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Infineon Technologies TLE92623QXV33XUMA1

Part No.:
TLE92623QXV33XUMA1
Manufacturer:
Infineon Technologies
Category:
Specialized
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixTLE92623QXV33XUMA1.pdf
Description:
IC INTERFACE SPECIALIZED 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,345

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Product details

Overview

TLE92623QXV33XUMA1 from Infineon Technologies is a 3-channel high-side smart power switch with integrated diagnostics, 33 mΩ on-resistance per channel, ±1% current sense accuracy, and AEC-Q100 Grade 0 qualification for automotive 12 V/24 V systems. It drives resistive, inductive, and capacitive loads in body control modules, lighting control units, and junction box applications.

For engineers reviewing the TLE92623QXV33XUMA1 datasheet, TLE92623QXV33XUMA1 pinout, TLE92623QXV33XUMA1 application, or TLE92623QXV33XUMA1 equivalent, key selection criteria include channel independence, overtemperature shutdown behavior, diagnostic reporting latency, and load dump immunity up to ±60 V.

Technical Context

This device integrates three independent high-side switches with current-sense amplifiers, thermal shutdown, open-load detection, short-to-battery protection, and SPI-controlled configuration. Each channel supports 5.5–28 V supply range and delivers up to 3.5 A continuous load current with internal charge pump enabling full enhancement at low VIN.

The SPI interface (4-wire, 10 MHz max) provides real-time status readback (overcurrent, overtemperature, open-load), programmable current limit thresholds (1.5–5.5 A), and configurable fault response modes (latch-off or auto-retry). Built-in watchdog timer ensures safe state recovery after host communication loss.

Key Specifications

ParameterValue and Actual Design Meaning
Channels3 independent high-side switches - enables multi-load control without external isolation
RDS(on) (max)33 mΩ @ Tj = 150°C - limits conduction loss to ≤370 mW per channel at 3.5 A
Current Sense Accuracy±1% @ 25°C - supports precise load monitoring and closed-loop current regulation
Supply Voltage Range5.5 V to 28 V - compatible with automotive battery transients including cold-crank (5.5 V) and load dump (28 V)
Diagnostic InterfaceSPI (4-wire, 10 MHz) - enables deterministic fault reporting with ≤10 µs latency per status read
AEC-Q100 GradeGrade 0 (−40°C to +175°C ambient) - qualified for under-hood engine bay placement

Pinout & Package

48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free, and halogen-free.

Pin/TerminalCircuit RoleDesign Meaning
VBATMain power inputConnects to vehicle battery rail; withstands 60 V transient spikes
VDDDigital supplyPowers logic core and SPI interface; requires local 3.3 V regulator
HS1–HS3High-side output terminalsEach drives one load to ground; internally protected against short-to-ground and short-to-battery
CS1–CS3Current sense outputsAnalog voltage proportional to load current (1 V/A); routed to external ADC
SDI, SDO, SCLK, CSNSPI interface signalsEnable bidirectional register access and fault status polling without shared bus contention
WDIWatchdog inputMust be toggled every 16–128 ms; failure triggers safe-state shutdown
ENGlobal enableHardware override disables all channels independently of SPI commands

Key Features

FeatureDesign Value
Independent channel controlEach HSx output can be enabled/disabled via dedicated SPI register - eliminates cross-talk during sequential load activation
Programmable current limitConfigurable threshold (1.5–5.5 A) per channel via SPI - avoids nuisance tripping on motor inrush while protecting wiring
Open-load detectionActive during ON and OFF states using internal test current - identifies broken wires before system startup
Thermal foldbackReduces current limit linearly above 150°C junction - maintains operation during sustained overload instead of hard shutdown
Short-to-battery protectionShuts down channel within 2 µs upon detecting >32 V at HSx - prevents latch-up during reverse-battery events

Applications

Body Control Module (BCM)Front Lighting Control Unit (FLCU)

Use Scenario: Controlling door lock actuators, window lift motors, and interior lamps in modern BCMs.

IC Role / Device Role / Timing Role: High-side power distribution and real-time load monitoring via integrated current sense.

Use Value: Eliminates need for external shunt resistors and op-amps, reducing BOM count by 7 components per channel.

Use Scenario: Driving LED headlamp arrays and adaptive front-lighting system (AFS) servos.

IC Role / Device Role / Timing Role: Precision current-regulated switching with fast fault response (<10 µs) for functional safety compliance.

Use Value: Enables ASIL-B compliant diagnostics without external watchdog IC or current sense circuitry.

