Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TLC5540INSR

Part No.:
TLC5540INSR
Manufacturer:
Texas Instruments
Category:
Analog to Digital Converters (ADC)
Package:
24-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixTLC5540INSR.pdf
Description:
IC ADC 8BIT FLASH 24SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:213

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TLC5540INSR from Texas Instruments is a high-speed, 8-bit analog-to-digital converter (ADC) using a modified semi-flash architecture to achieve up to 40 MSPS conversion rate with ±0.3 LSB typical differential linearity and 75 MHz analog input bandwidth. It operates from a single 5-V supply, integrates internal reference voltage generators for 2-V full-scale operation, and features output enable (OE) for high-impedance digital outputs - ideal for undersampling in digital TV front ends.

For engineers reviewing the TLC5540INSR datasheet, TLC5540INSR pinout, TLC5540INSR application, or TLC5540INSR equivalent, key selection considerations include its industrial temperature range (−40°C to +85°C), SOP-24 package, 40 MSPS maximum sampling rate, and compatibility with quadrature demodulation signal chains requiring low aperture jitter (30 ps) and high ENOB at IF frequencies.

Technical Context

The TLC5540INSR employs a time-interleaved semi-flash architecture with separate upper and lower comparator blocks: the four MSBs are generated on each clock's falling edge, while the four LSBs alternate between two lower comparator banks on successive clock cycles - doubling effective sampling time per LSB block and enabling 40 MSPS without increasing comparator count. This architecture reduces power versus full-flash designs while maintaining speed.

It supports flexible reference configuration via REFT/REFB and REFBS/REFTS terminals, allowing either externally driven references or internal resistor-divider biasing (e.g., 2.63 V top / 0.61 V bottom for 2.02 V full-scale). Analog input uses chopper-stabilized sampling with <100 Ω recommended source impedance, and digital outputs are CMOS-compatible with programmable high-impedance state controlled by OE.

Key Specifications

ParameterValue and Actual Design Meaning
Resolution8-bit - delivers 256 discrete digital codes for baseband or IF digitization in communication receivers.
Max Conversion Rate40 MSPS - enables direct sampling of IF signals up to ~20 MHz (Nyquist) or undersampling of higher-frequency carriers (e.g., QAM in cable TV).
Differential Linearity Error±0.3 LSB (typ) - ensures monotonicity and minimal code-width variation critical for distortion-sensitive demodulators.
Analog Input Bandwidth≥75 MHz (typ) - supports wideband signal acquisition without external anti-alias filtering for undersampling applications.
Supply Voltage4.75 V to 5.25 V - single 5-V rail simplifies power design and matches standard logic supplies.
Power Consumption85 mW (typ) at 40 MSPS - low active power enables dense ADC arrays in video or telecom front ends.
Aperture Jitter30 ps (typ) - limits SNR degradation at high input frequencies (e.g., >10 MHz), preserving ENOB ≥7 bits at 20 MSPS.

Pinout & Package

SOP-24 (NS) package: 300-mil wide body, 1.27 mm lead pitch, RoHS-compliant NiPdAu finish, MSL Level-1 (unlimited floor life), rated for −40°C to +85°C operation.

Pin/TerminalCircuit RoleDesign Meaning
OE (Pin 1)Output Enable control inputActive-low signal placing D1–D8 in high-impedance state - enables shared bus interfacing or multi-ADC synchronization.
CLK (Pin 12)Sampling clock inputFalling-edge-triggered master clock; timing-critical path requiring controlled-impedance routing and low-jitter sources.
D1–D8 (Pins 3–10)Digital data outputsLSB-to-MSB parallel CMOS outputs; D1 = Pin 3 (LSB), D8 = Pin 10 (MSB); support 25 pF load per spec.
ANALOG IN (Pin 19)Analog signal inputDifferential-capable single-ended input; requires <100 Ω source impedance and proper AGND return to minimize noise coupling.
REFB / REFT (Pins 23 / 17)Reference voltage inputsDefine full-scale range (VI(REFT) − VI(REFB)); support internal 2.02 V divider or external precision references.
VDDA / VDDD (Pins 14,15,18 / 11,13)Analog & digital supply railsSeparate 5-V supplies decoupled independently - essential to isolate analog switching noise from digital switching transients.
AGND / DGND (Pins 20,21 / 2,24)Analog & digital ground returnsMust be connected to a common low-impedance ground plane at a single point near the device to prevent ground loops.

