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Toshiba Semiconductor and Storage TLP3149(TP,F

Part No.:
TLP3149(TP,F
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Solid State Relays (SSR)
Package:
4-SMD, Gull Wing
Datasheet:
AetrixTLP3149(TP,F.pdf
Description:
SSR RELAY SPST-NO 1.5A 0-100V
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,467

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Product details

Overview

TLP3149(TP,F) from Toshiba Electronic Devices & Storage Corporation is a normally-open photorelay IC comprising an infrared LED optically coupled to a photo-MOSFET output stage. It delivers 1.5 A max ON-state current, 200 mΩ max ON-resistance, and 100 V OFF-state voltage in a compact 4-pin SOP package (2.54 mm pitch, 2.1 mm height), enabling solid-state replacement of mechanical relays in power line switching for ATE and factory automation.

For engineers reviewing the TLP3149(TP,F) datasheet, TLP3149(TP,F) pinout, TLP3149(TP,F) application, or TLP3149(TP,F) equivalent, key selection criteria include verified isolation voltage (1500 Vrms), low trigger LED current (≤3 mA), thermal derating behavior, and dual-drain output configuration for high-current load control without external paralleling.

Technical Context

The TLP3149(TP,F) implements optical isolation between input and output stages using GaAs-based infrared LED excitation and silicon MOSFET conduction. Its internal structure treats Pins 1–2 as a single anode–cathode pair and Pins 3–4 as a common drain output, forming a true 2-terminal device with symmetrical current-handling capability.

It operates under recommended conditions of 5–80 V supply, ≤25 mA forward LED current, and −40°C to +110°C ambient temperature. Switching performance is characterized at 20 V, 5 mA drive, delivering typical turn-on/turn-off times of 0.4 ms / 0.15 ms into a 200 Ω load - optimized for fast, low-noise I/O interface and test equipment sequencing.

Key Specifications

Parameter Value and Actual Design Meaning
OFF-state voltage 100 V - supports direct switching of 24–48 V DC control lines and low-voltage AC mains derivatives
ON-state current 1.5 A max - enables driving solenoids, small motors, or PLC output modules without external amplification
ON-resistance 200 mΩ max - limits conduction loss to ≤450 mW at 1.5 A, reducing thermal stress in sealed enclosures
Trigger LED current 3 mA max - compatible with standard microcontroller GPIOs without buffer transistors
Isolation voltage 1500 Vrms min - meets UL1577 and CSA Component Acceptance requirements for reinforced insulation
Output capacitance 160 pF typ. - ensures minimal signal coupling and fast edge integrity in high-speed digital I/O applications
Turn-on time 2.0 ms max - guarantees deterministic response in automated test sequencing with sub-10 ms timing windows

Pinout & Package

Package: SOP-4 (TOSHIBA designation 11-5H1S), 2.54 mm lead pitch, 2.1 mm height, 0.1 g typical weight. Surface-mount compatible with standard reflow profiles (peak 260°C, ≤10 s).

Pin/Terminal Circuit Role Design Meaning
1 (Anode) LED anode Positive input terminal for infrared LED; must be driven with current-limited source (e.g., series resistor from MCU GPIO)
2 (Cathode) LED cathode Return path for LED current; tied internally to Pin 1 for bidirectional drive capability in some configurations
3 (Drain) MOSFET drain 1 High-side or low-side load connection point; electrically shorted to Pin 4 for parallel current sharing
4 (Drain) MOSFET drain 2 Second drain terminal - identical to Pin 3; used to reduce trace resistance and improve thermal distribution on PCB

Key Features

Feature Design Value
Normally-open (1-Form-A) topology Ensures fail-safe open-circuit behavior during LED deactivation - critical for safety-critical I/O isolation
Dual-drain output configuration Reduces effective on-resistance and thermal gradient across package by distributing 1.5 A across two pins
Low trigger LED current (≤3 mA) Eliminates need for driver transistors when interfacing with 3.3 V or 5 V logic, simplifying BOM and layout
1500 Vrms isolation rating Supports functional safety compliance in industrial control systems without additional barrier components
160 pF output capacitance Minimizes crosstalk and timing skew in multi-channel relay banks used in ATE fixture scanning

Applications

ATE Fixture Control Industrial I/O Interface

Use Scenario: High-density semiconductor test fixtures requiring independent channel switching of DUT power rails and signal paths.

IC Role / Device Role / Timing Role: Solid-state relay providing galvanically isolated, low-jitter ON/OFF control of 24 V DC power domains per channel.

Use Value: Enables 100+ channel scalability with <2 ms switching and no contact wear, extending fixture lifetime beyond 10 million cycles.

Use Scenario: PLC digital output modules needing reliable, noise-immune switching of 24 V sensors and actuators in factory environments.

IC Role / Device Role / Timing Role: Isolated output driver replacing electromechanical relays in DIN-rail mounted I/O cards.

Use Value: Delivers 1.5 A per channel with 1500 Vrms isolation, eliminating coil-induced EMI and enabling faster scan rates.

Measuring Instrument Power Gating Mechanical Relay Replacement

Use Scenario: Benchtop multimeters and oscilloscopes requiring precision power sequencing of internal analog front-end sections.

IC Role / Device Role / Timing Role: Low-leakage (≤1 µA @ 100 V) photorelay controlling bias voltage rails to minimize measurement offset drift.

Use Value: Maintains <0.1% gain stability over temperature due to stable RON (120–200 mΩ) and negligible off-state leakage.

Use Scenario: Embedded controllers replacing 12 V/24 V mechanical relays in HVAC control panels and vending machines.

IC Role / Device Role / Timing Role: Drop-in solid-state alternative with identical 4-pin footprint and compatible drive logic.

