Infineon Technologies TLE8261EXUMA1
- Part No.:
- TLE8261EXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
TLE8261EXUMA1.pdf
- Description:
- IC TRANSCEIVER DSO36-38
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TLE8261EXUMA1 from Infineon Technologies is a monolithic Universal System Basis Chip (SBC) for automotive CAN gateway and body control modules, integrating a high-speed CAN transceiver (ISO 11898-2/5 compliant), three LDO regulators (Vcc1µC/Vcc2/Vcc3), SPI interface, watchdog/reset supervision, wake-up input, and open-drain Limp Home output. It operates across 5.5–27 V supply, supports −40°C to +150°C ambient, and delivers 200 mA per 5 V regulator with ±2% accuracy.
For engineers reviewing the TLE8261EXUMA1 datasheet, TLE8261EXUMA1 pinout, TLE8261EXUMA1 application, or TLE8261EXUMA1 equivalent, key selection criteria include CAN bus wake-up capability, dual 5 V LDOs with independent current limits, SPI-configurable watchdog timeout (16–1024 ms), and AEC-Q100 qualified operation in permanent-battery-connected systems.
Technical Context
The device implements a state-machine-driven SBC architecture with dedicated hardware blocks: HS-CAN transceiver powered by VccHSCAN, three regulated outputs (Vcc1µC for MCU, Vcc2 for internal CAN cell, Vcc3 shunt-controlled up to 400 mA), and bi-level wake-up detection on WK pin. All regulators feature short-circuit protection to GND and battery, and thermal shutdown at 175°C.
Supervision includes a window watchdog with checksum-protected configuration via SPI, programmable reset delay, and undervoltage detection on Vcc1µC with 50 µs timeout. The Limp Home output activates on critical fault (e.g., overtemperature, Vcc1µC UVLO) and remains asserted until cleared by SPI command or power cycle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Data Rate | Up to 1 MBaud - enables real-time communication in high-speed automotive networks like powertrain gateways. |
| Vcc1µC Output | 5 V ±2%, 200 mA - powers external microcontrollers with tight regulation for stable digital core operation. |
| Vcc2 Output | 5 V ±2%, 200 mA - supplies internal HS-CAN transceiver independently, isolating CAN analog performance from MCU load transients. |
| Vcc3 Current Limit | Up to 400 mA (with 220 mΩ shunt) - supports external CAN transceivers or sensors without requiring additional regulators. |
| Watchdog Timeout Range | 16 ms to 1024 ms, SPI-configurable - allows precise alignment with host MCU firmware execution cycles and safety monitoring intervals. |
| Operating Temperature | −40°C to +150°C (junction) - meets under-hood AEC-Q100 Grade 0 requirements for engine bay placement. |
| ESD Robustness | 8 kV HBM on CANH/CANL/SPLIT - ensures reliable bus operation in noisy automotive environments without external protection. |
Pinout & Package
Package: PG-DSO-36-38 (exposed die pad), RoHS-compliant, AEC-Q100 qualified. Thermal resistance RthJA = 35 K/W (PCB-mounted, 2-layer board, 2 cm² copper).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 RO | Reset Input/Output | Open-drain active-low reset signal with integrated pull-up; asserts during Vcc1µC undervoltage or watchdog timeout. |
| 2 CSN | SPI Chip Select | Active-low enable for SPI communication; requires CLK low before assertion to prevent data corruption. |
| 3 CLK | SPI Clock Input | CMOS-level clock input with internal pull-down; synchronizes SPI data transfer between SBC and host MCU. |
| 4 SDI | SPI Data Input | Receives configuration commands (e.g., watchdog setup, Limp Home enable) from host MCU via SPI master. |
| 5 SDO | SPI Data Output | Transmits status flags (e.g., fault codes, temperature warning, CAN bus error counters) to host MCU. |
| 17 Vcc3shunt | Vcc3 Current Sense | Connects to shunt resistor to set Vcc3 current limit; enables scalable external load support up to 400 mA. |
| 18 GND | Power Ground | Primary ground reference for all regulators and digital logic; tied to exposed die pad for thermal conduction. |
| 19 Vcc1µC | MCU Supply Output | Stable 5 V ±2% output delivering 200 mA; powers microcontroller core and peripherals with low dropout. |
| 20 Vcc3REF | Vcc3 Reference | Internal reference for Vcc3 regulation; connects to external PNP transistor base for adjustable Vcc3 output. |
| 23 WK | Wake-Up Input | Bi-level sensitive input detecting voltage transitions; wakes device from Stop/Sleep mode on CAN message or external signal. |
| 24 RxDCAN | CAN Receiver Data | Differential input from CAN bus (via CAN_H/CAN_L); decodes HS-CAN messages for SPI status reporting. |
