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Infineon Technologies TLE7258SJXUMA1
- Part No.:
- TLE7258SJXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TLE7258SJXUMA1.pdf
- Description:
- IC TRANSCEIVER 1/1 PGDSO8
- Quantity:
- Payment:
- Shipping:
Inventory:18,572
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Product details
Overview
TLE7258SJXUMA1 from Infineon is a single-wire LIN transceiver compliant with ISO 17987-4, LIN 2.2A, and SAE J2602, supporting data rates up to 20 kbps. It operates as the physical layer interface between microcontrollers and automotive LIN buses, featuring integrated wake-up detection, dominant time-out protection, BUS short-to-VBAT/GND handling, and AEC-Q100 qualification for under-hood applications including rain sensors and window lifters.
For engineers reviewing the TLE7258SJXUMA1 datasheet, TLE7258SJXUMA1 pinout, TLE7258SJXUMA1 application, or TLE7258SJXUMA1 equivalent, key selection criteria include sleep-mode current (<10 µA), ±10 kV IEC61000-4-2 ESD robustness, 3.3 V/5 V logic compatibility, BUS leakage current specification, and PG-DSO-8 package thermal performance in automotive ambient conditions.
Technical Context
The TLE7258SJXUMA1 implements a BiCMOS-based LIN physical layer with slew-rate-controlled driver and RF-filtered receiver to minimize electromagnetic emission while maintaining high immunity. Its three-mode operation (normal/standby/sleep) is managed via EN input and INH output, enabling external voltage regulator control and partial network power management.
Wake-up is triggered by bus activity detected on RxD, with internal pull-up disabled in sleep mode and re-enabled in standby. The transceiver integrates overtemperature shutdown, supply undervoltage detection, and TxD fail-safe monitoring - all verified per AEC-Q100 stress test conditions for automotive reliability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Data Rate | 20 kbps - Enables full LIN 2.x protocol compliance including diagnostic frames and slave node responses. |
| Sleep Current | <10 µA typical - Allows permanent battery connection in always-on vehicle modules without draining 12 V system. |
| ESD Robustness | ±10 kV HBM per IEC61000-4-2 - Eliminates need for external TVS diodes on BUS line in most automotive harness environments. |
| Logic Compatibility | 3.3 V and 5 V microcontroller I/O - Supports mixed-voltage ECUs without level-shifting circuitry on TxD/RxD lines. |
| BUS Leakage | <1 µA at 25 °C - Ensures reliable wake-up in partially powered networks where only LIN transceiver remains active. |
| Supply Range | 5.5 V to 27 V - Covers cold-crank (5.5 V) to load-dump (27 V) transients without external regulation. |
| Operating Temp | −40 °C to +150 °C - Qualified for engine bay placement per AEC-Q100 Grade 0 requirements. |
Pinout & Package
Package: PG-DSO-8 (lead-free, RoHS-compliant, thermally enhanced SOIC-8 variant with exposed pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RxD | Receiver output | Open-drain output reflecting BUS state; requires external pull-up to MCU supply for wake-up signaling and logic-level translation. |
| EN | Enable input | Active-high digital control; integrated pull-down ensures defined sleep mode at power-up or MCU reset. |
| N.C. | No connect | Internally unconnected pin; must remain floating - no PCB trace or solder mask opening required. |
| TxD | Transmit input | CMOS-compatible input with internal pull-up; drives dominant state when pulled low, recessive when high or floating. |
| GND | Ground reference | Primary return path for BUS driver, receiver, and internal regulator; must be low-inductance connection to chassis ground. |
| BUS | LIN bus interface | Single-wire bidirectional I/O with integrated slave termination; withstands ±40 V fault events per ISO 7637-2 Pulse 5a. |
| VS | Battery supply input | Direct connection to 12 V rail; requires 100 nF ceramic decoupling capacitor placed within 5 mm of pin. |
| INH | Inhibit output | Open-drain output referenced to VS; signals MCU readiness and controls external LDO enable in multi-rail systems. |
Key Features
| Feature | Design Value |
|---|---|
| Dominant time-out protection | Prevents bus lock-up by forcing TxD release after programmable timeout - eliminates need for MCU watchdog supervision of LIN TX. |
| Bus wake-up with RxD signaling | Generates MCU-interrupt-capable RxD low pulse on LIN activity during sleep - enables zero-power listening without polling. |
| Integrated BUS termination | Eliminates external 30 kΩ pull-up resistor; reduces BOM count and PCB area in slave-node designs. |
| Overtemperature shutdown | Thermal foldback activates at 175 °C junction temperature and recovers automatically after cooldown - prevents permanent damage in sealed enclosures. |
| Short-to-battery & short-to-ground recovery | Self-resetting protection on BUS pin survives direct 12 V shorts and GND faults without latch-up or parameter drift. |
Applications
| Rain and Light Sensor Module | Window Lifter Control Unit |
|---|---|
|
Use Scenario: Integrated cabin sensor cluster detecting ambient light intensity and windshield moisture to auto-activate wipers and headlights. IC Role / Device Role / Timing Role: LIN slave transceiver interfacing 8-bit MCU to central body controller; handles periodic status reporting and command reception at 10.4 kbps. Use Value: Low sleep current extends battery backup runtime during vehicle off-state; ±10 kV ESD rating ensures reliability against washer fluid spray-induced discharges. |
Use Scenario: Motor-driven door window module with anti-pinch detection, position feedback, and soft-stop control. IC Role / Device Role / Timing Role: Physical layer bridge between 32-bit ARM Cortex-M MCU and vehicle-wide LIN backbone; supports firmware updates via UDS over LIN. Use Value: BUS short-to-VBAT protection maintains communication during door harness chafing incidents; INH output sequences 5 V logic supply after VS stabilization. |
