Infineon Technologies TLD1314ELXUMA1

Overview

TLD1314ELXUMA1 from Infineon Technologies is a 3-channel high-side LED current source IC for automotive exterior and interior lighting. It delivers up to 120 mA per channel with ±7% output current accuracy at RSET = 12 kΩ, operates from 5.5 V to 40 V supply, and integrates open-load and short-to-GND diagnosis. It drives red LED chains (e.g., 3 LEDs × 3 channels) in tail/brake lights under thermal constraints.

For engineers reviewing the TLD1314ELXUMA1 datasheet, TLD1314ELXUMA1 pinout, TLD1314ELXUMA1 application, or TLD1314ELXUMA1 equivalent, key selection factors include channel count, high-side current sourcing capability, integrated diagnostics (DEN-controlled), thermal derating behavior, and PG-SSOP-14 exposed-pad thermal performance in automotive ambient lighting and brake light modules.

Technical Context

The TLD1314ELXUMA1 implements three independent high-side current-regulated outputs using internal power stages with adjustable setpoint via external RSET resistor. Each channel maintains load-independent current regulation across supply variations from 5.5 V to 40 V.

Diagnosis is enabled via DEN pin voltage threshold (VDEN(act)), triggering open-load and short-to-GND detection reported on ST pin. Thermal protection activates at junction temperature >150°C, and undervoltage lockout engages below 5 V VS.

Key Specifications

Pinout & Package

Package: PG-SSOP-14 with exposed thermal pad (EP), lead pitch 0.65 mm, body size 5.0 mm × 6.0 mm × 1.45 mm. Exposed pad must be connected to GND for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side LED driver applications.

Compared with ASL3416SHN and TLD1114EL, the TLD1314ELXUMA1 uniquely balances standalone operation, integrated diagnosis reporting on ST, and 120 mA capability in PG-SSOP-14 - making it optimal for cost-sensitive, ECU-monitored automotive lighting where SPI complexity is unnecessary.

Availability

TLD1314ELXUMA1 is available at Aetrix Electronics and suitable for rear combination lamps, dashboard ambient lighting, side marker modules, and interior dome light control requiring stable component supply across automotive production cycles.

Supply support for TLD1314ELXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and sensor solutions with global automotive qualification standards.

The LITIX™Basic product line delivers robust, AEC-Q100-qualified LED drivers for cost-sensitive automotive lighting, emphasizing integration, thermal resilience, and diagnostic readiness without MCU dependency.

FAQ

What is the minimum supply voltage required for normal operation?

The TLD1314ELXUMA1 requires a minimum supply voltage of 5.5 V for functional operation. Below this, undervoltage lockout disables outputs. The power-on reset threshold is 5 V at RSET = 12 kΩ with 80% nominal current and 2.5 V output voltage, ensuring reliable startup across cold-cranking conditions.

How is output current adjusted, and what resistor value sets 60 mA?

Output current is set by connecting an external resistor (RSET) between IN_SET and GND. At RSET = 12 kΩ, nominal output current is 60 mA per channel under 8–18 V supply. The relationship is approximately IOUT = 9 V / RSET, so 60 mA corresponds to RSET ≈ 150 Ω - but actual design uses 12 kΩ due to internal scaling; see Table 1 for exact calibration.

Can the ST pin report faults for individual channels separately?

No. The ST pin provides a combined open-drain status signal indicating any active fault (open-load or short-to-GND) across all three channels when DEN is asserted. It does not distinguish which channel is faulty; system-level firmware must perform sequential channel disablement to isolate the failing output.

Is the exposed thermal pad electrically isolated or connected internally?

The exposed pad (EP) is internally connected to GND and must be soldered to a PCB ground plane. It serves both thermal dissipation (RthJC = 8–10 K/W) and electrical grounding. Leaving it unconnected degrades thermal performance and may cause instability or premature thermal shutdown under load.