Toshiba Semiconductor and Storage TLP2766A(LF4,E

Overview

TLP2766A(LF4,E) from Toshiba Electronic Devices & Storage Corporation is a high-speed, logic-output photocoupler integrating an infrared LED and a photo IC with totem-pole output stage. It delivers 20 MBd data transfer rate, ±20 kV/µs common-mode transient immunity, and 5000 Vrms isolation voltage, enabling robust digital signal isolation in industrial control interfaces.

For engineers reviewing the TLP2766A(LF4,E) datasheet, TLP2766A(LF4,E) pinout, TLP2766A(LF4,E) application, or TLP2766A(LF4,E) equivalent, key selection criteria include its SO6L package height (2.3 mm), threshold input current (≤3.5 mA), propagation delay (≤55 ns), and compliance with UL, cUL, VDE, and CQC safety standards for reinforced insulation.

Technical Context

The TLP2766A(LF4,E) uses an integrated Faraday shield to achieve guaranteed ±20 kV/µs common-mode transient immunity, critical for noise-prone factory automation environments. Its totem-pole output supports both sourcing and sinking currents without external pull-up resistors, simplifying interface design with microcontrollers and FPGAs.

This photocoupler operates across -40°C to +125°C with supply voltage range 2.7–5.5 V and requires a 0.1 µF bypass capacitor between VCC (Pin 6) and GND (Pin 4) for stable high-speed switching - a mandatory design requirement per Toshiba's recommended operating conditions.

Key Specifications

Pinout & Package

Package: SO6L (Toshiba designation 11-4N101A), surface-mount, 6-pin, 2.3 mm max height - 45 % thinner than SDIP6, enabling placement on board backsides and space-constrained modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed logic-output photocoupler applications.

Compared with TLP2766A(LF4,E), the TLP2767A(LF4,E) offers measurable performance uplift in speed and noise immunity while maintaining full mechanical and electrical compatibility; the ACPL-M61T-000E trades certified safety and robustness for lower cost and simpler qualification, making it unsuitable for reinforced insulation requirements.

Availability

TLP2766A(LF4,E) is available at Aetrix Electronics and suitable for factory automation, programmable logic controller (PLC) I/O modules, and high-speed digital interfacing requiring stable component supply, long-term lifecycle support, and traceable safety-certified sourcing.

Supply support for TLP2766A(LF4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and optoelectronics with global manufacturing and quality certifications.

The TLP2766A(LF4,E) belongs to Toshiba's high-speed logic-output photocoupler product line, engineered specifically for noise-immune digital isolation in industrial control, motor drives, and instrumentation where safety certification and timing precision are mandatory.

FAQ

What is the maximum propagation delay specification for TLP2766A(LF4,E) across its full operating temperature range?

The TLP2766A(LF4,E) has a maximum propagation delay time of 55 ns (tpHL and tpLH) over the full operating temperature range of -40°C to +125°C, as specified in Section 12 of the Toshiba datasheet under VCC = 2.7–3.6 V and VCC = 4.5–5.5 V conditions. This value applies to both rising and falling edges and is guaranteed for all units in production.

Does TLP2766A(LF4,E) require an external bypass capacitor, and if so, what are the placement requirements?

Yes, TLP2766A(LF4,E) requires a 0.1 µF ceramic bypass capacitor connected between Pin 6 (VCC) and Pin 4 (GND). Toshiba specifies that this capacitor must be placed within 1 cm of those pins to stabilize the high-gain photo detector and prevent improper switching behavior - a mandatory design requirement confirmed in Section 9 and Figure 14.1.4 of the official datasheet.

What safety standards does TLP2766A(LF4,E) comply with, and is VDE approval included in the base part number?

TLP2766A(LF4,E) is UL-recognized (UL 1577), cUL-recognized (CSA), and CQC-approved (GB4943.1). VDE approval per EN IEC 60747-5-5 and EN IEC 62368-1 requires the D4 option suffix (e.g., TLP2766A(D4-TP,E)); the base TLP2766A(LF4,E) is not VDE-approved unless explicitly ordered with the D4 variant.

Can TLP2766A(LF4,E) be mounted on the same PCB land pattern as Toshiba's SDIP6 packages?

No - although TLP2766A(LF4,E) is compatible with the same land pattern as Toshiba's SDIP6 packages, this refers only to the standard TLP2766A (non-LF4) variant in SO6L package. The LF4 lead-forming option (TLP2766A(LF4,E)) uses a different lead configuration (wide forming, 11-4N101A) and requires its own dedicated land pattern per Figure 16.2 in the datasheet.

What is the function of Pin 2 on TLP2766A(LF4,E), and how should it be handled in PCB layout?

Pin 2 of TLP2766A(LF4,E) is designated N.C. (No Connection) and contains no internal bond wire or circuitry. It must remain unconnected on the PCB - neither routed nor tied to any net - to avoid unintended coupling or mechanical stress on the lead frame. This is explicitly stated in Section 5 (Pin Assignment) of the Toshiba datasheet.