| 25 TxDCAN | CAN Transmitter Data | Differential output driving CAN_H/CAN_L; complies with ISO 11898-2 dominant/recessive timing specifications. |
| 26 Limp home | Fault Safety Output | Open-drain output asserting during critical faults (overtemp, UVLO, watchdog failure); drives external fail-safe circuitry. |
| 27 INT | Interrupt Output | Active-low interrupt signal indicating configurable events (e.g., WK edge, CAN error, regulator fault). |
| 28 Vs | Main Supply Input | Battery input (5.5–27 V); powers internal regulators and CAN transceiver; includes reverse-polarity protection. |
| 29 Vcc2 | CAN Cell Supply | 5 V ±2% output for internal HS-CAN transceiver; isolated from Vcc1µC to prevent noise coupling into CAN analog path. |
| 30 VccHSCAN | CAN Transceiver Supply | Dedicated supply pin for HS-CAN driver stage; enables independent power domain for optimal bus drive strength. |
| 31 SPLIT | CAN Common-Mode Stabilization | Connects to center-tap of CAN bus termination resistor; reduces EMI and improves common-mode rejection. |
| 32 CANL | CAN Low Bus Line | Differential bus line connected to vehicle CAN network; short-circuit protected to GND and battery. |
| 33 CANH | CAN High Bus Line | Differential bus line connected to vehicle CAN network; short-circuit protected to GND and battery; 8 kV ESD rated. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated HS-CAN Transceiver | Fully compliant with ISO 11898-2/5 and SAE J2284, enabling direct connection to automotive CAN backbone without external transceivers. |
| Triple Independent LDO Regulators | Vcc1µC (200 mA), Vcc2 (200 mA), and shunt-controlled Vcc3 (up to 400 mA) provide isolated, fault-isolated power domains for MCU, CAN, and peripherals. |
| SPI-Configurable Supervision | Window watchdog with 16–1024 ms timeout range and checksum-protected register writes prevents unauthorized or erroneous configuration changes. |
| Limp Home Fail-Safe Output | Hardware-asserted open-drain output activated on overtemperature, Vcc1µC UVLO, or watchdog failure-ensures deterministic safety response without software dependency. |
| Bi-Level Wake-Up Detection | WK pin detects both rising and falling edges, supporting flexible wake sources (CAN message, LIN pulse, external sensor) while minimizing false triggers in noisy environments. |
Applications
| Body Control Module (BCM) | Gateway Controller |
|---|---|
|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in modern vehicles. IC Role / Device Role / Timing Role: SBC provides regulated power, CAN communication, and fault monitoring for distributed ECUs. Use Value: Eliminates need for discrete regulators and CAN transceivers, reducing BOM count and PCB area while ensuring AEC-Q100 reliability. |
Use Scenario: Aggregation and routing of messages between CAN, LIN, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: Acts as primary CAN interface and power source for gateway MCU and auxiliary transceivers. Use Value: Vcc3's 400 mA capability powers multiple external CAN/LIN transceivers, enabling multi-bus support from single chip. |
| Engine Bay Sensor Hub | ADAS Domain Controller Support |
|
Use Scenario: Powering and interfacing temperature, pressure, and position sensors near engine compartment. IC Role / Device Role / Timing Role: Delivers robust 5 V supplies and CAN connectivity under extreme thermal stress (−40°C to +150°C). Use Value: Integrated thermal shutdown and 8 kV CAN bus ESD protection ensure uninterrupted operation despite under-hood EMI and thermal cycling. |
Use Scenario: Providing auxiliary power and CAN diagnostics for radar, camera, and ultrasonic sensor clusters. IC Role / Device Role / Timing Role: Supplies regulated Vcc1µC to companion MCU and monitors system health via SPI-accessible fault registers. Use Value: Limp Home output triggers safe degradation mode (e.g., reduced frame rate, fallback algorithms) upon detected regulator or thermal fault. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE9471-2QX | Includes LIN physical layer (LIN 2.2A), higher Vcc1µC current (300 mA), and enhanced SPI error detection; no Vcc3 shunt control. | Required where LIN bus integration is needed alongside CAN; not suitable when only CAN is used and Vcc3 scalability is critical. | Select when LIN communication is mandatory and higher MCU supply current is required; verify absence of Vcc3 shunt flexibility against design needs. |