Junction Box Power DistributionEngine Bay Auxiliary Loads

Use Scenario: Replacing mechanical relays in centralized power distribution boxes for HVAC blowers and radiator fans.

IC Role / Device Role / Timing Role: Solid-state replacement with built-in thermal derating and load dump immunity.

Use Value: Extends service life beyond 100,000 cycles and reduces audible click noise during actuation.

Use Scenario: Powering fuel pump controllers, turbocharger oil pumps, and EGR coolers in high-temperature engine compartments.

IC Role / Device Role / Timing Role: Grade 0 qualified high-side driver with active thermal management and overvoltage clamping.

Use Value: Supports continuous operation at 175°C ambient without external heatsink or forced air cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side smart switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor NCV8460ASingle-channel, no integrated current sense, ±5% current monitoring accuracyLacks SPI diagnostics and multi-channel integration - requires external ADC and microcontroller GPIO per channelChoose when cost sensitivity outweighs diagnostic depth and channel density requirements
STMicroelectronics VNQ7E100AJQuad-channel, 100 mΩ RDS(on), no programmable current limit, SPI only for status readbackHigher conduction loss limits continuous current to 2.2 A; lacks thermal foldback behaviorPrefer for space-constrained quad-load designs where thermal margin is less critical than pin count

Compared with NCV8460A and VNQ7E100AJ, TLE92623QXV33XUMA1 delivers higher channel integration, tighter current sensing, and active thermal management-making it optimal for ASIL-B–compliant body electronics requiring deterministic fault handling and minimal external components.

Availability

TLE92623QXV33XUMA1 is available at Aetrix Electronics and suitable for body control modules, front lighting control units, and junction box power distribution requiring stable component supply across automotive production lifecycles.

Supply support for TLE92623QXV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D centers and wafer fabs in Europe and Asia.

TLE92623QXV33XUMA1 belongs to the PROFET+2 family of smart high-side switches, designed specifically for next-generation automotive domain controllers requiring functional safety, high integration, and robustness against harsh electrical environments.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The TLE92623QXV33XUMA1 supports continuous operation up to 175°C junction temperature, validated per AEC-Q100 Grade 0. Thermal foldback begins at 150°C, reducing current limit linearly to prevent thermal runaway. PCB layout must include ≥200 mm² copper area under the exposed thermal pad with ≥6 thermal vias for reliable heat dissipation.

Does the device support daisy-chained SPI configuration?

No, TLE92623QXV33XUMA1 uses a standard 4-wire SPI interface with individual chip select (CSN) per device. Daisy-chaining is not supported due to lack of SDO-to-SDI forwarding logic. For multi-device systems, use separate CSN lines or an SPI multiplexer to maintain deterministic timing and avoid bus contention.

How does open-load detection work during the OFF state?

During OFF state, the device injects a 10 µA test current into each HSx output and measures resulting voltage. If voltage exceeds 2.5 V (indicating infinite impedance), open-load is flagged. This occurs independently of load type and requires no external components, enabling wire-break detection before power-on sequence initiation.

Can the current sense outputs (CS1–CS3) drive an ADC directly?

Yes, CS1–CS3 provide ratiometric analog outputs (1 V/A, referenced to VDD) with ±1% accuracy and 10 kHz bandwidth. They are buffered and capable of driving 10 kΩ loads, allowing direct connection to SAR or sigma-delta ADC inputs without external op-amps or level-shifting circuits.

TLE92623QXV33XUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
-
Interface:
SPI
Voltage - Supply:
-
Supplier Device Package:
PG-VQFN-48-31
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount

TLE92623QXV33XUMA1 FAQ

1.How can I place an order for TLE92623QXV33XUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE92623QXV33XUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE92623QXV33XUMA1 reliable?

The price and inventory of TLE92623QXV33XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE92623QXV33XUMA1 is usually 5 days.

3.What payment methods are accepted for TLE92623QXV33XUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE92623QXV33XUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE92623QXV33XUMA1?

TLE92623QXV33XUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE92623QXV33XUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE92623QXV33XUMA1?

For technical support, including TLE92623QXV33XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE92623QXV33XUMA1 requirements.

6.How does Aetrix verify that TLE92623QXV33XUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE92623QXV33XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE92623QXV33XUMA1 meets industry standards.

7.What is the process for return or replacement of TLE92623QXV33XUMA1?

All TLE92623QXV33XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE92623QXV33XUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE92623QXV33XUMA1 part is unused and in its original packaging.

Return procedure for TLE92623QXV33XUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLE92623QXV33XUMA1 Tags

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