Infineon Technologies TLE7185E

Overview

TLE7185E from Infineon Technologies is a 3-phase high- and low-side MOSFET bridge driver IC for automotive motor control, supporting 5.5–32 V supply, 0–95% high-side duty cycle, integrated charge pump for low-voltage operation, and analog-adjustable short-circuit protection. It drives six external N-channel MOSFETs in cooling fans, water pumps, and electric power steering systems.

For engineers reviewing the TLE7185E datasheet, TLE7185E pinout, TLE7185E application, or TLE7185E equivalent, key selection criteria include bootstrap-capacitor-based high-side gate drive capability, shoot-through protection with adjustable dead time, open-drain ERRx diagnostic outputs, and AEC-Q100 qualification for under-hood automotive use.

Technical Context

The TLE7185E integrates six independent floating gate drivers-three high-side (GH1–GH3) with bootstrap supply (BH1–BH3) and three low-side (GL1–GL3)-each with dedicated source pins (SH1/SL1 through SH3/SL3) enabling Kelvin sensing. It uses an internal regulated charge pump to sustain high-side drive down to 5.5 V VS.

Protection architecture includes per-phase short-circuit detection referenced to VDH, programmable SCDL threshold, dual ERRx open-drain outputs with 2-bit diagnosis, under-voltage lockout (UVLO) on VS, over-temperature warning, and configurable shoot-through prevention via STOE and DT pins.

Key Specifications

Pinout & Package

Package: PG-DSO-36-38 (36-pin exposed-pad SOIC with thermal pad), RoHS-compliant, AEC-Q100 qualified.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase MOSFET gate driver applications.

Compared with BD9M500MUF-M and UCC27282D, the TLE7185E delivers automotive-grade integration-combining charge-pump-enabled low-voltage operation, per-phase analog fault threshold tuning, dual ERR-encoded diagnostics, and AEC-Q100 Grade 0 thermal resilience-reducing BOM count and validation effort in safety-critical motor drives.

Availability

TLE7185E is available at Aetrix Electronics and suitable for cooling fan control, electric power steering, and water pump drive applications requiring stable component supply across extended automotive lifecycles.

Supply support for TLE7185E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and automotive qualification infrastructure.

The TLE7185E belongs to Infineon's TLE automotive driver IC family, engineered specifically for high-reliability 3-phase motor control in engine bay environments-emphasizing fault resilience, low-voltage operability, and embedded diagnostics.

FAQ

What is the minimum supply voltage required for TLE7185E startup?

The TLE7185E requires a minimum of 6.5 V on VS to wake up and initialize its internal regulators and charge pump. Stable operation is guaranteed from 5.5 V onward, but startup sequencing must ensure VS reaches ≥6.5 V before asserting ENA or INH high. This threshold ensures reliable initialization of the bootstrap charge pump and internal logic states.

How does the SCDL pin adjust short-circuit detection sensitivity?

The SCDL pin accepts a resistor-to-ground to set the reference current for the internal short-circuit comparator. A lower resistance increases detection sensitivity (lower trip threshold), while higher resistance raises the threshold. The relationship is linear and specified in the datasheet's electrical characteristics table, enabling precise tuning for motor phase resistance and MOSFET R_DS(on) variations.

Can TLE7185E drive both N-channel and P-channel high-side MOSFETs?

No-the TLE7185E is designed exclusively for N-channel high-side MOSFETs using bootstrap gate drive. Its GHx outputs are floating high-side drivers referenced to SHx, requiring the source node to swing above VS during conduction. It does not support direct P-channel high-side drive or external high-voltage level shifters.

What thermal management provisions does the PG-DSO-36-38 package include?

The PG-DSO-36-38 package features an exposed thermal pad (Cooling Tab) that must be soldered to a large copper pour on the PCB for effective heat dissipation. Thermal resistance θ_JA is 35 °C/W under standard JEDEC conditions; mounting the IC with ≥200 mm² 2-oz copper area beneath the pad reduces θ_JA to ≤22 °C/W, enabling 3 W continuous power dissipation at T_CASE = 135 °C.