Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TLC5510INSR-A

Part No.:
TLC5510INSR-A
Manufacturer:
Texas Instruments
Category:
Analog to Digital Converters (ADC)
Package:
-
Datasheet:
AetrixTLC5510INSR-A.pdf
Description:
ANALOG DATA CONVERTR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,000

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TLC5510INSR-A from Texas Instruments is a CMOS 8-bit, 20 MSPS analog-to-digital converter (ADC) using a semiflash architecture for high-speed video and communication signal digitization. It features 2-V full-scale input range, ±0.75 LSB integral nonlinearity at 25°C, 5-V single-supply operation, and parallel CMOS-compatible digital outputs with tri-state enable. It is used in digital TV front-ends requiring low-latency, stable sampling of baseband video signals.

For engineers reviewing the TLC5510INSR-A datasheet, TLC5510INSR-A pinout, TLC5510INSR-A application, or TLC5510INSR-A equivalent, this page delivers verified technical context, real-world timing behavior, package-specific layout guidance, and validated alternative options for video ADC selection in production-grade embedded systems.

Technical Context

The TLC5510INSR-A implements a 2-step semiflash conversion architecture: upper and lower 4-bit comparator blocks operate in staggered clock phases to reduce comparator count and power versus full-flash designs. Conversion latency is fixed at 2.5 clock cycles from analog sample edge to valid D1–D8 output.

It integrates internal reference resistors (320 Ω / 270 Ω / 80 Ω) enabling a self-contained 2-V full-scale range when REFTS is shorted to REFT and REFBS to REFB. Analog input bandwidth is 14 MHz (–1 dB), aperture jitter is 30 ps, and differential gain/phase are 1% and 0.7° under NTSC conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Resolution 8-bit - delivers 256 discrete digital codes for precise amplitude quantization of video or IF signals.
Max Conversion Rate 20 MSPS - supports digitization of up to 10-MHz baseband signals per Nyquist criterion.
Full-Scale Input Range 2 V - matches standard video signal swing (e.g., 1-Vpp into 75 Ω with DC bias), eliminating external scaling.
Integral Nonlinearity ±0.75 LSB max at 25°C - ensures monotonicity and <0.3% code-dependent gain error across full scale.
Supply Voltage 4.75 V to 5.25 V - compatible with standard 5-V logic rails and tolerant of typical board-level regulation ripple.
Power Consumption 127.5 mW typ - enables dense placement in multi-channel video capture systems without forced cooling.
Analog Input Bandwidth 14 MHz (–1 dB) - preserves fidelity of composite video harmonics up to 5th order (e.g., NTSC color subcarrier at 3.58 MHz).

Pinout & Package

Package: 24-pin SOIC (NS), 7.7 mm × 12.9 mm body, RoHS-compliant NiPdAu lead finish, MSL Level-1 (260°C, unlimited floor life).

Pin/Terminal Circuit Role Design Meaning
OE (Pin 1) Output enable control input Active-low signal enabling tri-state drive on D1–D8; allows bus sharing with other parallel devices without external logic.
CLK (Pin 12) Sampling clock input Falling-edge-triggered analog sample; rising edges drive internal pipeline stages-requires clean, low-jitter 20-MHz source.
D1–D8 (Pins 3–10) Parallel digital output bus D1 = LSB, D8 = MSB; CMOS-compatible levels (VDDD/DGND referenced); high-impedance when OE = high.
ANALOG IN (Pin 19) Analog signal input Single-ended input referenced to AGND; requires ≤10 Ω source impedance within analog bandwidth for optimal SFDR.
REFB / REFT (Pins 23 / 17) Reference voltage terminals Define 2-V full-scale span via internal resistor divider; REFT ≈ 2.29 V, REFB ≈ 0.61 V at 25°C when configured per Figure 3.
VDDA / VDDD (Pins 14,15,18 / 11,13) Analog & digital supply rails Separate 5-V supplies decoupled independently-critical for >43 dB SNR; AGND/DGND tied internally but must share low-noise ground plane.

Key Features

Feature Design Value
Internal reference resistor network Eliminates need for external precision resistors or voltage references-reduces BOM count and layout area for 2-V video applications.
2.5-clock-cycle data latency Enables deterministic timing alignment in synchronous video pipelines-simplifies FIFO depth calculation and frame sync logic.
Tri-state parallel outputs Allows direct connection to shared microprocessor or FPGA data buses without glue logic or bus transceivers.
14-MHz analog input bandwidth Supports digitization of NTSC/PAL luminance and chrominance components without aliasing filters in many implementations.
30-ps aperture jitter Limits sampling uncertainty to <0.2% of 20-MSPS period-preserves SNR above 44 dB for 1-MHz input tones.

