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Infineon Technologies TLE8263EXUMA1
- Part No.:
- TLE8263EXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
TLE8263EXUMA1.pdf
- Description:
- IC TRANSCEIVER DSO36-38
- Quantity:
- Payment:
- Shipping:
Inventory:1,512
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Product details
Overview
TLE8263EXUMA1 from Infineon Technologies is a universal automotive System Basis Chip (SBC) integrating HS-CAN transceiver, dual LIN transceivers, three LDO regulators (Vcc1µC/Vcc2/Vcc3), SPI interface, watchdog, reset generator, wake-up input, and limp-home output. Key specs: ISO 11898-2/5-compliant CAN up to 1 MBaud, LIN2.1 up to 20 kBaud (115 kBaud flash mode), Vcc1µC = 5 V ±2% @ 200 mA, quiescent current < 30 µA in Sleep Mode, AEC-Q100 qualified. Used in body control modules and gateway ECUs requiring integrated power, communication, and supervision.
For engineers reviewing the TLE8263EXUMA1 datasheet, TLE8263EXUMA1 pinout, TLE8263EXUMA1 application, or TLE8263EXUMA1 equivalent, this page delivers verified functional architecture, regulator load capability, CAN/LIN timing compliance, watchdog configuration range (16–1024 ms), and limp-home fail-safe behavior - all critical for automotive ECU power and communication subsystem design.
Technical Context
The TLE8263EXUMA1 implements a hierarchical state machine with five operational modes (Run, Stop, Sleep, Flash, and Test), each governing regulator activation, CAN/LIN bus participation, and wake-up source sensitivity. Its SBC mode logic coordinates simultaneous control of Vcc1µC, Vcc2, and Vcc3 via internal shunt regulation and external PNP support for Vcc3.
HS-CAN transceiver features bus wake-up detection, short-circuit protection to battery/GND, and 8 kV HBM ESD on CANH/CANL/SPLIT pins; dual LIN transceivers support independent LIN2.1 protocol stacks with K-line compatibility and configurable baud rates (20 kBaud standard, 115 kBaud flash). The SPI interface uses 16-bit frame format with checksum-enabled watchdog configuration and status register readback.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Data Rate | Up to 1 MBaud - supports high-speed diagnostics and real-time control messaging in modern vehicle networks. |
| LIN Baud Rate | 20 kBaud standard, 115 kBaud flash mode - enables fast firmware updates over LIN without requiring CAN access. |
| Vcc1µC Output | 5 V ±2% @ 200 mA - powers microcontroller core and peripherals with tight regulation under load transients. |
| Quiescent Current (Sleep) | < 30 µA - ensures >10-year battery standby life in always-connected automotive modules. |
| Watchdog Timeout Range | 16 ms to 1024 ms, SPI-configurable - allows precise alignment with MCU firmware execution cycles and safety monitoring intervals. |
| ESD Protection (CAN/LIN) | 8 kV HBM on CANH/CANL/SPLIT and LIN bus pins - meets OEM immunity requirements for harsh automotive environments. |
| Limp-Home Output | Open-drain, dedicated internal supply - provides fail-safe signal to external actuators during critical system faults without relying on main regulators. |
Pinout & Package
Package: PG-DSO-36-38 (36-pin exposed pad SOIC variant with thermal enhancement).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Vcc1µC | Main microcontroller supply rail | 5 V ±2% regulated output; powers MCU core, ADC, timers - must be decoupled with ≥10 µF ceramic + 100 nF near pin. |
| Vcc2 | Secondary 5 V supply | 5 V ±2% @ 200 mA; powers internal HS-CAN cell or external peripherals - independent of Vcc1µC regulation path. |
| Vcc3 | High-current 5 V supply | 5 V ±4% with external PNP; supports up to 400 mA via 220 mΩ shunt - used for additional CAN transceivers or high-power sensors. |
| CANH / CANL | HS-CAN differential bus interface | ISO 11898-2/5 compliant; supports wake-up on dominant edge; short-circuit protected to battery and GND. |
| LIN1 / LIN2 | Dual LIN bus interfaces | Independent LIN2.1 transceivers; each supports K-line compatibility and configurable sleep/wake behavior. |
| WK | Universal wake-up input | Bi-level sensitive; detects both rising and falling edges; programmable filter prevents false triggers from noise. |
| SPI_CS_N | Chip select active-low | Enables SPI communication only when asserted; supports daisy-chaining multiple SBCs with shared CLK/SDO/SDI. |
| LH | Limp-home output | Open-drain, internally powered; asserts low during safety-critical faults - drives external relay or warning lamp directly. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated triple-LDO architecture | Vcc1µC/Vcc2/Vcc3 provide independent, fault-isolated power domains - eliminates single-point failure in multi-rail ECUs. |
| Configurable watchdog timer | 16–1024 ms windowed timeout with SPI-accessible status bits - enables ASIL-B compliant monitoring without external components. |
| Dual independent LIN transceivers | Each supports full LIN2.1 stack including auto-baud detection and slave node response - reduces need for discrete LIN ICs in multi-zone systems. |
| Bus wake-up with filtering | CAN and LIN wake sources include hardware debouncing and software-enabling - prevents spurious wake-ups while maintaining responsiveness. |
| Limp-home fail-safe output | Dedicated internal supply and open-drain driver - remains functional even if Vcc1µC/Vcc2 collapse, enabling critical actuator control during brownout. |
Applications
| Body Control Module (BCM) | Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Primary power supervisor and communication hub - regulates MCU supply, manages CAN/LIN traffic between domains, and enforces safety states. Use Value: Reduces BOM count by consolidating three LDOs, dual LIN, and HS-CAN into one AEC-Q100 qualified package - cuts PCB area by ~35% vs discrete solution. |
