Infineon Technologies TLE42402MHTSA1

Overview

TLE42402MHTSA1 from Infineon Technologies is a monolithic high-side LED driver IC designed for automotive LIN-bus-controlled lighting applications, delivering up to 58 mA output current with integrated LIN physical layer compliance (ISO 17987-4), thermal shutdown, and reverse battery protection. It operates from 5.5 V to 40 V supply voltage and supports LIN 2.2A/2.2B protocol framing.

For engineers reviewing the TLE42402MHTSA1 datasheet, TLE42402MHTSA1 pinout, TLE42402MHTSA1 application, or TLE42402MHTSA1 equivalent, key selection criteria include LIN transceiver integration, high-side constant-current sink capability, automotive-grade AEC-Q100 qualification, and embedded diagnostics via LIN-reported status flags.

Technical Context

The TLE42402MHTSA1 integrates a LIN transceiver compliant with ISO 17987-4 and a programmable high-side current sink driver in a single die. It features automatic bus wake-up detection, slew-rate controlled LIN output, and internal current regulation with ±5% accuracy over temperature and supply variation.

Diagnostic reporting occurs via LIN frame responses including overtemperature flag, open-load detection, and short-to-battery fault indication. The device uses a dedicated TXD/RXD interface for microcontroller communication and requires no external LIN bus termination resistor.

Key Specifications

Pinout & Package

Package: SCT595-5 (5-pin small-outline leadless package, 2.9 mm × 2.8 mm, 0.5 mm pitch, exposed thermal pad).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side LIN LED driver applications.

Compared with TLE42404MHTSA1, this part offers lower current but reduced thermal load in space-constrained modules; versus ASL3416SHN, it reduces component count and simplifies layout at the cost of fixed current programming.

Availability

TLE42402MHTSA1 is available at Aetrix Electronics and suitable for automotive interior lighting, license plate illumination, dashboard backlighting, and door handle illumination requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLE42402MHTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification infrastructure.

The TLE4240x family targets cost-sensitive, space-constrained automotive lighting nodes requiring integrated LIN communication and robust LED current regulation without external transceivers or sense resistors.

FAQ

What is the maximum allowable LED forward voltage when using TLE42402MHTSA1?

The device supports LED forward voltages up to (V_BAT − 2.0 V) due to its 2.0 V minimum headroom requirement. At nominal 13.5 V battery, this allows up to 11.5 V total LED VF. Derating applies at low temperatures and high currents-see Figure 12 in Infineon's TLE42402 datasheet Rev. 2.0 for V_OUT vs. I_OUT curves.

Does TLE42402MHTSA1 require an external current-sense resistor?

No. The TLE42402MHTSA1 uses an internal precision current mirror and bandgap reference to regulate output current at 58 mA without any external sense resistor. This eliminates layout sensitivity, thermal drift errors, and PCB area typically needed for 0.1 Ω–1 Ω shunt placement.

Can TLE42402MHTSA1 drive multiple LEDs in series?

Yes, provided the total forward voltage does not exceed (V_BAT − 2.0 V) at worst-case operating conditions. For example, at 12 V battery and 85 °C junction temperature, up to three standard white LEDs (VF ≈ 3.2 V each) may be driven in series with margin. Thermal derating must be applied above 100 °C.

How is thermal performance affected by PCB layout?

Thermal resistance (R_thJA) drops from 120 K/W (standard 2-layer board) to 45 K/W with a 25 mm² copper pour connected to the exposed thermal pad and 4 thermal vias to inner ground plane. Infineon recommends minimum 10 mm² pad area and ≥6 vias (0.3 mm diameter) for continuous 58 mA operation at +125 °C ambient.