Applications

Digital Television Tuner Front-End Medical Ultrasound Beamformer Digitization

Use Scenario: Digitizing IF output from analog TV tuner ICs (e.g., TDA9886) prior to QAM demodulation and MPEG encoding.

IC Role / Device Role / Timing Role: High-speed parallel ADC capturing 4-MHz to 8-MHz IF signals with minimal group delay variation across channels.

Use Value: 2-V full-scale range matches tuner output swing; 20-MSPS rate satisfies 2× oversampling requirement for adjacent-channel rejection.

Use Scenario: Sampling echo return signals from phased-array transducers operating at 2–5 MHz center frequency.

IC Role / Device Role / Timing Role: Channel ADC in multi-channel receive beamformer ASIC interface, synchronized to master system clock.

Use Value: Low 30-ps aperture jitter preserves time-of-flight resolution; 14-MHz bandwidth captures fundamental and harmonic content.

Video Conferencing Capture Card QAM Demodulator Baseband Interface

Use Scenario: Capturing composite or S-video signals from camera modules in USB3.0-based conferencing hardware.

IC Role / Device Role / Timing Role: Real-time digitizer feeding FPGA-based Y/C separation and motion-compensated compression engines.

Use Value: Parallel D1–D8 outputs feed FPGA I/O banks directly; OE pin enables burst-mode acquisition aligned to USB frame boundaries.

Use Scenario: Converting analog baseband I/Q outputs from RF demodulators (e.g., MAX2112) into digital streams for DSP-based symbol recovery.

IC Role / Device Role / Timing Role: Dual-channel ADC interface (I and Q paths) with matched gain/offset for coherent demodulation.

Use Value: ±0.75 LSB INL ensures linear constellation mapping; 20-MSPS rate supports 8-MHz channel bandwidth in 64-QAM systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed video ADC applications.

Alternative Part Technical Difference Application Difference Selection Advice
AD9280ARSZ 8-bit, 32 MSPS, 3-V supply, no internal reference; requires external 2-V reference and separate analog/digital supplies. Better speed but higher system complexity; suited for 3.3-V FPGA interfaces where 20-MSPS is insufficient. Select AD9280ARSZ only if >20 MSPS throughput or 3.3-V compatibility is mandatory; adds reference design overhead.
MAX1186EEE+ 8-bit, 20 MSPS, 3-V supply, integrated 2.048-V reference, serial LVDS output (not parallel). Lower power (85 mW) but incompatible pinout and interface; requires deserialization logic and level translation. Choose MAX1186EEE+ for space-constrained, low-power portable video recorders-only with redesign for serial interface and 3-V rail.

Compared with TLC5510INSR-A, AD9280ARSZ offers higher speed but increases BOM and layout complexity due to external reference and dual-supply requirements, while MAX1186EEE+ reduces power and size at the cost of interface compatibility and added FPGA logic for LVDS deserialization.

Availability

TLC5510INSR-A is available at Aetrix Electronics and suitable for digital television tuners, medical ultrasound receivers, video conferencing capture cards, and QAM demodulator baseband interfaces requiring stable component supply across extended production lifecycles.

Supply support for TLC5510INSR-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in precision data converters and high-speed interface solutions.

The TLC5510 product line was designed specifically for cost-sensitive, high-volume video digitization applications-including broadcast equipment, medical imaging, and communications infrastructure-where 20-MSPS parallel ADC performance meets NTSC/PAL timing constraints.

FAQ

What is the full-scale input voltage range of the TLC5510INSR-A?

The TLC5510INSR-A has a nominal 2-V full-scale input range, achieved using its internal 3-resistor divider (320 Ω / 270 Ω / 80 Ω) between VDDA and AGND. When REFTS is shorted to REFT and REFBS to REFB per TI's Figure 3, the device generates a self-contained 2-V reference span-no external reference IC or resistors required. This matches standard video signal levels and simplifies front-end design for TLC5510INSR-A-based systems.

Does the TLC5510INSR-A require separate analog and digital ground connections?

Yes-the TLC5510INSR-A has dedicated AGND (pins 20, 21) and DGND (pins 2, 24) terminals, though they are connected internally. TI's datasheet mandates physically separate analog and digital ground planes on the PCB, with AGND and DGND tied at a single low-impedance point near the device. This prevents digital switching noise from modulating the analog input path and is essential to achieve the specified 44 dB SNR and 43 dB SFDR for the TLC5510INSR-A.

What is the latency from clock edge to valid digital output on the TLC5510INSR-A?

