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Infineon Technologies TLE5012BDE1200XUMA1
- Part No.:
- TLE5012BDE1200XUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Angle, Linear Position Measuring
- Package:
- 16-TSSOP (0.154", 3.90mm Width)
- Datasheet:
-
TLE5012BDE1200XUMA1.pdf
- Description:
- SPEED SENSORS 16TDSO
- Quantity:
- Payment:
- Shipping:
Inventory:4,309
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Product details
Overview
TLE5012BDE1200XUMA1 from Infineon is a dual-die GMR-based 360° angle sensor with integrated magnetic field sensing, 15-bit absolute angle resolution (0.01°), ±1.0° max angle error over lifetime and temperature with auto-calibration enabled, and redundant dual-sensor architecture for functional safety. It delivers sine/cosine outputs via two independent SSC interfaces and supports automotive EPS, steering angle measurement, and motor commutation.
For engineers reviewing the TLE5012BDE1200XUMA1 datasheet, TLE5012BDE1200XUMA1 pinout, TLE5012BDE1200XUMA1 application, or TLE5012BDE1200XUMA1 equivalent, this page provides verified technical context, interface configuration details, dual-die synchronization behavior, SIL-compliant diagnostic coverage, and pre-configured IIF-mode operation per ordering code E1200.
Technical Context
The TLE5012BDE1200XUMA1 integrates two physically flipped GMR sensor dies in one PG-TDSO-16 package, enabling differential angle output for ASIL-B/D compliance; each die features independent 15-bit SD-ADCs and CORDIC-based angle computation. Its dual-die architecture inherently produces opposite rotation direction outputs unless corrected via ANG_DIR register configuration.
It supports five concurrent interfaces-SSC (SPI-compatible, up to 8 Mbit/s), PWM, SPC (SENT-based), IIF (incremental A/B/IDX), and HSM-with programmable push-pull/open-drain output drivers and built-in 8-bit CRC (SSC) and 4-bit CRC nibble (SPC) for data integrity. Startup BIST covers ISM, CORDIC, CCU, and ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Angle Resolution | 15-bit absolute angle (0.01° step size), enabling high-precision rotor position tracking in BLDC motors |
| Angle Accuracy | Max ±1.0° total error over -40°C to 150°C junction temp with auto-calibration active |
| Interface Speed | SSC up to 8 Mbit/s - supports real-time closed-loop control loop timing in EPS systems |
| Output Configuration | Programmable push-pull or open-drain on all IFA/IFB/IFC pins, enabling direct connection to MCU GPIO or legacy Hall inputs |
| Functional Safety | SIL-compliant diagnostics including CRC, BIST, over/undervoltage detection, and dual-die cross-check capability |
| Operating Temp | -40°C to +150°C junction temperature, qualified per AEC-Q100 Grade 1 for under-hood automotive use |
| ESD Robustness | ±4 kV HBM - ensures reliability during PCB handling and system integration |
Pinout & Package
Package: PG-TDSO-16 (16-pin thermally enhanced thin dual small outline package, lead-free, halogen-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 8 | IFC1 / IFC2 | Dual-die index/clock input or Hall switch signal 3 - configurable per die for synchronized startup or multi-sensor daisy-chaining |
| 2, 7 | SCK1 / SCK2 | Independent SSC clock inputs - enables simultaneous or staggered readout of both sensor dies |
| 3, 6 | CSQ1 / CSQ2 | Separate chip select lines - allows individual addressing of each die without bus arbitration overhead |
| 4, 5 | DATA1 / DATA2 | Bidirectional SSC data lines - supports full-duplex communication with independent status/error reporting per die |
| 9, 16 | IFB1 / IFB2 | Incremental Phase B outputs - deliver quadrature signals for legacy resolver replacement or low-latency speed estimation |
| 12, 13 | IFA1 / IFA2 | Multi-function outputs (IIF_A / PWM / SPC / HS1) - selectable per die for mixed-interface system integration |
| 10, 11, 14, 15 | GND2 / VDD2 / VDD1 / GND1 | Separated power/ground domains per die - minimizes crosstalk and supports independent supply sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Fully redundant dual-die architecture | Two physically flipped GMR sensor elements enable hardware-level fault detection and ASIL-D capable system design |
| Pre-calibrated laser-fuse storage | Factory-trimmed calibration parameters stored in non-volatile fuses - eliminates field calibration effort and ensures first-power-up accuracy |
| Configurable interface modes | SSC, PWM, SPC, IIF, and HSM can operate simultaneously or independently - simplifies migration from legacy Hall/resolver systems |
| On-chip self-test (BIST) | Automated startup validation of ISM, CORDIC, CCU, and ADC blocks - meets ISO 26262 diagnostic coverage requirements |
| Temperature-stable auto-calibration | Runtime compensation for thermal drift and aging effects - maintains ±1.0° accuracy across full automotive temperature range |
Applications
| Electric Power Steering (EPS) | Steering Column Angle Sensing |
|---|---|
Use Scenario: Real-time rotor position feedback for field-oriented control of 3-phase BLDC assist motor in column-assist EPS systems. IC Role / Device Role / Timing Role: Primary angle sensor providing 15-bit absolute position and 16-bit sine/cosine outputs at ≤100 µs latency via SSC interface. Use Value: Enables precise torque vectoring and smooth assist response while meeting ASIL-C requirements through dual-die cross-validation. | Use Scenario: Direct mounting on steering column shaft to measure absolute steering wheel angle for ADAS lane-keeping and automated parking functions. IC Role / Device Role / Timing Role: Redundant angle source delivering synchronized IIF quadrature and SPC-coded absolute angle to domain controller. Use Value: Provides fail-operational capability via dual-die disagreement detection and seamless fallback to incremental mode during SSC interruption. |
| Brake-by-Wire Actuator | Throttle Valve Position Sensing |
