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Infineon Technologies TLE9262BQXV33XUMA1

Part No.:
TLE9262BQXV33XUMA1
Manufacturer:
Infineon Technologies
Category:
Specialized
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixTLE9262BQXV33XUMA1.pdf
Description:
IC INTERFACE SPECIALIZED 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,381

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Product details

Overview

TLE9262BQXV33 from Infineon Technologies is a mid-range+ automotive System Basis Chip (SBC) integrating dual voltage regulators (3.3 V/250 mA main, 5 V/100 mA auxiliary), a high-speed CAN FD transceiver (up to 5 Mbit/s), a LIN 2.2 transceiver, four 7 Ω high-side switches, two HV GPIOs, and three HV wake inputs - deployed in body control modules for power management, communication, and load switching functions.

For engineers reviewing the TLE9262BQXV33 datasheet, TLE9262BQXV33 pinout, TLE9262BQXV33 application, or TLE9262BQXV33 equivalent, key selection criteria include CAN FD timing compliance, high-side switch RDS(on) and diagnostic capability, regulator dropout behavior under cold-crank, SPI-configurable fail-safe states, and HV wake input threshold stability across temperature.

Technical Context

The device implements a hierarchical state machine with six operational modes (Normal, Stop, Sleep, Restart, Fail-Safe, Development), each governing regulator enablement, transceiver bus activity, HS-switch behavior, and wake-source sensitivity. Configuration and diagnostics are handled via a 16-bit SPI interface with CRC protection and dedicated interrupt/reset outputs.

Its CAN FD transceiver complies fully with ISO 11898-2:2016 and SAE J2284, supporting Partial Networking; the LIN transceiver meets ISO 17987-4 and SAE J2602, including flash programming capability. Voltage regulation includes short-to-battery protection on VR2 and configurable external PNP-based VR3 for off-board load sharing.

Key Specifications

Parameter Value and Actual Design Meaning
Main Regulator Output 3.3 V ±2%, 250 mA max - powers MCU core logic and internal peripherals under full load and -40°C to +150°C ambient.
Auxiliary Regulator Output 5 V ±2%, 100 mA max - supplies LIN transceiver, sensors, or external logic with short-to-battery protection.
CAN FD Data Rate Up to 5 Mbit/s - enables high-bandwidth gateway messaging and firmware updates without protocol translation.
High-Side Switch RDS(on) 7 Ω typ. at 25°C - supports direct driving of resistive/inductive loads (e.g., solenoids, lamps) with integrated open-load detection.
SPI Interface 16-bit, CRC-protected - enables real-time configuration of watchdog timeout, wake sources, regulator enable/disable, and fault masking.
HV Wake Input Threshold VWAKE = 4.5 V min, 32 V max - detects battery-connected wake events (e.g., door handle touch, key fob signal) with hysteresis and filtering.
Operating Junction Temp -40°C to +150°C - qualified per AEC-Q100 Grade 0, enabling placement near heat sources in BCM or HVAC modules.

Pinout & Package

Package: PG-VQFN-48 (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad). Pin layout optimized for automotive PCB layout with dedicated GND planes, split supply domains (VBAT, VREG, VIO), and ESD-protected wake inputs.

Pin/Terminal Circuit Role Design Meaning
VBAT Main battery supply input Accepts 5.5–28 V DC; feeds internal regulators and high-voltage circuitry; includes overvoltage clamp at 41 V.
VREG Main regulator output 3.3 V regulated supply; powers internal logic, SPI interface, and connected MCU core; monitored for undervoltage reset.
VSUP Auxiliary regulator input Input for 5 V auxiliary regulator; requires external decoupling; enables independent power domain for LIN/CAN PHY.
HS1–HS4 High-side switch outputs Four independently controllable 7 Ω switches; support PWM dimming, current-limited turn-on, and diagnostic reporting via SPI.
WAKE1–WAKE3 High-voltage wake inputs 32 V-tolerant inputs with programmable filter time; trigger wake-up from Sleep/Stop mode upon valid edge or level event.
CANH / CANL CAN FD differential bus interface Compliant with ISO 11898-2; supports dominant clamping, TXD timeout, and wake-capable bus monitoring.
LIN Single-wire LIN transceiver I/O Bi-directional LIN bus pin; supports slave node flash programming and slope-controlled slew rate for EMC robustness.
CSN / SCK / MOSI / MISO SPI interface signals 4-wire SPI with chip select active-low; enables full register read/write access, including shadow registers for safe reconfiguration.

Key Features

Feature Design Value
Dual independent regulators with off-board usage protection Prevents backfeed from auxiliary 5 V domain into main 3.3 V rail during system power-down sequences.
Configurable external PNP-based VR3 (3.3 V or 1.8 V) Enables load sharing with external FET for higher-current off-board rails while maintaining precise voltage setpoint and thermal derating.
Integrated fail-safe logic with watchdog and interrupt outputs Hardware-level safety response (e.g., forced HS-switch disable, regulator shutdown) triggered by SPI timeout, overtemperature, or undervoltage.
Cyclic sense and cyclic wake with internal timer Reduces quiescent current to ≤30 µA in Sleep mode while maintaining periodic bus monitoring and wake-source polling without MCU intervention.
Open-load and overcurrent detection per HS switch Each high-side output reports fault status via SPI register bits, enabling diagnostic logging and adaptive load recovery strategies.

