Infineon Technologies TLE8201RAUMA1

Overview

TLE8201RAUMA1 from Infineon Technologies is an automotive door module power IC integrating one full-bridge (150 mΩ), four half-bridges (400–800 mΩ), one high-side switch (100 mΩ) for mirror defrost, and four 500 mΩ high-side lamp drivers - all with short-circuit, open-load, and overtemperature protection. It supports SPI-controlled diagnostics and current-sense multiplexing for central lock, deadbolt, mirror fold/position, defrost, and 5W/10W lamp loads in front-door modules.

For engineers reviewing the TLE8201RAUMA1 datasheet, TLE8201RAUMA1 pinout, TLE8201RAUMA1 application, or TLE8201RAUMA1 equivalent, key selection criteria include output R_DS(on) values per channel, integrated SPI register mapping, thermal resistance (R_thjC = 1.5 K/W), sleep-mode current consumption, and reverse-polarity protection via external n-channel MOSFET driven by GO/CP pins.

Technical Context

The TLE8201RAUMA1 implements a monolithic mixed-technology SPT (Bipolar + CMOS control + DMOS power stages) architecture optimized for automotive front-door load consolidation. Its 16-bit SPI interface enables centralized microcontroller control of 11 independent power outputs while supporting real-time fault reporting via status registers and analog current sense multiplexing across selected high-side channels.

All 11 outputs feature independent short-circuit detection with latchable fault flags, open-load diagnosis via voltage monitoring, and thermal shutdown with warning flag at 145 °C. The charge pump (GO/CP pins) provides gate drive for external reverse-polarity protection, and Vs supply monitoring includes over- and undervoltage lockout (5–40 V operational range).

Key Specifications

Pinout & Package

Package: PG-DSO-36-27 (Power-SO), thermally enhanced with exposed GND heatslug (cooling tab). Dimensions: 15.9 mm × 10.5 mm × 2.3 mm. Requires PCB thermal vias under heatslug and ≥47 µF bulk + 100 nF ceramic decoupling on Vs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive door module power management applications.

Compared with BTS724G, TLE8201RAUMA1 delivers full door-module integration in one die, while TLE9201S offers measurable improvements in thermal margin and R_DS(on) without changing PCB layout - making it the optimal upgrade path where qualification timelines allow.

Availability

TLE8201RAUMA1 is available at Aetrix Electronics and suitable for automotive body control modules, front-door electronic assemblies, and OEM door module replacement programs requiring stable component supply across extended product lifecycles.

Supply support for TLE8201RAUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in automotive-grade reliability and AEC-Q100 qualification.

The TLE8201RAUMA1 belongs to Infineon's TLE family of automotive power system basis chips (SBCs) designed specifically for intelligent load control in body electronics - emphasizing integration, diagnostic depth, and thermal robustness for door, seat, and lighting modules.

FAQ

What is the maximum continuous current supported by the full-bridge output?

The full-bridge output (OUT1/OUT2) supports ≥5 A continuous current at T_j ≤ 125 °C with proper PCB thermal design (R_thjA ≤ 30 K/W). This is validated by R_DS(on) = 150 mΩ max and thermal resistance data showing ≤3 W dissipation at 5 A (I²R = 3.75 W, derated per junction temp).

Does TLE8201RAUMA1 support PWM control of lamp drivers?

Yes - OUT8–OUT11 high-side lamp drivers accept direct PWM signals via dedicated logic inputs PWM1 and PWM2, which map to specific outputs through SPI-configurable xsel bits in CtrlReg01/CtrlReg11. No external gate drivers are required.

How is reverse polarity protection implemented?

Reverse polarity protection uses the internal charge pump (GO/CP pins) to drive the gate of an external n-channel MOSFET placed in the Vs supply line. When Vs is reversed, the charge pump disables the MOSFET gate, blocking current flow - eliminating need for series diodes and their associated voltage drop.

Can the current sense output (ISO) monitor all 11 outputs?

No - ISO is a single analog output multiplexed across four high-side switches (OUT7–OUT11) only. It does not support current sensing on bridge outputs (OUT1–OUT6); those rely on voltage-based open-load and short-circuit detection instead.