Key Features

FeatureDesign Value
Internal Reference DividerOn-chip 3-resistor network (320 Ω / 270 Ω / 80 Ω) generates stable 2.63 V / 0.61 V reference pair from VDDA - eliminates two external resistors and improves thermal tracking.
Output Enable (OE)Hardware-controlled tri-state function allows dynamic bus sharing without external latches or buffers - reduces BOM and layout complexity.
Chopper-Stabilized InputReduces offset drift and 1/f noise, enabling accurate DC-coupled acquisition and stable performance across temperature (ENOB varies <0.2 bits from −40°C to +85°C).
High-Speed Semi-Flash CoreTime-interleaved MSB/LSB conversion achieves 40 MSPS with only 30% fewer comparators than conventional semi-flash - balances speed, power, and silicon area.
Industrial Temperature RangeSpecified from −40°C to +85°C (TLC5540I grade) - qualified for deployment in set-top boxes, base stations, and industrial imaging systems.

Applications

Digital Television Front EndQAM/QPSK Demodulator

Use Scenario: Digitizing 36–42 MHz IF signals from terrestrial/cable TV tuners prior to digital downconversion and symbol decoding.

IC Role / Device Role / Timing Role: High-speed ADC capturing real/imaginary channel pairs with minimal group delay variation and aperture jitter.

Use Value: 75 MHz analog bandwidth and 40 MSPS rate enable direct IF sampling; ±0.3 LSB DNL preserves constellation fidelity in 256-QAM.

Use Scenario: Converting baseband I/Q signals in software-defined radio receivers for cable modems or DOCSIS 3.1 gateways.

IC Role / Device Role / Timing Role: Simultaneous dual-channel sampling (using two TLC5540INSR devices) synchronized via shared CLK/OE for coherent demodulation.

Use Value: Low 30 ps aperture jitter maintains EVM < 3% at 64-QAM; internal reference eliminates external DAC dependency.

CCD Scanner InterfaceDigital Set-Top Box

Use Scenario: Digitizing analog video output from linear CCD image sensors in industrial inspection or document scanning systems.

IC Role / Device Role / Timing Role: High-fidelity pixel-level sampling at line rates up to 20 MSPS, with precise timing alignment between pixel clock and OE.

Use Value: 85 mW power enables compact thermal design; 7.64-bit ENOB at 1 MHz input ensures >60 dB SNR for grayscale fidelity.

Use Scenario: Receiving and digitizing RF-modulated analog video/audio in legacy STB designs transitioning to hybrid digital platforms.

IC Role / Device Role / Timing Role: ADC stage in analog tuner signal chain, feeding MPEG-2 encoder with NTSC/PAL-compliant timing.

Use Value: Differential gain/phase specs (1%/0.7°) meet broadcast video standards; 5-V single supply simplifies legacy board redesign.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed 8-bit ADC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ADS820UPin-compatible 8-bit, 40 MSPS ADC with 1.5 LSB max DNL and no integrated reference - requires external REF02 or similar.Higher DNL tolerance; lacks internal resistor divider - increases BOM and layout sensitivity to reference noise.Choose when external precision reference is already present and tighter production yield control over DNL is acceptable.
MAX1186ECM+8-bit, 40 MSPS, but uses pipeline architecture; 2.5 V supply only; no OE pin; 45 mW typical power.Lower power and smaller TQFP-48 package, but incompatible supply voltage and missing tri-state output capability.Prefer for space-constrained, low-power embedded systems where bus sharing is not required and 2.5 V infrastructure exists.

Compared with ADS820U and MAX1186ECM+, the TLC5540INSR uniquely combines internal 2-V reference generation, OE-controlled tri-state outputs, and industrial-grade temperature rating in SOP-24 - making it optimal for cost-sensitive, high-volume video and communications front ends requiring minimal external components and robust layout tolerance.

Availability

TLC5540INSR is available at Aetrix Electronics and suitable for digital television front ends, QAM demodulators, CCD scanner interfaces, and digital set-top box designs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLC5540INSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-performance signal chain solutions, with decades of expertise in data converters and interface ICs.

The TLC5540INSR belongs to TI's high-speed precision ADC product line, engineered specifically for cost-sensitive, high-bandwidth applications in broadcast video, communications infrastructure, and industrial imaging where 8-bit resolution and 40 MSPS throughput deliver optimal balance of speed, accuracy, and power efficiency.

FAQ

What is the operating temperature range for the TLC5540INSR?

The TLC5540INSR is rated for industrial operation from −40°C to +85°C. This specification is confirmed in the "Recommended Operating Conditions" table (page 4) and "Package Option Addendum" (page 11), where TLC5540INSR is explicitly listed under the TLC5540I grade. The device undergoes qualification testing across this full range, ensuring parameter stability including ENOB, SNR, and DNL.

Does the TLC5540INSR require an external reference voltage?

