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Toshiba Semiconductor and Storage TLP3100(F)

Part No.:
TLP3100(F)
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Solid State Relays (SSR)
Package:
6-SMD, Gull Wing
Datasheet:
AetrixTLP3100(F).pdf
Description:
SSR RELAY SPST-NO 2.5A 0-20V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,402

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Product details

Overview

TLP3100(F) from Toshiba Electronic Devices & Storage Corporation is a surface-mount photorelay IC comprising an infrared LED optically coupled to a photo-MOSFET in a 6-pin SOP package. It delivers 2.5 A max ON-state current, 0.05 Ω max ON-resistance, and 1500 Vrms isolation voltage, enabling reliable DC/AC power line switching in factory automation and measurement equipment.

For engineers reviewing the TLP3100(F) datasheet, TLP3100(F) pinout, TLP3100(F) application, or TLP3100(F) equivalent, key selection criteria include its normally-open (Form A) configuration, 3 mA max trigger LED current, 20 V min OFF-state voltage, thermal derating behavior above 50°C, and UL/cUL recognition per UL 1577 and CSA Component Acceptance Service No.5A.

Technical Context

The TLP3100(F) integrates a GaAs infrared LED and a dual-drain photo-MOSFET output stage with isolated gate drive. Its optical coupling enables galvanic isolation while supporting both A-connection (single-channel) and C-connection (parallel drain) configurations for higher current handling up to 5.0 A.

Switching performance is characterized by 1.5 ms typical turn-on time and 0.1 ms typical turn-off time at VDD = 10 V and RL = 200 Ω. Input-to-output capacitance is only 0.8 pF (typ.), minimizing signal coupling noise in high-speed control loops.

Key Specifications

ParameterValue and Actual Design Meaning
Isolation Voltage1500 Vrms min - meets basic insulation requirements for industrial control interfaces
ON-State Current2.5 A max at Ta = 50°C - supports medium-power load switching without external heatsinking
ON-State Resistance0.02 Ω typ., 0.05 Ω max - ensures low conduction loss (<50 mW at 2.5 A)
Trigger LED Current3 mA max - compatible with standard microcontroller GPIOs without buffer stages
OFF-State Voltage20 V min - suitable for 12–24 V DC control bus and low-voltage AC line sensing
Package6-pin SOP (2.54 mm pitch, 2.1 mm height) - compatible with standard SMT reflow profiles
Operating Temperature−40 to +85°C - validated for use in industrial ambient environments

Pinout & Package

6-pin SOP (2.54SOP6) package: 2.1 mm height, 2.54 mm pitch, 0.13 g typical weight. Pin 3 is NC; pins 4 and 6 are parallel-connected drains for C-connection operation.

Pin/TerminalCircuit RoleDesign Meaning
1AnodeLED anode - connect to current-limited driver (e.g., MCU GPIO + series resistor)
2CathodeLED cathode - reference ground for input side
3N.C.No internal connection - must remain unconnected
4Drain D1Output MOSFET drain terminal - used singly (A) or in parallel with pin 6 (C)
5SourceCommon MOSFET source - return path for load current
6Drain D2Second MOSFET drain - paralleled with pin 4 in C-connection for 5.0 A capability

Key Features

FeatureDesign Value
Optically isolated MOSFET switchEliminates ground loop issues between control and power domains
Low ON-resistance (0.02 Ω typ.)Reduces I²R heating and enables compact PCB layout without forced air cooling
UL/cUL recognized (File E67349)Satisfies safety certification requirements for industrial end-equipment compliance
ESD-sensitive handling requirementMandates grounded workstations and anti-static packaging - critical for manufacturing yield
Three configurable output connections (A/B/C)Supports flexible design reuse: single-channel (A), dual-path (B), or high-current parallel (C)

Applications

Industrial Power Line ControlFactory Automation I/O Modules

Use Scenario: Switching 24 V DC solenoids and indicator lamps in PLC-controlled machinery.

IC Role / Device Role / Timing Role: Solid-state relay replacement providing zero-crossing–free switching for DC loads.

Use Value: Enables silent, bounce-free actuation with 2.5 A current capacity and <5 ms total switching time.

Use Scenario: Isolated digital output channel in modular I/O systems interfacing with microcontrollers.

IC Role / Device Role / Timing Role: Galvanically isolated load driver with integrated MOSFET output stage.

Use Value: Eliminates need for external optocoupler + discrete MOSFET, reducing BOM count and board area.

Test & Measurement EquipmentEnergy Monitoring Systems

Use Scenario: Remote-controlled power sequencing of instrument subsystems during calibration cycles.

IC Role / Device Role / Timing Role: High-reliability, low-leakage (10 nA max OFF-state) switching element.

Use Value: Ensures accurate low-current measurements by preventing leakage-induced offset errors.

Use Scenario: Controlling auxiliary circuits (e.g., sensor bias, communication interface enable) in smart meters.