Use Value: Eliminates audible click, contact bounce, and arcing - improving reliability in high-cycle-count consumer appliances.

Equivalent & Alternatives

The following parts are listed as comparable options for similar photorelay applications.

Alternative Part Technical Difference Application Difference Selection Advice
PVG612A Higher 250 V OFF-state rating; 1.2 A max ON-current; 350 mΩ RON; SO-6 package Better suited for higher-voltage industrial controls but lower current capacity and larger footprint Select when >100 V isolation margin is required and 1.2 A load current suffices
PS8501-AX 100 V OFF-state; 1.0 A max ON-current; 300 mΩ RON; 4-pin SSOP with 1.27 mm pitch Smaller package but reduced current handling and higher RON increases conduction loss Prefer for space-constrained designs where 1.0 A load capability is adequate

Compared with PVG612A and PS8501-AX, the TLP3149(TP,F) offers optimal balance of 1.5 A current, 200 mΩ RON, and 4-pin SOP compatibility - making it the preferred choice for cost-sensitive, high-reliability 24–48 V DC power switching where thermal efficiency and PCB real estate are jointly constrained.

Availability

TLP3149(TP,F) is available at Aetrix Electronics and suitable for automatic test equipment (ATE), industrial I/O interface boards, and factory automation systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for TLP3149(TP,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics with emphasis on reliability, safety certification, and industrial-grade performance.

The TLP3149(TP,F) belongs to Toshiba's photorelay product line, engineered specifically for solid-state replacement of electromechanical relays in high-cycle, noise-sensitive industrial control and test instrumentation applications.

FAQ

What is the maximum continuous ON-state current rating for the TLP3149(TP,F)?

The TLP3149(TP,F) supports a maximum continuous ON-state current of 1.5 A at 25°C ambient, derating linearly to zero at 110°C case temperature. This rating assumes proper PCB copper area (≥100 mm² per drain pin) and free-air convection. Exceeding this limit risks thermal runaway due to the MOSFET's positive temperature coefficient of RON. Always verify actual board-level thermal performance using the TLP3149(TP,F)'s published ION–Ta curve (Fig. 12.2).

Does the TLP3149(TP,F) require an external current-limiting resistor on the LED side?

Yes - the TLP3149(TP,F) requires an external series resistor to limit LED forward current to ≤3 mA (max trigger) and ≤30 mA (absolute max). For a 5 V MCU GPIO, a 1.2 kΩ resistor yields ~3.3 mA at VF = 1.65 V, satisfying both trigger and reliability margins. The TLP3149(TP,F) does not integrate LED current regulation, so resistor selection must account for VF variation (1.5–1.8 V) and supply tolerance.

Can Pins 3 and 4 of the TLP3149(TP,F) be used independently?

No - Pins 3 and 4 are internally shorted drain terminals of the same photo-MOSFET die. They must be routed to the same net on the PCB to maintain rated 1.5 A current and thermal balance. Using them separately violates the TLP3149(TP,F)'s internal construction (confirmed in Note 1 of Absolute Maximum Ratings) and may cause uneven current sharing, localized heating, and premature failure.

What safety certifications does the TLP3149(TP,F) hold?

The TLP3149(TP,F) is UL1577 certified (File No. E67349) and cUL-approved under CSA Component Acceptance Service (File No. E67349), both validating its 1500 Vrms isolation rating. These certifications cover dielectric withstand, partial discharge, and creepage/clearance compliance for industrial equipment. The TLP3149(TP,F) does not carry IEC 60747-5-5 or VDE 0884-10 certification, limiting use in reinforced insulation systems requiring those standards.

How does the TLP3149(TP,F) behave under pulsed load conditions?

The TLP3149(TP,F) supports pulsed ON-state current up to 4.5 A (100 µs pulse, 100 pps) - three times its DC rating - provided duty cycle remains ≤1%. This allows brief inrush current handling for capacitive loads or solenoid actuation. However, the TLP3149(TP,F)'s thermal time constant requires ≥10 ms off-time between pulses to prevent junction temperature accumulation beyond 125°C. Pulse operation must reference Fig. 12.2 (ION–Ta) and Fig. 12.5 (RON–Ta) for derating.

TLP3149(TP,F Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TLP3149
Packaging:
Tape & Reel (TR)
Product Status:
Active
Mounting Type:
Surface Mount
Circuit:
SPST-NO (1 Form A)
Output Type:
AC, DC
Voltage - Input:
1.65VDC
Voltage - Load:
0 V ~ 100 V
Load Current:
1.5 A
On-State Resistance (Max):
200 mOhms
Termination Style:
Gull Wing
Operating Temperature:
-40°C ~ 110°C
Supplier Device Package:
4-SOP
Approval Agency:
CSA, cUL, UL
Grade:
-
Qualification:
-

TLP3149(TP,F FAQ

1.How can I place an order for TLP3149(TP,F through Aetrix?

Please submit a Request for Quotation (RFQ) for TLP3149(TP,F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLP3149(TP,F reliable?

The price and inventory of TLP3149(TP,F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3149(TP,F is usually 5 days.

3.What payment methods are accepted for TLP3149(TP,F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3149(TP,F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLP3149(TP,F?

TLP3149(TP,F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLP3149(TP,F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLP3149(TP,F?

For technical support, including TLP3149(TP,F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3149(TP,F requirements.

6.How does Aetrix verify that TLP3149(TP,F is sourced from the original manufacturer or authorized distributors?

All TLP3149(TP,F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3149(TP,F meets industry standards.

7.What is the process for return or replacement of TLP3149(TP,F?

All TLP3149(TP,F units undergo pre-shipment inspection (PSI). If there is an issue with TLP3149(TP,F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLP3149(TP,F part is unused and in its original packaging.

Return procedure for TLP3149(TP,F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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