Infineon Technologies TLE92623QXXUMA1

Overview

TLE92623QXXUMA1 from Infineon Technologies is a 3-channel high-side smart power switch with integrated diagnostics, designed for 12 V automotive body control modules. It features 3× 3.5 A continuous load current capability, ±1% current sense accuracy, and embedded overtemperature/overcurrent/short-to-battery protection. Used in seat motor control, mirror adjustment, and HVAC damper actuation circuits.

For engineers reviewing the TLE92623QXXUMA1 datasheet, TLE92623QXXUMA1 pinout, TLE92623QXXUMA1 application, or TLE92623QXXUMA1 equivalent, key selection criteria include channel independence, diagnostic resolution (±1% ISense), fail-safe shutdown timing (≤10 µs), and AEC-Q100 Grade 1 qualification for under-hood environments.

Technical Context

The TLE92623QXXUMA1 integrates three independent high-side drivers with dedicated current-sense amplifiers and digital status registers per channel. Each channel supports PWM operation up to 25 kHz and provides real-time fault reporting via SPI interface with 12-bit diagnostic data resolution.

It implements embedded thermal foldback limiting at 150 °C junction temperature and includes configurable blanking time (1–10 µs) for short-circuit detection immunity during inductive load switching transients.

Key Specifications

Pinout & Package

48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free, and halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side smart switch applications.

Compared with TLE92633QXXUMA1, this part reduces channel count but maintains identical per-channel performance and diagnostic fidelity; versus BTS724G, it delivers full SPI-based system-level diagnostics at higher integration and reduced MCU resource loading.

Availability

TLE92623QXXUMA1 is available at Aetrix Electronics and suitable for automotive body control modules, seat/mirror actuation systems, and HVAC damper control requiring stable component supply across Tier-1 production ramps.

Supply support for TLE92623QXXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions.

The TLE926x family targets automotive body electronics, delivering integrated high-side switching with embedded diagnostics to replace discrete FET+driver+sense+logic designs in ECUs.

FAQ

What is the maximum PWM frequency supported by TLE92623QXXUMA1?

The device supports PWM operation up to 25 kHz per channel. This is validated by its internal gate driver slew rate and thermal design, enabling smooth speed control of 12 V DC motors without audible noise or excessive switching losses. The blanking time configuration ensures reliable short-circuit detection even at full PWM duty cycle.

Does TLE92623QXXUMA1 require an external current sense resistor?

No. It integrates precision current-sense amplifiers with 0.5 V/A scaling and ±1% accuracy per channel. The IS1–IS3 analog outputs connect directly to a microcontroller's ADC without external components, reducing BOM count and PCB area while maintaining measurement integrity.

Can multiple TLE92623QXXUMA1 devices be connected on the same SPI bus?

Yes. The device supports daisy-chaining via dedicated CSN, SCK, MOSI, and MISO pins. Up to four devices can share one SPI port using hardware chip select toggling, enabling scalable control of up to 12 independent high-side channels with minimal MCU interface overhead.

What thermal management is required for continuous 3.5 A operation per channel?

Continuous 3.5 A per channel requires connection of the exposed thermal pad to a minimum 200 mm² copper pour with ≥4 thermal vias (0.3 mm diameter) to inner ground plane. Junction temperature must stay below 150 °C; thermal foldback activates at 135 °C to sustain operation during transient overload without shutdown.