Applications

Body Control Module (BCM) Passive Keyless Entry (PKE)

Use Scenario: Centralized power distribution and communication hub in vehicle door, lighting, and window subsystems.

IC Role / Device Role / Timing Role: System Basis Chip providing regulated power, CAN/LIN connectivity, and controlled load switching for actuators and sensors.

Use Value: Reduces BOM count by integrating regulators, transceivers, and switches - simplifying layout and improving startup sequencing reliability.

Use Scenario: Low-power remote authentication module detecting key fob proximity and initiating vehicle unlock sequence.

IC Role / Device Role / Timing Role: Wake-capable SBC managing ultra-low-power sleep mode, HV wake input sensing, and secure LIN-based handshaking.

Use Value: Achieves <30 µA quiescent current in Sleep mode with cyclic wake, extending battery life in key fobs and door handle electronics.

Gateway Node HVAC Actuator Control

Use Scenario: In-vehicle network bridge between high-speed CAN FD backbone and low-speed LIN subnets (e.g., climate, seat controls).

IC Role / Device Role / Timing Role: Dual-protocol transceiver with partial networking support, enabling selective bus activation and reduced ECU wake-up traffic.

Use Value: Eliminates need for discrete CAN/LIN transceivers and level shifters while maintaining protocol-compliant timing margins.

Use Scenario: Motorized blend door and flap actuation in heating, ventilation, and air conditioning systems.

IC Role / Device Role / Timing Role: High-side driver with current-sense feedback and open-load detection for brushed DC motors and position sensors.

Use Value: Enables closed-loop motor stall detection and soft-start control without external current-sense amplifiers or discrete FETs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP MC33903 Single 5 V regulator (250 mA), no 3.3 V option; CAN FD not supported (CAN 2.0 only); 3 HS switches (no PWM support) Suitable for legacy CAN-only gateways where 3.3 V MCU supply must be provided externally Select when CAN FD bandwidth is unnecessary and cost-sensitive LIN+CAN 2.0 integration suffices.
STPMIC1A PMIC-only (no transceivers or HS switches); 4 buck regulators + 3 LDOs; no wake inputs or SPI diagnostics Requires external CAN/LIN transceivers and high-side drivers - increases board area and component count Select only when full system partitioning (power + comms + switching) is preferred for design reuse or qualification separation.

Compared with MC33903 and STPMIC1A, TLE9262BQXV33 delivers integrated CAN FD + LIN + dual regulators + four diagnostic HS switches in one AEC-Q100-qualified package - reducing interconnect complexity and enabling faster time-to-market for next-gen body electronics.

Availability

TLE9262BQXV33 is available at Aetrix Electronics and suitable for Body Control Modules, Passive Keyless Entry systems, and Gateway Nodes requiring stable component supply, automotive-grade lifecycle assurance, and traceable sourcing.

Supply support for TLE9262BQXV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

TLE9262BQXV33 belongs to the OPTIREG™ SBC family - designed specifically for automotive body electronics requiring integrated power, communication, and intelligent load control in space-constrained modules.

FAQ

What is the maximum junction temperature rating for TLE9262BQXV33?

The device is qualified per AEC-Q100 Grade 0 with a maximum junction temperature of +150°C. Thermal resistance (RthJA) is 32 K/W in standard 4-layer PCB layout with 20 cm² copper pour under the exposed pad. Derating begins above +125°C ambient depending on power dissipation and airflow.

Does TLE9262BQXV33 support partial networking on the CAN FD bus?

Yes - the integrated CAN FD transceiver supports Partial Networking per ISO 11898-2:2016. It enables selective wakeup of specific nodes using targeted frame IDs, reducing overall network quiescent current. Configuration is done via SPI register bit PN_EN and associated mask registers.

Can the 3.3 V main regulator be disabled while keeping the 5 V auxiliary regulator active?

No - the 3.3 V main regulator (VREG) powers internal logic, SPI, and CAN/LIN PHY blocks; disabling it halts all functionality. The 5 V auxiliary regulator (VSUP) can operate independently only when supplied externally and configured via SPI to bypass internal VREG-dependent enable logic.

How is open-load detection implemented on the high-side switches?

Each HSx output includes an internal current-sense path comparing load current against a 10 mA threshold. When current falls below this value under enabled conditions, the corresponding HSx_OCD flag is set in the SPI status register. Detection works across all SBC modes except Fail-Safe, where switches are forcibly disabled.

TLE9262BQXV33XUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Applications:
-
Interface:
SPI
Voltage - Supply:
28V
Supplier Device Package:
PG-VQFN-48-31
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount

TLE9262BQXV33XUMA1 FAQ

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The price and inventory of TLE9262BQXV33XUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9262BQXV33XUMA1 is usually 5 days.

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For technical support, including TLE9262BQXV33XUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9262BQXV33XUMA1 requirements.

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All TLE9262BQXV33XUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9262BQXV33XUMA1 meets industry standards.

7.What is the process for return or replacement of TLE9262BQXV33XUMA1?

All TLE9262BQXV33XUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9262BQXV33XUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE9262BQXV33XUMA1 part is unused and in its original packaging.

Return procedure for TLE9262BQXV33XUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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