Use Scenario: Monitoring linear-to-rotary conversion mechanism in electro-hydraulic brake actuators requiring high-reliability angular feedback. IC Role / Device Role / Timing Role: Safety-critical angle transducer supplying dual-channel SSC data with 8-bit CRC and diagnostic status flags to brake ECU. Use Value: Supports ISO 26262 ASIL-D decomposition by delivering independent, time-correlated angle streams from physically separated dies. | Use Scenario: Closed-loop position control of electronic throttle body butterfly valve in gasoline direct injection engines. IC Role / Device Role / Timing Role: High-resolution angle sensor operating in PWM mode for deterministic low-latency feedback to engine control unit. Use Value: Achieves <±0.2° linearity error across 0–100% throttle travel using factory-calibrated GMR elements and on-chip CORDIC computation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar GMR-based angle sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AMS AS5055A | Single-die GMR sensor; 14-bit resolution; no dual-die redundancy; SPI-only interface | Lacks built-in SIL diagnostics, BIST, and dual-output capability - suitable for non-safety-critical consumer or industrial uses | Select when cost sensitivity outweighs ASIL requirements and single-channel operation suffices |
| TDK-Micronas HAL3900 | Single-die Hall-based sensor; 12-bit resolution; supports SENT/SPC only; no SSC or IIF | Lower accuracy (±1.5°), no auto-calibration, limited interface flexibility - targets cost-optimized throttle/valve applications | Choose for legacy SENT-based ECUs where GMR-level precision and safety features are not mandated |
Compared with AMS AS5055A and HAL3900, the TLE5012BDE1200XUMA1 uniquely delivers dual-die functional safety, 15-bit resolution with auto-calibration, and five interoperable interfaces - making it the only option qualified for ASIL-D decomposition in automotive steering and braking systems.
Availability
TLE5012BDE1200XUMA1 is available at Aetrix Electronics and suitable for Electric Power Steering (EPS), steering column angle sensing, and brake-by-wire actuator applications requiring stable component supply, long-term automotive lifecycle support, and traceable AEC-Q100 qualified inventory.
Supply support for TLE5012BDE1200XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and sensor solutions, with global R&D and manufacturing infrastructure.
The TLE5012BD belongs to Infineon's PRO-SIL™ functional safety sensor family, engineered specifically for ASIL-B to ASIL-D automotive subsystems requiring redundant angle measurement, real-time diagnostics, and robust magnetic field immunity.
FAQ
What interface modes are pre-configured in the TLE5012BDE1200XUMA1 ordering variant?
The E1200 suffix indicates factory pre-configuration for Incremental Interface (IIF) mode: IFA1/IFA2 and IFB1/IFB2 output quadrature signals (A/B phases), while IFC1/IFC2 provide index pulses. SSC remains accessible for configuration and diagnostics, but default operation is IIF with no external clock required.
How does the dual-die architecture improve functional safety compliance?
The top and bottom GMR dies are physically flipped, producing inherently opposite rotation-direction outputs. This enables hardware-level plausibility checking: disagreement beyond defined thresholds triggers diagnostic flags, satisfying ASIL-D fault detection requirements without software intervention or external comparators.
Can the TLE5012BDE1200XUMA1 operate with a 3.3 V supply?
Yes - it supports 3.0 V to 3.6 V operation with adjusted I/O thresholds (VL3 = 0.3×VDD, VH3 = 0.7–0.8×VDD) and reduced drive strength. Pull-up/pull-down currents scale accordingly, and all interfaces (SSC, PWM, SPC, IIF) remain fully functional within specified timing margins.
What is the role of laser-fused calibration parameters in system-level accuracy?
Laser-fused parameters store per-die offset, gain, and nonlinearity corrections applied during signal processing. These values are loaded into flip-flops at power-on, ensuring immediate 0.01° resolution and ±1.0° accuracy without host MCU involvement or runtime calibration routines.
TLE5012BDE1200XUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 16-TSSOP (0.154", 3.90mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- For Measuring:
- Angle
- Technology:
- Magnetoresistive
- Rotation Angle - Electrical, Mechanical:
- 0° ~ 360°, Continuous
- Linear Range:
- -
- Output:
- SENT, SPI
- Output Signal:
- Cosine, Sine
- Actuator Type:
- External Magnet, Not Included
- Linearity:
- -
- Resistance:
- -
- Resistance Tolerance:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Termination Style:
- Gull Wing
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- PG-TDSO-16
TLE5012BDE1200XUMA1 FAQ
1.How can I place an order for TLE5012BDE1200XUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE5012BDE1200XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE5012BDE1200XUMA1 reliable?
The price and inventory of TLE5012BDE1200XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE5012BDE1200XUMA1 is usually 5 days.
3.What payment methods are accepted for TLE5012BDE1200XUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE5012BDE1200XUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE5012BDE1200XUMA1?
TLE5012BDE1200XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE5012BDE1200XUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE5012BDE1200XUMA1?
For technical support, including TLE5012BDE1200XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE5012BDE1200XUMA1 requirements.
6.How does Aetrix verify that TLE5012BDE1200XUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE5012BDE1200XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE5012BDE1200XUMA1 meets industry standards.
7.What is the process for return or replacement of TLE5012BDE1200XUMA1?
All TLE5012BDE1200XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE5012BDE1200XUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE5012BDE1200XUMA1 part is unused and in its original packaging.
Return procedure for TLE5012BDE1200XUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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