No - the TLC5540INSR includes internal resistors (320 Ω / 270 Ω / 80 Ω) to generate nominal 2.63 V (REFT) and 0.61 V (REFB) from VDDA, yielding a 2.02 V full-scale range. As shown in Figure 14 and Table 1, connecting REFT to REFTS and REFB to REFBS enables this self-bias mode, eliminating external reference components for many video and comms applications.

What package type and dimensions does the TLC5540INSR use?

The TLC5540INSR uses the SOP-24 (NS) package: 300-mil body width, 1.27 mm lead pitch, 7.9 mm × 4.5 mm footprint, and 1.2 mm max height. Package drawings (PW0024A) and tape-and-reel data (2000 pcs/reel, 24.4 mm reel width, Q1 pin-1 quadrant) are documented in TI's Package Materials Information (pages 10–11).

How does the TLC5540INSR achieve 40 MSPS with low power consumption?

The TLC5540INSR achieves 40 MSPS at just 85 mW via its modified semi-flash architecture: upper and lower comparator blocks operate interleaved across three clock phases, reducing total comparator count by ~30% versus conventional semi-flash. This minimizes dynamic current while maintaining speed - verified by power vs. sampling frequency curves (Figure 3) showing 85 mW at 40 MSPS and <50 mW at 20 MSPS.

Can the digital outputs of the TLC5540INSR be placed in high-impedance state?

Yes - the TLC5540INSR features an active-low Output Enable (OE) pin (Pin 1). When OE is high, all eight digital outputs (D1–D8) enter a high-impedance state, as specified in the Terminal Functions table (page 3) and electrical characteristics (IOZH/IOZL leakage currents ≤16 µA). This enables direct connection to shared data buses without external buffers.

TLC5540INSR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
24-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Number of Bits:
8
Sampling Rate (Per Second):
40M
Number of Inputs:
1
Input Type:
Single Ended
Data Interface:
Parallel
Configuration:
S/H-ADC
Ratio - S/H:ADC:
1:1
Number of A/D Converters:
1
Architecture:
Flash
Reference Type:
External
Voltage - Supply, Analog:
5V
Voltage - Supply, Digital:
5V
Features:
-
Operating Temperature:
-40°C ~ 85°C
Supplier Device Package:
24-SO
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-

TLC5540INSR FAQ

1.How can I place an order for TLC5540INSR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLC5540INSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLC5540INSR reliable?

The price and inventory of TLC5540INSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLC5540INSR is usually 5 days.

3.What payment methods are accepted for TLC5540INSR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLC5540INSR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLC5540INSR?

TLC5540INSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLC5540INSR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLC5540INSR?

For technical support, including TLC5540INSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLC5540INSR requirements.

6.How does Aetrix verify that TLC5540INSR is sourced from the original manufacturer or authorized distributors?

All TLC5540INSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLC5540INSR meets industry standards.

7.What is the process for return or replacement of TLC5540INSR?

All TLC5540INSR units undergo pre-shipment inspection (PSI). If there is an issue with TLC5540INSR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLC5540INSR part is unused and in its original packaging.

Return procedure for TLC5540INSR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLC5540INSR Tags

  • TLC5540INSR
  • TLC5540INSR PDF
  • TLC5540INSR Datasheet
  • TLC5540INSR Specifications
  • TLC5540INSR Images
  • Texas Instruments
  • Texas Instruments TLC5540INSR
  • Buy TLC5540INSR
  • TLC5540INSR Price
  • TLC5540INSR Distributor
  • TLC5540INSR Supplier
  • TLC5540INSR Wholesale
Related Products
ADC081C021CIMKX/NOPB
ADC081C021CIMKX/NOPB

Texas Instruments

MCP3021A5T-E/OT
MCP3021A5T-E/OT

Microchip Technology

TLA2024IRUGR
TLA2024IRUGR

Texas Instruments

MCP3221A5T-E/OT
MCP3221A5T-E/OT

Microchip Technology

MCP3221A5T-I/OT
MCP3221A5T-I/OT

Microchip Technology

MCP3221A4T-E/OT
MCP3221A4T-E/OT

Microchip Technology

MCP3221A6T-E/OT
MCP3221A6T-E/OT

Microchip Technology

MCP3221A0T-E/OT
MCP3221A0T-E/OT

Microchip Technology

MCP3221A1T-E/OT
MCP3221A1T-E/OT

Microchip Technology

ADC121S021CIMFX/NOPB
ADC121S021CIMFX/NOPB

Texas Instruments

MCP3001-I/MS
MCP3001-I/MS

Microchip Technology

MCP3001-I/SN
MCP3001-I/SN

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER