Infineon Technologies TLE8262-2E

Overview

TLE8262-2E from Infineon Technologies is a monolithic Universal System Basis Chip (SBC) for automotive CAN-LIN gateway and body control applications. It integrates a high-speed CAN transceiver (ISO 11898-2/5 compliant, up to 1 MBaud), one LIN 2.1 transceiver (up to 20 kBaud), three LDO regulators (Vcc1µC/Vcc2 @ 5 V ±2%, 200 mA; Vcc3 @ 5 V ±4%, up to 400 mA), SPI interface, watchdog/reset supervision, wake-up input, and open-drain Limp Home outputs - all in a single PG-DSO-36-38 package.

For engineers reviewing the TLE8262-2E datasheet, TLE8262-2E pinout, TLE8262-2E application, or TLE8262-2E equivalent, key selection criteria include its dual-regulator architecture supporting microcontroller + CAN/LIN peripherals, configurable safety-critical Limp Home behavior, bi-level wake-up capability, and AEC-Q100 qualification for permanent-battery automotive systems.

Technical Context

The TLE8262-2E implements a hierarchical state machine with Stop, Sleep, Normal, and SBC SW Development modes, enabling precise power-state control across battery-permanent automotive ECUs. Its supervision logic includes a programmable window watchdog (16–1024 ms timeout), undervoltage detection on Vcc1µC with time-out, and reset output with integrated pull-up resistor.

Communication interfaces are functionally segregated: HS-CAN operates independently via dedicated VccHSCAN supply and supports bus wake-up; LIN uses shared Vcc2 and complies with SAE J2602-2 and ISO 9141; SPI is a standard 16-bit interface for configuration and status readback, with CRC-protected register access and corrupted-data detection logic.

Key Specifications

Pinout & Package

Package: PG-DSO-36-38 - thermally enhanced 36-pin exposed-pad SOIC package with improved heat dissipation for automotive under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Compared with TLE8262E, the -2E variant adds two extra Limp Home outputs for enhanced fail-safe signaling; versus TLE8263-2E, it trades one LIN channel for lower cost and reduced pin count - making it optimal for single-bus gateway or BCM designs requiring maximum safety output flexibility.

Availability

TLE8262-2E is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, seat control units, and roof module applications requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.

Supply support for TLE8262-2E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TLE8262-2E belongs to Infineon's HERMES System Basis Chip family - designed specifically for automotive electronic control units needing integrated power, communication, supervision, and fail-safe features in a single AEC-Q100-qualified device.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The TLE8262-2E is rated for continuous operation up to 150 °C junction temperature per AEC-Q100 Grade 0 qualification. Thermal derating begins above 125 °C ambient; full electrical specifications are guaranteed from −40 °C to +125 °C ambient with appropriate PCB copper area (≥200 mm² thermal pad exposure) and airflow.

How does the bi-level wake-up input (WK) function in Stop Mode?

In Stop Mode, the WK pin monitors for either low-to-high transition exceeding V_WKH = 2.5 V or high-to-low transition below V_WKL = 0.8 V. Both edges trigger wake-up, and the source can be masked per application via SPI configuration - enabling selective wake from rain sensors, door switches, or LIN bus activity without CPU intervention.

Can Vcc3 supply external CAN transceivers without additional components?

No. Vcc3 requires an external PNP transistor (e.g., BCX56) and shunt resistor (typically 220 mΩ) to deliver up to 400 mA. The internal circuitry provides only base drive and current sensing; the PNP emitter supplies the load, ensuring thermal isolation and preventing Vcc3 regulation degradation under high current.

Is the SPI interface compatible with standard 16-bit microcontrollers?

Yes. The TLE8262-2E implements a standard Motorola SPI mode (CPOL = 0, CPHA = 0) with 16-bit frame length, programmable clock frequency up to 2 MHz, and dedicated SS, SCLK, MOSI, and MISO pins. All registers are accessible via 16-bit read/write commands with checksum-protected configuration writes.