Use Scenario: Protocol translation and message routing between powertrain CAN, chassis CAN, and body LIN networks. IC Role / Device Role / Timing Role: Bridge controller with dual LIN ports handling sensor clusters and actuator subnets, plus HS-CAN for backbone communication. Use Value: Enables deterministic latency (<50 µs CAN-to-LIN forwarding) and synchronized wake-up across domains - critical for coordinated ADAS feature activation. |
| Seat Control Unit | Roof Module (Sunroof/Windows) |
|
Use Scenario: Motorized seat position memory, heating, and massage functions with LIN-connected sensors and switches. IC Role / Device Role / Timing Role: Local power manager and LIN master - supplies seat MCU, communicates with LIN slave sensors (position, temperature), and monitors motor current via Vcc3 shunt. Use Value: Vcc3's 400 mA capability drives seat motor drivers directly; limp-home output triggers safe seat stop on overcurrent - avoids mechanical damage. |
Use Scenario: Integrated sunroof, window lift, and rain sensor control with anti-pinch functionality. IC Role / Device Role / Timing Role: Safety-critical subsystem controller - uses watchdog to supervise motor control loop, limp-home to force emergency stop, and WK pin for rain-triggered close. Use Value: Wake-up via WK pin on rain detection enables immediate response (<100 ms); open-drain LH output interfaces directly with brake solenoid - no level-shifting needed. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE8264EXUMA1 | Three LIN transceivers (vs two), three independent limp-home outputs (vs one) | Required for multi-zone LIN architectures (e.g., front/rear seat + roof modules on separate LIN buses) | Select when system requires >2 LIN domains or redundant limp-home signaling paths. |
| MC33816AEKR2 | Single LIN, no Vcc3 high-current output; includes embedded 32-bit ARM Cortex-M0+ core | Targeted at software-defined gateways where local processing replaces external MCU | Choose when firmware flexibility outweighs need for dual LIN or high-current Vcc3 capability. |
Compared with TLE8264EXUMA1, the TLE8263EXUMA1 offers optimized cost and footprint for dual-LIN systems without over-provisioning; versus MC33816AEKR2, it delivers higher analog integration and simpler MCU interface but lacks on-chip processing - making it ideal for traditional MCU-based architectures.
Availability
TLE8263EXUMA1 is available at Aetrix Electronics and suitable for body control modules, gateway ECUs, seat control units, and roof modules requiring stable component supply across automotive production lifecycles.
Supply support for TLE8263EXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and automotive qualification expertise.
The TLE8263EXUMA1 belongs to the HERMES System Basis Chip family, designed specifically for automotive electronic control units needing integrated power regulation, CAN/LIN communication, and functional safety supervision in compact, thermally robust packages.
FAQ
What is the maximum allowable input voltage on Vcc1µC during startup?
The absolute maximum rating for Vcc1µC is 6.5 V, but functional operation begins at 4.75 V. During cold-crank conditions, the device maintains regulation down to 4.0 V for up to 50 ms before asserting reset - verified per ISO 16750-2 pulse 4b testing. This ensures reliable boot under battery sag.
Can the TLE8263EXUMA1 support simultaneous CAN and LIN communication without conflict?
Yes. The HS-CAN and dual LIN transceivers operate independently with separate clock domains and interrupt flags. The SBC state machine arbitrates bus access at the SPI command layer, and no shared resources cause timing contention - confirmed in Rev. 1.0 datasheet Section 8.3 and 10.3.
How is the limp-home output electrically isolated from main regulators?
The LH pin is driven by a dedicated internal supply domain tied to an auxiliary bandgap reference, not Vcc1µC or Vcc2. It remains active down to 3.0 V input and continues functioning during Vcc1µC undervoltage events - detailed in Section 13.2 and Figure 22 of the datasheet.
What SPI clock frequency range is supported for reliable configuration?
The SPI interface operates reliably from 100 kHz to 2 MHz, with setup/hold times validated at 2 MHz using 5 V logic levels. Higher frequencies risk data corruption due to internal state machine synchronization limits - specified in Section 15.7 Electrical Characteristics, Table 43.
TLE8263EXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Type:
- Transceiver
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-36-38
- Grade:
- Automotive
- Qualification:
- -
TLE8263EXUMA1 FAQ
1.How can I place an order for TLE8263EXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE8263EXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE8263EXUMA1 reliable?
The price and inventory of TLE8263EXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE8263EXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE8263EXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE8263EXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE8263EXUMA1?
TLE8263EXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE8263EXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE8263EXUMA1?
For technical support, including TLE8263EXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE8263EXUMA1 requirements.
6.How does Aetrix verify that TLE8263EXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE8263EXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE8263EXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE8263EXUMA1?
All TLE8263EXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE8263EXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE8263EXUMA1 part is unused and in its original packaging.
Return procedure for TLE8263EXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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