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Infineon Technologies TLE8110EDXUMA1
- Part No.:
- TLE8110EDXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 36-BFSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
TLE8110EDXUMA1.pdf
- Description:
- IC LOW-SIDE SWITCH DSO36-72
- Quantity:
- Payment:
- Shipping:
Inventory:2,688
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Product details
Overview
TLE8110EDXUMA1 from Infineon Technologies is a 10-channel smart low-side power switch in Smart Power Technology (SPT), designed for automotive engine management and powertrain systems. It integrates 10 open-drain DMOS output stages, supports dual control via parallel PWM inputs or 16-bit SPI interface, features clampSAFE clamping architecture, and delivers channel-specific on-resistance (0.25–0.60 Ω at 25°C) with AEC-Q100 qualification.
For engineers reviewing the TLE8110EDXUMA1 datasheet, TLE8110EDXUMA1 pinout, TLE8110EDXUMA1 application, or TLE8110EDXUMA1 equivalent, key selection considerations include channel-wise current rating (0.75–1.70 A nominal), dual-supply compatibility (VDD: 4.5–5.5 V, VCC: 3.0–5.5 V), integrated open-load/short-circuit/overtemperature diagnosis, and daisy-chainable SPI for multi-device control in space-constrained ECUs.
Technical Context
The TLE8110EDXUMA1 implements a dual-control architecture: parallel input pins (IN1–IN10) enable direct PWM-driven switching of individual channels, while its 16-bit SPI interface supports command-based control (e.g., CMD_RSDS, CMD_RPC), diagnosis register access (DRx), and compactCONTROL mode for efficient register updates. The device uses an internal modulo-8 counter and safeCOMMUNICATION encoding to ensure robust SPI data integrity.
Its protection system includes per-channel thermal sensing, two-stage overcurrent shutdown thresholds (2.6–3.7 A), and a centralized clampSAFE structure enabling thermally balanced parallel operation of multiple outputs. Diagnosis flags for open load, short-to-GND, short-to-VBatt, and overtemperature are latched and readable via SPI, with automatic channel disable on fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Supply Range | 4.5–5.5 V - powers analog circuitry and ensures TTL-level compatibility with 5 V microcontrollers. |
| VCC Supply Range | 3.0–5.5 V - powers digital logic, enabling interoperability with both 3.3 V and 5 V MCUs without level-shifting. |
| Clamping Voltage (CH1–10) | 55 V typ - enables safe inductive load switching (e.g., solenoids, injectors) without external flyback diodes. |
| RON (CH1–4 @ 25°C) | 0.30 Ω - supports 1.5 A nominal output with ≤0.675 W conduction loss per channel at full load. |
| RON (CH5–6 @ 25°C) | 0.25 Ω - optimized for higher-current relays (1.7 A nominal), reducing thermal stress in critical powertrain nodes. |
| RON (CH7–10 @ 25°C) | 0.60 Ω - balances die area and thermal performance for lower-current general-purpose loads (0.75 A nominal). |
| Overcurrent Threshold (CH7–10) | 1.70 A min - provides precise fault detection margin above nominal 0.75 A, preventing nuisance trips during transient surges. |
Pinout & Package
Package: PG-DSO-36-72 - thermally enhanced 36-pin exposed-pad SOIC package with 7.2 mm body width, optimized for automotive PCB layouts requiring high power dissipation and EMI robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Analog supply input | Provides 4.5–5.5 V to analog blocks including drivers, clamping circuitry, and temperature sensors. |
| VCC | Digital supply input | Supplies 3.0–5.5 V to SPI logic, registers, and input buffers - independent of VDD for mixed-voltage system integration. |
| GND | Power ground | Common reference for all analog/digital circuits and output stage return paths; tied to exposed thermal pad. |
| RST | Global reset input | Active-low asynchronous reset that clears all registers and disables all outputs - required for safe power-up sequencing. |
| EN | Output enable control | Active-high signal enabling/disabling only the output control unit and power stages - allows diagnostic retention during standby. |
| S_CS | SPI chip select | Enables SPI communication when low; supports daisy-chaining by routing S_SO of one device to S_SI of next. |
| S_SI / S_SO / S_CLK | SPI data in/out/clock | Full-duplex 16-bit SPI interface compliant with standard timing; supports 2×8-bit and mixed protocols for flexible firmware design. |
| IN1–IN10 | Parallel PWM inputs | Direct CMOS/TTL-compatible control lines for real-time channel switching - bypasses SPI latency for time-critical actuator control. |
| OUT1–OUT10 | Low-side DMOS outputs | Open-drain outputs rated for 55 V clamp voltage and channel-specific current capability - connect directly to loads referenced to VBatt. |
Key Features
| Feature | Design Value |
|---|---|
| clampSAFE parallel operation | Enables thermally matched parallel connection of multiple channels (e.g., OUT1+OUT2) without external balancing components - increases effective current capacity while maintaining safe thermal distribution. |
| safeCOMMUNICATION SPI | Uses modulo-8 counter + command encoding to detect bit errors, CRC-like corruption, and out-of-sequence commands - prevents unintended output toggling in noisy automotive environments. |
| Per-channel diagnosis registers | 10 independent DRx registers store open-load, short-to-GND, short-to-VBatt, and overtemperature status - enables precise root-cause identification without scanning all channels. |
| Dual-mode control (SPI + parallel) | Allows safety-critical functions (e.g., injector firing) to use low-latency parallel inputs, while diagnostics, configuration, and non-time-critical loads use SPI - decouples real-time and supervisory control paths. |
| AEC-Q100 Grade 1 qualification | Validated for operation from −40 °C to +125 °C ambient, with extended lifetime testing under thermal cycling and humidity bias - meets functional safety requirements for powertrain ECUs. |
Applications
| Engine Fuel Injector Control | Transmission Solenoid Actuation |
|---|---|
|
Use Scenario: Precise pulse-width modulation of gasoline/diesel fuel injectors in inline-4 or V6 engines. IC Role / Device Role / Timing Role: Low-side driver delivering timed 12 V switched currents up to 1.7 A (CH5–6) with <1 µs turn-off delay for accurate fuel metering. Use Value: Integrated clampSAFE eliminates need for discrete flyback diodes, reducing BOM count and PCB area while ensuring repeatable inductive kick energy handling across temperature. |