| Parking Aid System Node | Seat Position Memory Module |
|
Use Scenario: Ultrasonic parking sensor ECU mounted near rear bumper, communicating proximity data to instrument cluster. IC Role / Device Role / Timing Role: LIN slave node operating in harsh thermal environment (−40 °C to +125 °C ambient); transmits burst-mode echo timing data every 50 ms. Use Value: AEC-Q100 Grade 0 qualification ensures functionality during exhaust heat soak; low BUS leakage avoids false wake-ups from capacitive coupling in bundled harnesses. |
Use Scenario: Driver seat memory module storing position settings and recalling them via LIN command from door module or key fob. IC Role / Device Role / Timing Role: Low-power LIN interface enabling persistent memory retention during vehicle sleep; wakes on master query to report stored positions. Use Value: <10 µA sleep current prevents parasitic drain on 12 V battery over weeks of inactivity; 3.3 V logic compatibility matches modern low-voltage MCUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLIN1029DR | Higher ESD rating (±15 kV), integrated VIO regulator, but no INH output and higher sleep current (15 µA). | Preferred for new designs requiring extended EMC margin and simplified power sequencing; less suitable for ultra-low-power partial-network wake-up. | Select TLIN1029DR when board space allows larger SOIC-14 package and system-level ESD testing exceeds ±10 kV requirements. |
| ATA663211-GAQW | Lower max data rate (10.4 kbps), no dominant time-out, but includes LIN voltage regulator and wake-up filter tuning. | Better suited for cost-sensitive body electronics with legacy LIN 1.x protocols; lacks support for fast diagnostic frames. | Choose ATA663211-GAQW only if design targets LIN 1.3 compliance and does not require 20 kbps update rates for real-time sensor fusion. |
Compared with TLIN1029DR and ATA663211-GAQW, the TLE7258SJXUMA1 uniquely balances ultra-low sleep current, integrated INH-controlled power sequencing, and full LIN 2.2A timing compliance - making it optimal for next-generation automotive slave nodes where BOM reduction and thermal resilience are prioritized.
Availability
TLE7258SJXUMA1 is available at Aetrix Electronics and suitable for rain/light sensors, window lifters, parking aid systems, and seat memory modules requiring stable component supply across automotive production lifecycles.
Supply support for TLE7258SJXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification infrastructure.
The TLE7258 belongs to Infineon's automotive transceiver product line, engineered specifically for robust, low-power LIN communication in electrically noisy vehicle environments - targeting body electronics, comfort systems, and distributed sensor networks.
FAQ
What is the function of the INH pin on the TLE7258SJXUMA1?
The INH (Inhibit) pin is an open-drain output referenced to VS that signals the transceiver's operational readiness. It goes high-impedance in sleep mode and actively pulls low in normal/standby modes, enabling direct control of external 5 V regulators or MCU reset sequencing. Its voltage-level independence from MCU I/O simplifies power domain isolation in multi-supply ECUs.
Does the TLE7258SJXUMA1 require an external pull-up resistor on the RxD line?
Yes - the RxD pin is open-drain and requires an external pull-up resistor (typically 10 kΩ) to the MCU's I/O supply voltage (3.3 V or 5 V). This pull-up establishes the recessive logic level and enables wake-up detection: a bus activity event forces RxD low, generating an interrupt-capable edge for the MCU without polling.
How does the TLE7258SJXUMA1 handle BUS short-to-battery faults?
The BUS pin features integrated short-to-battery protection that limits current to <50 mA during sustained 12 V shorts, then automatically recovers once the fault clears. Unlike latch-off architectures, this self-resetting behavior maintains communication availability after transient harness faults - critical for safety-relevant LIN nodes like parking sensors.
Can the TLE7258SJXUMA1 operate as a LIN master node?
No - the TLE7258SJXUMA1 is designed exclusively for slave-node operation. Master functionality requires external 1 kΩ termination and clamping diode between BUS and VS, but the device lacks the timing precision and bus arbitration logic needed for master role. Use Infineon's TLE7259 or TLIN2029 for master-capable transceivers.
TLE7258SJXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- -
- Receiver Hysteresis:
- 120 mV
- Data Rate:
- 20kbps
- Voltage - Supply:
- 5.5V ~ 18V
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8
TLE7258SJXUMA1 FAQ
1.How can I place an order for TLE7258SJXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE7258SJXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE7258SJXUMA1 reliable?
The price and inventory of TLE7258SJXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE7258SJXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE7258SJXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE7258SJXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE7258SJXUMA1?
TLE7258SJXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE7258SJXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE7258SJXUMA1?
For technical support, including TLE7258SJXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE7258SJXUMA1 requirements.
6.How does Aetrix verify that TLE7258SJXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE7258SJXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE7258SJXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE7258SJXUMA1?
All TLE7258SJXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE7258SJXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE7258SJXUMA1 part is unused and in its original packaging.
Return procedure for TLE7258SJXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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