Infineon Technologies TLE9262QXV33XUMA1

Overview

TLE9262QXV33XUMA1 from Infineon Technologies is a 48-pin automotive-grade system basis chip (SBC) integrating a 3.3 V/250 mA LDO, high-side and low-side switch drivers, watchdog timer, and SPI interface for microcontroller power management and communication in 12 V/48 V dual-battery vehicle architectures. It supports CAN FD physical layer compliance and operates over -40 °C to 150 °C ambient temperature.

For engineers reviewing the TLE9262QXV33XUMA1 datasheet, TLE9262QXV33XUMA1 pinout, TLE9262QXV33XUMA1 application, or TLE9262QXV33XUMA1 equivalent, key selection criteria include integrated 3.3 V LDO output capability, dual-battery voltage monitoring thresholds (VBAT1/VBAT2), programmable watchdog timeout, SPI register access for diagnostics, and AEC-Q100 Grade 0 qualification.

Technical Context

The TLE9262QXV33XUMA1 implements a multi-rail power management architecture with independent high-side (HS1/HS2) and low-side (LS1/LS2) drivers capable of 600 mA continuous load current each, supporting wake-up via CAN bus or external pins. Its embedded watchdog features windowed timeout and reset generation on SPI command failure or clock fault detection.

Integrated analog comparators monitor VBAT1 (12 V system) and VBAT2 (48 V system) with programmable undervoltage/overvoltage thresholds and hysteresis. The 3.3 V LDO supplies microcontroller core logic with ±2 % output accuracy and short-circuit protection.

Key Specifications

Pinout & Package

48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free, and halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Compared with TLE9262QXV33XUMA1, the TLE9263 variant adds LIN capability at no pinout cost, while the MC33FS4500 targets 5 V systems without 48 V support-making the TLE9262 optimal for new 48 V mild hybrid designs needing 3.3 V MCU supply and dual-battery monitoring.

Availability

TLE9262QXV33XUMA1 is available at Aetrix Electronics and suitable for engine control units, 48 V mild hybrid powertrains, electric power steering modules, and brake-by-wire actuators requiring stable component supply across automotive production lifecycles.

Supply support for TLE9262QXV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TLE9262 belongs to Infineon's Automotive System Basis Chip (SBC) product line, designed specifically for centralized power management, communication interface support, and functional safety compliance in modern 12 V/48 V vehicle electrical architectures.

FAQ

What is the maximum allowable voltage on the VCC2 pin?

The VCC2 pin accepts 16 V to 58 V DC, supporting direct connection to 48 V battery rails. Absolute maximum rating is 60 V for transient spikes per ISO 7637-2 Pulse 5a. Operation above 58 V risks permanent damage to internal high-voltage circuitry and voids AEC-Q100 qualification.

Does the TLE9262QXV33XUMA1 support SPI clock frequencies above 10 MHz?

Yes, the SPI interface supports up to 20 MHz clock frequency with standard mode timing. At 20 MHz, setup/hold times remain within specification for all operating temperatures (−40 °C to +150 °C), enabling fast register reads during runtime diagnostics without compromising data integrity.

Can the watchdog be disabled after power-on reset?

No-the watchdog is enabled by default after POR and cannot be permanently disabled via SPI. It can only be temporarily suspended for ≤100 ms using the WDI pin, ensuring continuous supervision even if firmware becomes unresponsive or loses SPI communication.

Is the thermal pad on the QFN package electrically connected?

Yes, the exposed thermal pad is internally connected to GND and must be soldered to a PCB thermal land tied to the main ground plane. Failure to connect it results in degraded thermal performance, exceeding 150 °C junction temperature under full load and triggering premature thermal shutdown.