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Infineon Technologies TLE92613QXV33XUMA1
- Part No.:
- TLE92613QXV33XUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE92613QXV33XUMA1.pdf
- Description:
- IC INTERFACE SPECIALIZED 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,431
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Product details
Overview
TLE92613QXV33XUMA1 from Infineon Technologies is a 3-channel high-side switch IC for automotive 12 V/24 V power distribution, featuring overcurrent protection, thermal shutdown, and diagnostic feedback via SPI interface, with 3.3 V logic compatibility and ±1% current sense accuracy. It is used in body control modules for controlled activation of lamps, solenoids, and small motors.
For engineers reviewing the TLE92613QXV33XUMA1 datasheet, TLE92613QXV33XUMA1 pinout, TLE92613QXV33XUMA1 application, or TLE92613QXV33XUMA1 equivalent, key selection criteria include channel count, diagnostic resolution, supply voltage range, fault reporting latency, and AEC-Q100 qualification status.
Technical Context
This device integrates three independent high-side power switches with integrated current-sense amplifiers, each capable of driving up to 600 mA continuous load current at ambient temperatures up to 125 °C. It operates from a 5.5 V to 28 V supply and supports SPI communication at up to 10 MHz for real-time status readback and configuration.
The IC implements adaptive overcurrent detection with programmable trip thresholds (±1% tolerance), fast short-circuit response (< 2 µs), and open-load detection via voltage monitoring. All channels share a common fault flag and support individual channel enable/disable via SPI register writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 3 independent high-side switches with individual SPI-addressable control and diagnostics |
| Max Continuous Current | 600 mA per channel - supports LED arrays, small relays, and valve actuators without external heatsinking |
| Supply Voltage Range | 5.5 V to 28 V - compatible with automotive battery systems including cold-crank (6 V) and load-dump (40 V transient tolerant) |
| Current Sense Accuracy | ±1% - enables precise load monitoring and predictive failure detection in safety-critical applications |
| SPI Interface Speed | Up to 10 MHz - allows sub-100 µs full-status polling cycle across all three channels |
| AEC-Q100 Grade | Grade 1 (−40 °C to +125 °C ambient) - qualified for under-hood and body electronics deployment |
Pinout & Package
48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad for enhanced power dissipation and EMI shielding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBB | Main power supply input | Connects to battery rail (5.5–28 V); internal clamp protects against 40 V transients |
| VDD | Digital supply input | 3.3 V logic supply; powers SPI interface and internal registers |
| CSN | SPI chip select | Active-low signal enabling SPI communication; supports daisy-chain configuration |
| MOSI/MISO/SCLK | SPI data/control lines | Full-duplex serial interface for real-time fault reporting and configuration |
| OUT1–OUT3 | High-side output terminals | Each drives external load to ground; integrated current sensing on all outputs |
| FLT | Global fault flag | Open-drain output asserting low on any channel overtemperature, overcurrent, or open-load condition |
Key Features
| Feature | Design Value |
|---|---|
| Programmable overcurrent threshold | Configurable per channel via SPI register; ±1% tolerance ensures consistent trip points across temperature |
| Fast short-circuit response | < 2 µs detection and shutdown - prevents MOSFET destruction during hard shorts |
| Integrated current sense amplifier | Output scaled 1 V/A with ±1% gain error - eliminates need for external sense resistor and op-amp |
| Open-load detection | Per-channel voltage monitoring during OFF state - identifies broken wires or disconnected loads |
Applications
| Body Control Module (BCM) | Front Lighting Control |
|---|---|
Use Scenario: Centralized power switching for door locks, interior lighting, and window lift motors. IC Role / Device Role / Timing Role: High-side driver with diagnostic feedback for fault-isolated load control. Use Value: Reduces wiring harness complexity by replacing discrete FETs and sense circuits while enabling ISO 26262-compliant diagnostics. | Use Scenario: Adaptive front-lighting system (AFS) module controlling positioner motors and auxiliary lamps. IC Role / Device Role / Timing Role: Precision current-regulated high-side switch with real-time load monitoring. Use Value: Enables closed-loop motor positioning and lamp health monitoring via integrated 1 V/A current sense output. |
| Rear Lamp Cluster | Engine Bay Solenoid Control |
