Infineon Technologies TLE9461ESXUMA1
- Part No.:
- TLE9461ESXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
- Datasheet:
-
TLE9461ESXUMA1.pdf
- Description:
- IC SYST BASIS CHIP TSDSO24-1
- Quantity:
- Payment:

- Shipping:

Inventory:9,760
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE9461ESXUMA1 from Infineon is a monolithic System Basis Chip (SBC) for automotive CAN FD networks, integrating a 5 V/150 mA main LDO regulator, a 5 V/100 mA protected auxiliary LDO, a high-speed CAN transceiver compliant with ISO 11898-2:2016 and SAE J2284 (up to 5 Mbit/s), a configurable HV GPIO, and a 16-bit SPI interface. It supports Stop/Sleep modes with cyclic wake/sense, reverse-polarity protection via charge pump, and fail-safe signaling - deployed in HVAC ECUs and seat control modules.
For engineers reviewing the TLE9461ESXUMA1 datasheet, TLE9461ESXUMA1 pinout, TLE9461ESXUMA1 application, or TLE9461ESXUMA1 equivalent, key selection criteria include CAN FD data rate support, dual-LDO current capability, low quiescent current in Sleep mode (≤20 µA), HV wake input voltage range (4.5–28 V), and AEC-Q100 Grade 1 qualification for under-hood operation.
Technical Context
The TLE9461ESXUMA1 implements a state-machine-driven power management architecture with five operational modes (Normal, Stop, Sleep, Restart, Fail-Safe), each with configurable entry/exit conditions via SPI or hardware signals. Its CAN FD transceiver features bus dominant clamping, TXD timeout, and wake-capable operation with integrated undervoltage detection.
The device integrates two independent LDOs: VR1 delivers 5 V ±2% at 150 mA (250 mA peak) for MCU supply; VR2 provides 5 V ±3% at 100 mA with short-to-battery protection for off-board sensors. Both regulators support wide input voltage (4.5–28 V) and operate across –40 °C to +150 °C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Data Rate | Up to 5 Mbit/s - enables high-bandwidth firmware updates and real-time diagnostics in modern ECU architectures. |
| Main LDO Output | 5 V ±2%, 150 mA continuous - powers 32-bit automotive microcontrollers (e.g., Aurix TC3xx) without external boost. |
| Aux LDO Output | 5 V ±3%, 100 mA with short-to-battery protection - safely supplies external Hall sensors or LIN transceivers. |
| Quiescent Current (Sleep) | ≤20 µA - meets OEM battery drain limits for always-on modules (e.g., trunk closure controllers). |
| Wake Input Range | 4.5–28 V - directly interfaces with 12 V/24 V vehicle batteries without level-shifting circuitry. |
| Operating Temp | –40 °C to +150 °C (TJ) - qualified for engine bay placement per AEC-Q100 Grade 1. |
| SPI Interface | 16-bit, full-duplex - enables precise configuration of watchdog windows, cyclic sense intervals, and GPIO modes. |
Pinout & Package
Package: PG-TSDSO-24-1 (exposed pad, 150 mil), RoHS-compliant, thermally optimized for automotive PCB layouts with internal thermal pad soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIO | Digital I/O Supply | Provides 3.3 V or 5 V logic supply for SPI interface and GPIOs; decoupling required near pin. |
| VCC | Main Regulator Input | Battery input (4.5–28 V); feeds both LDOs and internal logic; requires ≥10 µF ceramic input capacitor. |
| VREG1 | Main LDO Output | 5 V ±2%, 150 mA regulated output for MCU core supply; includes overtemperature shutdown. |
| VREG2 | Aux LDO Output | 5 V ±3%, 100 mA with short-to-battery protection; isolated from VREG1 for fault containment. |
| CANH / CANL | CAN FD Bus Interface | Differential pair supporting 5 Mbit/s; integrated common-mode choke drive and bus termination control. |
| WK | HV Wake Input | Bi-level sensitive input (4.5–28 V) enabling wake from Sleep/Stop mode via battery voltage transition. |
| FO | Fail-Safe Output | Open-drain, 200 mA sink; asserts low during overtemperature, undervoltage, or watchdog timeout for ECU reset coordination. |
| TEST | Development Mode Entry | Pulled low to enter SBC Development Mode (watchdog halted, SPI accessible for debug). |
Key Features
| Feature | Design Value |
|---|---|
| Cyclic Wake Function | Configurable 1–65535 ms interval allows periodic bus polling without MCU involvement - reduces system power by >90% vs. always-on CAN listening. |
| Charge Pump Output | Drives external N-channel MOSFET for reverse-polarity protection with spread-spectrum modulation - lowers EMI peaks by 10 dB compared to fixed-frequency pumps. |
| Configurable Watchdog | Window-type watchdog with programmable timeout (0.5–65 s) and window width (25–75%) - prevents runaway code while tolerating deterministic delays. |
| HV GPIO Flexibility | Single pin (FO/GPIO) reconfigurable as Fail Output, Wake Input, High-Side Switch, or Low-Side Switch - reduces BOM count in multi-function ECUs. |
| EMC Optimization | Integrated spread-spectrum clocking on charge pump and slew-rate controlled CAN drivers - meets CISPR 25 Class 5 radiated emission limits without added ferrites. |
Applications
| HVAC Control Unit | Seat Belt Pretensioner |
|---|---|
Use Scenario: Central climate controller managing blower motors, temperature sensors, and damper actuators in premium vehicles. IC Role / Device Role / Timing Role: Primary power manager and CAN FD gateway - supplies MCU, interfaces with body domain CAN, and wakes on HVAC command packets. Use Value: Dual-LDO architecture isolates sensor supply (VREG2) from MCU noise; cyclic wake enables <20 µA sleep current during vehicle off-state. | Use Scenario: Occupant safety module triggering pyrotechnic pretensioners during crash events via CAN-triggered activation. IC Role / Device Role / Timing Role: Safety-critical SBC providing fail-safe power sequencing and CAN FD communication with airbag control unit. Use Value: FO pin directly drives external safety relay; overtemperature/undervoltage protection ensures functional integrity before deployment. |