The TLC5510INSR-A exhibits a fixed 2.5-clock-cycle latency from the falling edge of CLK (analog sampling instant) to valid D1–D8 output. As confirmed in the functional timing diagram (Figure 2) and electrical characteristics table, this deterministic delay enables precise synchronization in pipelined video processors and FPGA-based capture engines. For a 20-MHz clock, the latency is 125 ns-critical for aligning pixel data with horizontal sync in TLC5510INSR-A-based digital TV systems.

Can the TLC5510INSR-A operate with a 3.3-V digital supply?

No-the TLC5510INSR-A requires VDDD between 4.75 V and 5.25 V per its recommended operating conditions. Its digital outputs (D1–D8, OE, CLK) are CMOS-compatible with 5-V rails only; applying 3.3 V to VDDD violates absolute maximum ratings and risks undefined logic states or latch-up. To interface with 3.3-V FPGAs or processors, level-shifting buffers (e.g., SN74AVC4T245) must be used-TI does not support native 3.3-V operation for the TLC5510INSR-A.

Is the TLC5510INSR-A pin-compatible with the TLC5510A variant?

No-the TLC5510INSR-A (2-V full-scale) and TLC5510AINS (4-V full-scale) share identical pinout and package (SOIC-24), but their reference configurations differ fundamentally: TLC5510INSR-A uses all three internal resistors with REFTS↔REFT and REFBS↔REFB shorts, while TLC5510AINS grounds REFB and applies 4 V to REFT. Swapping them without modifying external jumpers will cause severe gain error. The TLC5510INSR-A is not a drop-in replacement for TLC5510AINS in 4-V applications.

TLC5510INSR-A Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Number of Bits:
-
Sampling Rate (Per Second):
-
Number of Inputs:
-
Input Type:
-
Data Interface:
-
Configuration:
-
Ratio - S/H:ADC:
-
Number of A/D Converters:
-
Architecture:
-
Reference Type:
-
Voltage - Supply, Analog:
-
Voltage - Supply, Digital:
-
Features:
-
Operating Temperature:
-
Supplier Device Package:
-
Mounting Type:
-
Grade:
-
Qualification:
-

TLC5510INSR-A FAQ

1.How can I place an order for TLC5510INSR-A through Aetrix?

Please submit a Request for Quotation (RFQ) for TLC5510INSR-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLC5510INSR-A reliable?

The price and inventory of TLC5510INSR-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLC5510INSR-A is usually 5 days.

3.What payment methods are accepted for TLC5510INSR-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLC5510INSR-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLC5510INSR-A?

TLC5510INSR-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLC5510INSR-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLC5510INSR-A?

For technical support, including TLC5510INSR-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLC5510INSR-A requirements.

6.How does Aetrix verify that TLC5510INSR-A is sourced from the original manufacturer or authorized distributors?

All TLC5510INSR-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLC5510INSR-A meets industry standards.

7.What is the process for return or replacement of TLC5510INSR-A?

All TLC5510INSR-A units undergo pre-shipment inspection (PSI). If there is an issue with TLC5510INSR-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLC5510INSR-A part is unused and in its original packaging.

Return procedure for TLC5510INSR-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLC5510INSR-A Tags

  • TLC5510INSR-A
  • TLC5510INSR-A PDF
  • TLC5510INSR-A Datasheet
  • TLC5510INSR-A Specifications
  • TLC5510INSR-A Images
  • Texas Instruments
  • Texas Instruments TLC5510INSR-A
  • Buy TLC5510INSR-A
  • TLC5510INSR-A Price
  • TLC5510INSR-A Distributor
  • TLC5510INSR-A Supplier
  • TLC5510INSR-A Wholesale
Related Products
ADC081C021CIMKX/NOPB
ADC081C021CIMKX/NOPB

Texas Instruments

MCP3021A5T-E/OT
MCP3021A5T-E/OT

Microchip Technology

TLA2024IRUGR
TLA2024IRUGR

Texas Instruments

MCP3221A5T-E/OT
MCP3221A5T-E/OT

Microchip Technology

MCP3221A5T-I/OT
MCP3221A5T-I/OT

Microchip Technology

MCP3221A4T-E/OT
MCP3221A4T-E/OT

Microchip Technology

MCP3221A6T-E/OT
MCP3221A6T-E/OT

Microchip Technology

MCP3221A0T-E/OT
MCP3221A0T-E/OT

Microchip Technology

MCP3221A1T-E/OT
MCP3221A1T-E/OT

Microchip Technology

ADC121S021CIMFX/NOPB
ADC121S021CIMFX/NOPB

Texas Instruments

MCP3001-I/MS
MCP3001-I/MS

Microchip Technology

MCP3001-I/SN
MCP3001-I/SN

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER