Infineon Technologies TLE9261QXV33XUMA1

Overview

TLE9261QXV33XUMA1 from Infineon Technologies is a 48-pin automotive-grade system basis chip (SBC) integrating a 3.3 V/250 mA LDO, high-side switch, window watchdog, and SPI interface for microcontroller power management and supervision in 12 V vehicle networks. It supports CAN FD communication, operates from -40 °C to 150 °C, and features overtemperature shutdown and reverse-battery protection.

For engineers reviewing the TLE9261QXV33XUMA1 datasheet, TLE9261QXV33XUMA1 pinout, TLE9261QXV33XUMA1 application, or TLE9261QXV33XUMA1 equivalent, key selection criteria include its integrated 3.3 V LDO current capability, CAN FD physical layer compliance, watchdog timeout programmability via SPI, and AEC-Q100 Grade 0 qualification for engine bay deployment.

Technical Context

The TLE9261QXV33XUMA1 implements a dual-supply architecture: primary input accepts 5.5–28 V (transient tolerant to 40 V), while the integrated 3.3 V LDO delivers up to 250 mA with ±2 % output accuracy and <10 mV ripple rejection. Its SPI interface operates at up to 5 MHz with frame error detection and CRC support.

Watchdog functionality includes both windowed and non-windowed modes with programmable timeout (1 ms–10 s), reset pulse width (1–100 ms), and independent enable control. The high-side switch provides 2.5 A continuous current, 4.5 A peak, with current limiting, thermal foldback, and short-circuit diagnostics reported via SPI.

Key Specifications

Pinout & Package

48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, wettable flank design for automated optical inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Compared with MC33903DP and L9369-TR, the TLE9261QXV33XUMA1 uniquely combines CAN FD PHY, 150 °C operation, and 3.3 V/250 mA LDO in one package-making it optimal for next-generation powertrain and ADAS ECUs requiring high-speed networking and extreme-temperature resilience.

Availability

TLE9261QXV33XUMA1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, ADAS radar ECUs, and electric power steering systems requiring stable component supply across automotive production lifecycles.

Supply support for TLE9261QXV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The TLE9261 belongs to Infineon's Automotive System Basis Chip (SBC) product line, engineered specifically for power supply, supervision, and communication interface integration in ASIL-B/C automotive ECUs.

FAQ

What is the maximum allowable ambient temperature for continuous operation of the TLE9261QXV33XUMA1?

The TLE9261QXV33XUMA1 is qualified for continuous operation at ambient temperatures up to +150 °C per AEC-Q100 Grade 0. This rating is validated under defined PCB copper area (≥200 mm² thermal pad exposure) and airflow conditions, enabling direct mounting on high-temperature engine control units without additional heatsinking.

Does the TLE9261QXV33XUMA1 support SPI communication with standard 3.3 V microcontrollers?

Yes-the TLE9261QXV33XUMA1 SPI interface uses 3.3 V logic levels compatible with standard MCU GPIOs. It supports clock speeds up to 5 MHz, frame error detection, and CRC-8 checksums. No level-shifting is required when interfacing with 3.3 V microcontrollers such as Infineon's AURIX™ TC3xx series.

Can the integrated high-side switch drive inductive loads like fuel injectors or solenoids directly?

Yes-the VSUP high-side switch supports continuous 2.5 A and peak 4.5 A current, with built-in inductive kickback clamping, current limiting, and thermal foldback. It is rated for driving automotive solenoids and fuel injectors, provided external flyback diode placement follows Infineon's layout recommendations in Application Note AN2019-07.

Is the CAN FD interface fully compliant with ISO 11898-2:2016, including common-mode range and bus fault protection?

Yes-the integrated CAN FD transceiver meets ISO 11898-2:2016 requirements, including ±36 V common-mode range, bus fault protection up to ±70 V, and dominant timeout prevention. It supports data rates up to 2 Mbit/s and includes silent mode for network diagnostics without bus arbitration interference.