Infineon Technologies TLE5014SP16DE0002XUMA1

Overview

TLE5014SP16DE0002XUMA1 from Infineon Technologies is a dual-die GMR-based absolute angle sensor in PG-TDSO-16 package, delivering two independent 15-bit angle outputs with ≤1° total error over -40°C to +125°C, EEPROM-configurable zero-angle offset, and ASIL-D compliance per ISO 26262 for automotive steering and e-axle position sensing.

For engineers reviewing the TLE5014SP16DE0002XUMA1 datasheet, TLE5014SP16DE0002XUMA1 pinout, TLE5014SP16DE0002XUMA1 application, or TLE5014SP16DE0002XUMA1 equivalent, this page provides verified functional safety architecture, dual-channel SSC interface timing, die-level redundancy mapping, and channel-specific pin assignment for safety-critical angular position systems.

Technical Context

The device integrates two galvanically decoupled GMR sensor dies in one PG-TDSO-16 package, with top and bottom dies physically flipped to yield opposite rotation direction outputs-enabling cross-checking for fault detection. Each channel supports independent SSC communication (up to 8 MHz), internal diagnostics (>97% coverage), and 32-point LUT-based angle error correction.

Configuration is stored in on-chip EEPROM (112-bit programmable ID, ANG_BASE register for polarity/offset tuning). The dual-die layout satisfies ASIL-D requirements via hardware redundancy, with thermal resistance RthJA = 100 K/W when both dies are active and MSL 3 reflow compatibility.

Key Specifications

Pinout & Package

Package: PG-TDSO-16 (Plastic Thin Dual Small Outline, 16-pin, lead-free, RoHS/halogen-free, MSL 3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel GMR angle sensor applications.

Compared with AS5055A-DSO and MR3301, the TLE5014SP16DE0002XUMA1 uniquely delivers certified ASIL-D dual-die redundancy, on-chip LUT correction, and fully independent SSC interfaces-enabling end-to-end safety without external components.

Availability

TLE5014SP16DE0002XUMA1 is available at Aetrix Electronics and suitable for electric power steering, electronic throttle control, and transmission gear position sensing requiring stable component supply, long-term automotive qualification, and full ASIL-D lifecycle support.

Supply support for TLE5014SP16DE0002XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and sensor solutions, with global manufacturing and automotive qualification infrastructure.

The TLE5014 product line targets high-integrity angular position sensing in ASIL-D automotive systems, integrating GMR sensing, dual-die redundancy, and functional safety mechanisms into single-package solutions.

FAQ

What is the purpose of the flipped orientation between the two sensor dies?

The bottom die is physically rotated 180° relative to the top die, causing opposite rotation-direction outputs under identical magnetic fields. This enables hardware-level cross-checking: consistent deviation between channels indicates magnetic interference or mechanical misalignment, while identical outputs suggest common-mode failure-critical for ASIL-D fault detection.

Can both channels share the same SSC bus lines?

No-each channel requires dedicated SCK, CSQ, and DATA lines (Pins 1–3 for Channel 1; Pins 14–16 for Channel 2) to maintain galvanic decoupling and independent fault containment. Sharing lines would violate ASIL-D independence requirements and disable simultaneous readout capability.

How is the 32-point LUT applied during operation?

The LUT is loaded from EEPROM at power-on and applied in real time to raw GMR sensor data before 15-bit angle encoding. It corrects systematic errors from magnetic circuit asymmetry or stray fields, using linear interpolation between stored points-no host MCU involvement required.

What does "IFB pin pull-up to VDD" mean for system design?

IFB-1 and IFB-2 must be externally pulled to their respective VDD rails (not shared) via ≥10 kΩ resistors. These pins serve as open-drain status flags: low indicates internal fault (e.g., memory CRC error), enabling immediate ECU shutdown without polling-reducing diagnostic latency to <100 µs.