IC Role / Device Role / Timing Role: Low-power, thermally stable load switch operating across −40 to +85°C.

Use Value: Maintains consistent ON-resistance over temperature, avoiding gain drift in metering front-ends.

Equivalent & Alternatives

The following parts are listed as comparable options for similar photorelay applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PVG612AHigher 3.5 A max ON-current but larger SO-6 package (3.5 mm height); 0.015 Ω RON typ.Better suited for space-constrained 24 V DC motor control where thermal margin is critical.Select when higher current density and lower RON outweigh height constraints.
APV1121Lower 1.5 A max ON-current; 0.12 Ω RON max; smaller 2.0 mm height SOP package.Targeted at low-power signal routing rather than power switching; not rated for >1 A continuous loads.Choose only for sub-1 A logic-level switching where minimal profile is mandatory.

Compared with PVG612A and APV1121, the TLP3100(F) offers balanced performance: mid-range current rating (2.5 A), ultra-low RON (0.02 Ω typ.), and industry-standard 2.1 mm SOP height - making it optimal for general-purpose industrial power switching where footprint, thermal behavior, and certification alignment are jointly prioritized.

Availability

TLP3100(F) is available at Aetrix Electronics and suitable for factory automation I/O modules, industrial power line control, and test & measurement equipment requiring stable component supply and long-term lifecycle support.

Supply support for TLP3100(F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures semiconductor components with emphasis on reliability, safety certification, and industrial-grade robustness.

The TLP3100(F) belongs to Toshiba's photorelay product line, engineered specifically for replacing mechanical relays in DC/low-voltage AC power switching applications where long life, silent operation, and high isolation integrity are required.

FAQ

What is the maximum allowable ambient temperature for continuous operation of the TLP3100(F)?

The TLP3100(F) supports continuous operation from −40°C to +85°C ambient temperature. Derating begins at Ta = 50°C for ON-state current (−33.3 mA/°C for A-connection) and at Ta = 25°C for LED forward current (−0.3 mA/°C). These limits ensure junction temperature remains ≤125°C under specified load conditions.

Can the TLP3100(F) be used to switch AC loads?

Yes, the TLP3100(F) can switch AC loads up to 20 V peak due to its 20 V minimum OFF-state voltage rating and Form A (normally open) configuration. However, it is not zero-crossing synchronized - use requires external snubbing for inductive AC loads to prevent voltage transients exceeding VOFF.

How does the C-connection configuration affect the TLP3100(F) performance?

In C-connection mode, pins 4 and 6 are paralleled to double current capacity to 5.0 A max (Ta = 50°C) and reduce ON-resistance to 0.005 Ω typ. This configuration requires symmetric PCB layout and matched trace impedance to avoid current imbalance; the TLP3100(F) datasheet specifies identical RON characteristics for both drains under matched conditions.

What is the isolation capacitance specification for the TLP3100(F), and why does it matter?

The TLP3100(F) has 0.8 pF typical input-to-output capacitance (CS). This ultra-low value minimizes capacitive coupling noise between control and power sides - critical in precision analog systems like energy meters or medical instrumentation where signal integrity must be preserved across isolation barriers.

Is the TLP3100(F) compliant with RoHS and REACH regulations?

Yes, the TLP3100(F) complies with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Toshiba confirms lead-free solderability and absence of restricted substances; full compliance documentation is available via Toshiba's official product page and authorized distributor portals.

TLP3100(F) Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TLP3100
Packaging:
Tube
Product Status:
Active
Mounting Type:
Surface Mount
Circuit:
SPST-NO (1 Form A)
Output Type:
AC, DC
Voltage - Input:
1.33VDC
Voltage - Load:
0 V ~ 20 V
Load Current:
2.5 A
On-State Resistance (Max):
50 mOhms
Termination Style:
Gull Wing
Operating Temperature:
-40°C ~ 85°C
Supplier Device Package:
6-SOP (2.54mm)
Approval Agency:
CSA, cUL, UL
Grade:
-
Qualification:
-

TLP3100(F) FAQ

1.How can I place an order for TLP3100(F) through Aetrix?

Please submit a Request for Quotation (RFQ) for TLP3100(F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLP3100(F) reliable?

The price and inventory of TLP3100(F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3100(F) is usually 5 days.

3.What payment methods are accepted for TLP3100(F)?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3100(F) transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLP3100(F)?

TLP3100(F) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLP3100(F) order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLP3100(F)?

For technical support, including TLP3100(F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3100(F) requirements.

6.How does Aetrix verify that TLP3100(F) is sourced from the original manufacturer or authorized distributors?

All TLP3100(F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3100(F) meets industry standards.

7.What is the process for return or replacement of TLP3100(F)?

All TLP3100(F) units undergo pre-shipment inspection (PSI). If there is an issue with TLP3100(F), returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLP3100(F) part is unused and in its original packaging.

Return procedure for TLP3100(F):

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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