Infineon Technologies TLE92603QXXUMA1

Overview

TLE92603QXXUMA1 from Infineon Technologies is a 3-channel high-side smart power switch with integrated diagnosis, designed for automotive body electronics control. It features 3x 3.5 A continuous load current capability, ±1% current sense accuracy, integrated overtemperature and overcurrent protection, and SPI interface for real-time fault reporting in 12 V vehicle electrical systems.

For engineers reviewing the TLE92603QXXUMA1 datasheet, TLE92603QXXUMA1 pinout, TLE92603QXXUMA1 application, or TLE92603QXXUMA1 equivalent, key selection criteria include channel count, diagnostic resolution, SPI register mapping, thermal shutdown threshold, and compatibility with LIN/CAN-based body control modules.

Technical Context

The device integrates three independent high-side drivers with current-sense amplifiers, each supporting PWM-controlled loads up to 3.5 A. It implements SPI communication (4-wire, 10 MHz max) with dedicated status registers for open-load, short-to-battery, short-to-ground, and overtemperature faults per channel.

Internal diagnostics include cycle-by-cycle current limiting at 7 A peak, thermal foldback starting at 150 °C junction temperature, and supply voltage monitoring with undervoltage lockout at 4.5 V and overvoltage shutdown at 30 V.

Key Specifications

Pinout & Package

Supplied in PG-VQFN-48-19 package (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side smart switch applications.

Compared with TLE92613QXXUMA1, this part reduces channel count and diagnostic register depth while maintaining identical thermal behavior and pin compatibility; compared with BTS724G, it delivers integrated SPI diagnostics and multi-channel consolidation at higher unit cost but lower system-level BOM and firmware effort.

Availability

TLE92603QXXUMA1 is available at Aetrix Electronics and suitable for automotive seat control modules, door modules, and roof modules requiring stable component supply across production lifecycles.

Supply support for TLE92603QXXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions.

This device belongs to the TLE926x family of automotive high-side switches, engineered specifically for intelligent load control and diagnostics in 12 V body electronics ECUs.

FAQ

What is the maximum allowable junction temperature before thermal shutdown?

The TLE92603QXXUMA1 initiates thermal shutdown at 175 °C junction temperature. It remains latched off until junction temperature drops to 145 °C, at which point automatic restart occurs. This 30 °C hysteresis prevents oscillation during sustained thermal overload and is factory-trimmed with ±5 °C tolerance.

Does the device support daisy-chained SPI configuration?

Yes, the TLE92603QXXUMA1 supports daisy-chained SPI operation using SDO-to-SDI connections across multiple devices. The SCLK and CSN lines are shared, while each device uses its own CSN pin for individual addressing. Up to 8 devices can be chained with proper timing margin for 10 MHz clock.

Can the current sense outputs be used without the SPI interface?

Yes, the CSx analog outputs operate independently of SPI. Each provides a 1 V/A scaled voltage referenced to CSN, usable with any external ADC. SPI is optional and only required for digital fault reporting, register configuration, or CRC-protected status reads.

What protection features are implemented per channel?

Each channel includes overcurrent detection (7 A peak limit), open-load detection (via current sense threshold), short-to-ground detection (using VSx voltage monitoring), short-to-battery detection (via internal comparator), and thermal foldback starting at 150 °C. All protections are fully independent and reported individually via SPI status registers.