| MC33816AER2 | Single 5 V regulator (250 mA), no Vcc3 output, integrated watchdog but no Limp Home output; supports SPI and CAN only. | Targeted at simpler nodes without multi-rail power requirements or fail-safe output demands. | Choose for cost-sensitive, lower-complexity applications lacking need for triple-regulator isolation or hardware fail-safe signaling. |
Compared with TLE8261EXUMA1, TLE9471-2QX adds LIN support at the expense of Vcc3 configurability, while MC33816AER2 reduces integration depth-omitting Vcc3 and Limp Home-to lower cost and footprint for non-safety-critical nodes.
Availability
TLE8261EXUMA1 is available at Aetrix Electronics and suitable for automotive body control modules, gateway controllers, engine bay sensor hubs, and ADAS domain controller support requiring stable component supply across extended temperature and voltage ranges.
Supply support for TLE8261EXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and AEC-Q100 validation infrastructure.
The TLE8261E belongs to Infineon's HERMES Scalable System Basis Chip family, designed specifically for automotive electronic control units requiring integrated power, communication, and safety supervision in permanent-battery-connected applications.
FAQ
What is the function of the SPLIT pin on TLE8261EXUMA1?
The SPLIT pin connects to the center tap of the CAN bus termination resistor network to stabilize common-mode voltage on the CAN differential pair. This reduces electromagnetic emissions and improves immunity to common-mode noise, especially in long cable runs or electrically noisy vehicle environments. It must be externally connected to the midpoint of a 120 Ω termination resistor between CAN_H and CAN_L.
Can TLE8261EXUMA1 operate without an external microcontroller?
No - the TLE8261EXUMA1 requires an external microcontroller for initialization and runtime supervision. Its SPI interface is mandatory for configuring watchdog parameters, enabling interrupts, reading fault status, and clearing Limp Home assertions. The device lacks autonomous firmware and relies entirely on host MCU commands for functional control and recovery sequences.
How does the Vcc3 output achieve up to 400 mA current capability?
Vcc3 current is set by an external shunt resistor connected between Vcc3shunt and GND. With a 220 mΩ resistor, the internal current sense amplifier limits Vcc3 to 400 mA. An external PNP transistor (driven by Vcc3REF) boosts output current beyond the internal LDO's capability, allowing scalable power delivery to external transceivers or sensors without loading Vcc1µC or Vcc2.
Is the Limp Home output actively driven or open-drain?
The Limp Home output is strictly open-drain with no internal pull-up. It requires an external pull-up resistor to a defined voltage rail (e.g., Vcc1µC or battery) to generate a logic-high level when deasserted. During fault conditions (e.g., overtemperature, Vcc1µC undervoltage), the output pulls low to signal fail-safe mode - enabling direct interface with external safety logic or indicator circuits.
TLE8261EXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Type:
- Transceiver
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-36-38
- Grade:
- Automotive
- Qualification:
- -
TLE8261EXUMA1 FAQ
1.How can I place an order for TLE8261EXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE8261EXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE8261EXUMA1 reliable?
The price and inventory of TLE8261EXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE8261EXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE8261EXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE8261EXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE8261EXUMA1?
TLE8261EXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE8261EXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE8261EXUMA1?
For technical support, including TLE8261EXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE8261EXUMA1 requirements.
6.How does Aetrix verify that TLE8261EXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE8261EXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE8261EXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE8261EXUMA1?
All TLE8261EXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE8261EXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE8261EXUMA1 part is unused and in its original packaging.
Return procedure for TLE8261EXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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