| Light Control Unit (LCU) | Smart Power Distribution |
Use Scenario: Front/rear lighting ECU controlling LED headlamps, DRLs, and turn signals with adaptive driving beam logic. IC Role / Device Role / Timing Role: System basis chip delivering regulated 5 V to vision processor, CAN FD link to ADAS domain, and HV GPIO for LED driver enable. Use Value: 5 Mbit/s CAN FD supports pixel-level headlamp control messages; HV GPIO configured as high-side switch drives 12 V LED strings directly. | Use Scenario: Zone-based power distribution module replacing fuses with electronic switching for door modules, infotainment, and telematics. IC Role / Device Role / Timing Role: Central SBC supplying power rails, monitoring load currents via HV measurement interface, and reporting faults over CAN FD. Use Value: Integrated HV measurement function replaces external ADC/resistor network; charge pump enables N-MOSFET reverse polarity protection at <10 mm² PCB area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE9471ESXUMA1 | Includes partial networking support (CAN PN) and higher VREG1 current (250 mA), but same package and SPI register map. | Required for ECUs needing selective CAN node wake-up without full bus arbitration. | Select when implementing partial networking for reduced system-wide wake events. |
| MC33816PAE | Offers LIN physical layer and 3.3 V LDO option, but lacks CAN FD (max 1 Mbit/s) and has larger SOIC-32 package. | Used in cost-sensitive body ECUs where LIN coexistence and legacy CAN speed suffice. | Choose for mixed LIN/CAN systems with space tolerance and no FD requirement. |
Compared with TLE9461ESXUMA1, TLE9471ESXUMA1 adds partial networking with identical footprint and software compatibility, while MC33816PAE trades CAN FD performance for LIN integration and legacy packaging - making TLE9461ESXUMA1 optimal for FD-only, space-constrained, and low-quiescent-current designs.
Availability
TLE9461ESXUMA1 is available at Aetrix Electronics and suitable for HVAC ECUs, seat control modules, light control units, and smart power distribution requiring stable component supply, AEC-Q100 compliance, and CAN FD data throughput.
Supply support for TLE9461ESXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and wafer fabrication facilities.
The TLE9461ESXUMA1 belongs to Infineon's Lite CAN SBC family - designed specifically for cost-optimized, low-power automotive ECUs requiring CAN FD connectivity, dual-regulated supplies, and robust HV I/O in compact TSDSO packages.
FAQ
What is the maximum allowable input voltage for VCC?
The absolute maximum rating for VCC is 36 V, but the functional operating range is 4.5 V to 28 V per ISO 16750-2. Operation above 28 V risks permanent damage even if within absolute max limits, and the device enters undervoltage lockout below 4.5 V.
Does TLE9461ESXUMA1 support CAN FD Classic frame format?
Yes - it fully supports both CAN FD Base and CAN FD Extended frame formats per ISO 11898-1:2015, including bit rates up to 5 Mbit/s on the data phase and seamless fallback to 1 Mbit/s Classical CAN for compatibility with legacy nodes.
How is the charge pump output used for reverse-polarity protection?
The CHGP pin drives the gate of an external N-channel MOSFET placed between battery and VCC. During reverse connection, the charge pump holds the MOSFET off, blocking current flow. Spread-spectrum modulation minimizes EMI during normal forward operation.
Can the HV GPIO be used simultaneously as Wake Input and Fail Output?
No - the FO/GPIO pin is functionally multiplexed; it must be configured at startup via SPI as either Fail Output (open-drain, active-low) or General Purpose I/O (with configurable direction and pull). Concurrent wake/fail operation requires separate pins or external logic.
TLE9461ESXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- Lite SBC
- Package/Case:
- 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- System Basis Chip (SBC)
- Applications:
- CAN
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSDSO-24-1
- Grade:
- Automotive
- Qualification:
- AEC-Q100
TLE9461ESXUMA1 FAQ
1.How can I place an order for TLE9461ESXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9461ESXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9461ESXUMA1 reliable?
The price and inventory of TLE9461ESXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9461ESXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE9461ESXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9461ESXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9461ESXUMA1?
TLE9461ESXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9461ESXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9461ESXUMA1?
For technical support, including TLE9461ESXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9461ESXUMA1 requirements.
6.How does Aetrix verify that TLE9461ESXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE9461ESXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9461ESXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE9461ESXUMA1?
All TLE9461ESXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9461ESXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9461ESXUMA1 part is unused and in its original packaging.
Return procedure for TLE9461ESXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9461ESXUMA1 Tags

-
CAP200DG-TL
Power Integrations

-
ATSHA204A-MAHDA-T
Microchip Technology

-
ATSHA204A-SSHDA-T
Microchip Technology

-
ATSHA204A-STUCZ-T
Microchip Technology
-
ATECC608B-MAHDA-T
Microchip Technology
-
ATECC608B-MAHCZ-S
Microchip Technology

-
ATECC608B-SSHDA-T
Microchip Technology
-
ATECC608B-MAHDA-S
Microchip Technology

-
ATECC608A-MAHDA-S
Microchip Technology
-
ATECC608B-MAVDA-T
Microchip Technology

-
ATECC608A-SSHDA-T
Microchip Technology

-
ATECC508A-MAHDA-T
Microchip Technology
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