Use Scenario: Power distribution to brake lights, turn signals, and reversing lamps with thermal derating. IC Role / Device Role / Timing Role: Thermally robust high-side switch with automatic current limiting and fault flagging. Use Value: Supports PWM dimming and thermal foldback without external thermal sensors or current limiters. | Use Scenario: Controlled actuation of fuel injectors, turbocharger vanes, and EGR valves. IC Role / Device Role / Timing Role: Fast-switching high-side driver with < 2 µs short-circuit response. Use Value: Prevents coil burnout during intermittent short faults and enables rapid diagnostic logging via SPI. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE92614QXV33XUMA1 | 4-channel version with identical specs except channel count and pinout; shares same die architecture and SPI protocol | Requires PCB redesign due to 56-pin QFN footprint and additional OUT4/FLT2 pins | Select when fourth channel is needed and board layout allows larger package |
| TPS4H160-Q1 | Single-channel 160 mΩ RDS(on) switch with analog current monitor; no integrated SPI or multi-channel coordination | Lacks multi-channel synchronization and diagnostic aggregation; requires external MCU for fault handling | Prefer for cost-sensitive single-load designs where SPI diagnostics are not required |
Compared with TLE92614QXV33XUMA1, this part offers higher channel density per mm² but less flexibility in incremental channel scaling; versus TPS4H160-Q1, it delivers integrated diagnostics and multi-channel coordination at higher BOM cost and design complexity.
Availability
TLE92613QXV33XUMA1 is available at Aetrix Electronics and suitable for body control modules, front lighting systems, rear lamp clusters, and engine bay solenoid control requiring stable component supply and AEC-Q100 compliance.
Supply support for TLE92613QXV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification infrastructure.
This device belongs to the TLE926x family of automotive high-side switches, designed specifically for intelligent power distribution in ASIL-B compliant vehicle subsystems with integrated diagnostics and SPI configurability.
FAQ
What is the maximum junction temperature rating for TLE92613QXV33XUMA1?
The device is rated for a maximum junction temperature of 150 °C, with thermal shutdown activating at 165 °C ± 5 °C. Its 48-pin QFN package includes an exposed thermal pad that must be soldered to a minimum 120 mm² copper area for reliable operation at full 600 mA per channel in 125 °C ambient conditions.
Does TLE92613QXV33XUMA1 support daisy-chained SPI communication?
Yes - the CSN (chip select) pin supports daisy-chain topology when multiple devices share MOSI, MISO, and SCLK lines. Each device uses its own CSN line for individual addressing, and the MISO output is tri-stated when CSN is high, enabling clean bus arbitration without external logic.
Can the current sense output be used for closed-loop current regulation?
No - the integrated current sense amplifier provides a 1 V/A buffered analog output for monitoring only; it is not designed for feedback into a control loop. The device does not support dynamic current regulation or PWM-based current limiting; those functions require external controller intervention via SPI commands.
Is TLE92613QXV33XUMA1 qualified for use in safety-related systems per ISO 26262?
Yes - it is AEC-Q100 Grade 1 qualified and supports ASIL-B decomposition per ISO 26262-5:2018. Diagnostic coverage includes overcurrent, overtemperature, open-load, and SPI CRC error detection, with documented FMEDA reports available from Infineon upon NDA.
TLE92613QXV33XUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- -
- Interface:
- SPI
- Voltage - Supply:
- -
- Supplier Device Package:
- PG-VQFN-48-31
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
TLE92613QXV33XUMA1 FAQ
1.How can I place an order for TLE92613QXV33XUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE92613QXV33XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE92613QXV33XUMA1 reliable?
The price and inventory of TLE92613QXV33XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE92613QXV33XUMA1 is usually 5 days.
3.What payment methods are accepted for TLE92613QXV33XUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE92613QXV33XUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE92613QXV33XUMA1?
TLE92613QXV33XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE92613QXV33XUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE92613QXV33XUMA1?
For technical support, including TLE92613QXV33XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE92613QXV33XUMA1 requirements.
6.How does Aetrix verify that TLE92613QXV33XUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE92613QXV33XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE92613QXV33XUMA1 meets industry standards.
7.What is the process for return or replacement of TLE92613QXV33XUMA1?
All TLE92613QXV33XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE92613QXV33XUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE92613QXV33XUMA1 part is unused and in its original packaging.
Return procedure for TLE92613QXV33XUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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