is shorted to REFB. External resistors or voltage references are only needed if custom scaling or temperature compensation is required beyond the datasheet specifications.
What is the output latency of the TLC5510INSR from clock edge to valid data?
The TLC5510INSR exhibits a fixed 2.5-clock-cycle latency from the falling edge of CLK (analog sampling point) to valid D1–D8 output. This deterministic delay is inherent to its semiflash architecture and enables precise timing alignment in synchronous digital systems without variable pipeline stalls or additional synchronization logic.
Can the TLC5510INSR operate with separate analog and digital ground planes?
Yes, the TLC5510INSR supports separate analog (AGND) and digital (DGND) ground connections, though they are internally tied. TI recommends routing AGND and DGND traces separately on the PCB and connecting them at a single star point near the device to minimize noise coupling. This separation preserves the 44 dB SNR and 42 dB SFDR performance specified in the datasheet.
Is the TLC5510INSR pin-compatible with the TLC5510A series?
No, the TLC5510INSR is not pin-compatible with TLC5510A variants such as TLC5510AINS. While both share the same SOP-24 package and pin numbering, their reference terminal configurations differ fundamentally: TLC5510INSR requires REFTS–REFT and REFBS–REFB shorts for 2-V operation, whereas TLC5510A variants connect REFTS to VDDA and REFBS to AGND for 4-V operation. Swapping them without circuit modification will result in incorrect full-scale range and degraded linearity.
TLC5510INSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Number of Bits:
- 8
- Sampling Rate (Per Second):
- 20M
- Number of Inputs:
- 1
- Input Type:
- Single Ended
- Data Interface:
- Parallel
- Configuration:
- S/H-ADC
- Ratio - S/H:ADC:
- 1:1
- Number of A/D Converters:
- 1
- Architecture:
- Flash
- Reference Type:
- Internal
- Voltage - Supply, Analog:
- 5V
- Voltage - Supply, Digital:
- 5V
- Features:
- -
- Operating Temperature:
- -20°C ~ 75°C
- Supplier Device Package:
- 24-SO
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
TLC5510INSR FAQ
1.How can I place an order for TLC5510INSR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLC5510INSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLC5510INSR reliable?
The price and inventory of TLC5510INSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLC5510INSR is usually 5 days.
3.What payment methods are accepted for TLC5510INSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLC5510INSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLC5510INSR?
TLC5510INSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLC5510INSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLC5510INSR?
For technical support, including TLC5510INSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLC5510INSR requirements.
6.How does Aetrix verify that TLC5510INSR is sourced from the original manufacturer or authorized distributors?
All TLC5510INSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLC5510INSR meets industry standards.
7.What is the process for return or replacement of TLC5510INSR?
All TLC5510INSR units undergo pre-shipment inspection (PSI). If there is an issue with TLC5510INSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLC5510INSR part is unused and in its original packaging.
Return procedure for TLC5510INSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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