Use Scenario: Driving hydraulic pressure control solenoids in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: High-reliability low-side switch managing 1.5 A nominal solenoid loads (CH1–4) with real-time overtemperature shutdown to prevent valve stiction. Use Value: Per-channel thermal sensing and latchable diagnosis flags allow ECU to isolate faulty solenoids without disabling entire transmission control module. |
| Body Control Module Relays | Electric Power Steering Motor Phases |
|
Use Scenario: Controlling HVAC blower relays, headlight leveling actuators, and door lock solenoids in BCMs. IC Role / Device Role / Timing Role: General-purpose low-side switch (CH7–10) delivering 0.75 A with 55 V clamp for resistive/inductive relay coils. Use Value: Dual VCC/VDD supplies enable direct interfacing with 3.3 V MCU I/Os while driving 12 V relay coils - eliminates level shifters and reduces component count. |
Use Scenario: Phase-leg switching in 12 V EPS motor drivers where redundancy and fault containment are critical. IC Role / Device Role / Timing Role: Parallel-configured low-side stage (e.g., OUT1+OUT2) delivering >3 A combined current with matched RON and thermal response. Use Value: clampSAFE ensures equal current sharing and synchronized thermal shutdown - avoids single-point failure modes in safety-critical steering assist systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multichannel low-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BTS716G | 8-channel, no parallel input pins; SPI-only control; lower clamp voltage (41 V); no clampSAFE architecture. | Limited to non-parallel, lower-voltage inductive loads; lacks real-time PWM bypass path. | Choose when board space is constrained and only SPI control is needed - not suitable for injector timing-critical systems. |
| TLE9201SE | 4-channel, integrated high-side + low-side configuration; 60 V clamp; supports PWM but no daisy-chain SPI. | Designed for H-bridge motor control, not pure low-side multiplexing; higher channel cost per function. | Prefer for bidirectional DC motor drives; avoid when consolidating >4 discrete low-side loads onto single IC. |
Compared with BTS716G and TLE9201SE, the TLE8110EDXUMA1 uniquely combines 10-channel density, dual-control flexibility, clampSAFE parallel operation, and AEC-Q100 Grade 1 qualification - making it the only option for high-channel-count, safety-critical, thermally demanding automotive power distribution.
Availability
TLE8110EDXUMA1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and body control modules requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.
Supply support for TLE8110EDXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and automotive qualification infrastructure.
The TLE8110EDXUMA1 belongs to Infineon's Smart Power Switch product line, engineered specifically for high-reliability, multi-load automotive power distribution where functional safety, thermal resilience, and diagnostic granularity are mandatory.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The TLE8110EDXUMA1 is rated for continuous operation up to 150 °C junction temperature, as validated per AEC-Q100 stress testing. Thermal derating begins above 125 °C ambient, and the integrated per-channel temperature sensor triggers automatic shutdown at ~175 °C to prevent irreversible damage. PCB layout with adequate copper pour under the exposed pad is essential to maintain this rating.
Can the SPI interface and parallel inputs be used simultaneously?
Yes - the TLE8110EDXUMA1 supports concurrent operation: parallel inputs (IN1–IN10) control output states in real time, while SPI reads diagnosis registers or configures operating modes without interfering. However, writing to OUTx registers via SPI overrides parallel input state for that channel, enabling hybrid control strategies such as SPI-initiated safety shutdown during active PWM operation.
How does clampSAFE improve reliability in parallel channel configurations?
clampSAFE uses a shared, centrally located clamping structure instead of per-channel clamps, ensuring uniform voltage distribution and thermal coupling across all 10 outputs. This eliminates mismatch-induced current hogging during inductive flyback events, allowing parallel-connected channels (e.g., OUT1+OUT2) to share load current within ±5 % tolerance - verified across temperature and process variation.
Is the TLE8110EDXUMA1 compatible with 3.3 V microcontrollers without level shifters?
Yes - the VCC pin accepts 3.0–5.5 V, and all digital I/Os (S_CS, S_SI, S_SO, S_CLK, IN1–IN10, RST, EN) are fully 3.3 V tolerant with guaranteed logic thresholds. When VCC = 3.3 V, input high is recognized at ≥2.0 V and output high drives ≥2.4 V, meeting standard CMOS interface requirements without external level translation.
TLE8110EDXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BFSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- Low-Side Switch
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-36-72
- Grade:
- Automotive
- Qualification:
- AEC-Q100
TLE8110EDXUMA1 FAQ
1.How can I place an order for TLE8110EDXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE8110EDXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE8110EDXUMA1 reliable?
The price and inventory of TLE8110EDXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE8110EDXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE8110EDXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE8110EDXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE8110EDXUMA1?
TLE8110EDXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE8110EDXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE8110EDXUMA1?
For technical support, including TLE8110EDXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE8110EDXUMA1 requirements.
6.How does Aetrix verify that TLE8110EDXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE8110EDXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE8110EDXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE8110EDXUMA1?
All TLE8110EDXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE8110EDXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE8110EDXUMA1 part is unused and in its original packaging.
Return procedure for TLE8110EDXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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