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Toshiba Semiconductor and Storage TLP3350(TP15,F)
- Part No.:
- TLP3350(TP15,F)
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Solid State Relays (SSR)
- Package:
- 4-SMD (0.128", 3.25mm)
- Datasheet:
-
TLP3350(TP15,F).pdf
- Description:
- SSR RELAY SPST-NO 200MA 0-20V
- Quantity:
- Payment:
- Shipping:
Inventory:2,948
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Product details
Overview
TLP3350(TP15,F) from Toshiba Electronic Devices & Storage Corporation is a normally-open photorelay in a 4-pin USOP-4 (11-2C1S) package, featuring 0.8 pF typical OFF-state capacitance, 3 Ω typical ON-state resistance, and 1000 Vrms isolation voltage. It is designed for high-frequency signal switching in automated test equipment including memory and logic IC testers.
For engineers reviewing the TLP3350(TP15,F) datasheet, TLP3350(TP15,F) pinout, TLP3350(TP15,F) application, or TLP3350(TP15,F) equivalent, key selection criteria include low COFF for RF signal integrity, 200 mA max ON-state current capability, and UL 1577 recognition for safety-critical ATE designs.
Technical Context
The TLP3350(TP15,F) integrates a GaAs infrared LED optically coupled to a photo-MOSFET output stage, forming a single-pole, single-throw (1-Form-A) solid-state relay. Its internal structure treats Pins 1–2 as a single anode–cathode pair and Pins 3–4 as a common drain output terminal.
Switching performance is defined by 40 µs typical turn-on time and 130 µs typical turn-off time at 10 V supply and 5 mA LED drive. The device operates within –40 °C to +85 °C ambient temperature and supports up to 20 V OFF-state output voltage with <1 nA leakage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Type | Normally open (1-Form-A) photorelay - enables default-open signal path critical for fail-safe tester channel isolation |
| OFF-State Capacitance | 0.8 pF typ., 1.1 pF max - ensures minimal RF signal distortion and crosstalk in >100 MHz test fixtures |
| ON-State Resistance | 3 Ω typ., 5 Ω max - maintains low insertion loss and voltage drop under 200 mA DC load conditions |
| Isolation Voltage | 1000 Vrms min - meets UL 1577 requirements for galvanic separation between tester controller and DUT interface |
| Trigger LED Current | ≤3 mA max - allows direct drive from low-power logic outputs without external current amplification |
| Switching Speed | 40 µs tON / 130 µs tOFF typ. - supports sub-10 kHz channel switching rates in high-throughput ATE systems |
Pinout & Package
Package: USOP-4 (Toshiba designation 11-2C1S), surface-mount, 0.03 g typical weight, 1.6 × 2.8 × 1.05 mm body dimensions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Anode) | LED input anode | Connects to positive side of driving circuit; paired internally with Pin 2 for LED operation |
| 2 (Cathode) | LED input cathode | Completes LED forward path; shorted internally to Pin 1 per two-terminal modeling convention |
| 3 (Drain) | Output MOSFET drain | High-side switch node; electrically tied to Pin 4 for dual-drain configuration and thermal sharing |
| 4 (Drain) | Output MOSFET drain | Redundant drain terminal - improves current handling and reduces RDS(on) via parallel conduction path |
Key Features
| Feature | Design Value |
|---|---|
| Low COFF for RF integrity | 0.8 pF typ. - preserves signal fidelity in RF measuring instruments operating up to 100 MHz |
| UL 1577 certification | 1000 Vrms isolation - satisfies safety compliance for automatic test equipment with operator-accessible interfaces |
| ESD-sensitive design | Requires antistatic handling per JESD22-A114 - prevents gate oxide damage during PCB assembly of high-density ATE backplanes |
| Thermal derating support | –2.0 mA/°C ION derating above 25 °C - enables accurate current margining in compact, convection-cooled tester modules |
Applications
| High-Speed Memory Testers | High-Speed Logic IC Testers |
|---|---|
Use Scenario: Channel multiplexing and DUT power sequencing in memory wafer sort and burn-in systems. IC Role / Device Role / Timing Role: Solid-state relay isolating tester pattern generator outputs from memory device pins during voltage ramping and functional test phases. Use Value: 0.8 pF COFF minimizes capacitive loading on high-speed address/data buses, preserving edge integrity at >100 MHz clock rates. | Use Scenario: Signal routing and stimulus isolation in logic IC functional testers with multi-site parallel test capability. IC Role / Device Role / Timing Role: Low-RON photorelay enabling fast channel enable/disable cycles between vector patterns and measurement windows. Use Value: 3 Ω RON and 40 µs tON allow sub-microsecond switching transitions, reducing per-cycle overhead in scan-based ATPG execution. |
| Radio-Frequency Measuring Instruments | ATE (Automatic Test Equipment) |
Use Scenario: RF path selection and calibration loop switching in vector network analyzers and spectrum analyzers. IC Role / Device Role / Timing Role: High-isolation, low-capacitance switch controlling signal flow between source, load, and detector paths. Use Value: 1000 Vrms isolation and <1 nA IOFF prevent measurement drift caused by ground-loop currents in sensitive RF front-ends. | Use Scenario: Modular fixture interface control across mixed-signal, RF, and digital ATE platforms. IC Role / Device Role / Timing Role: Safety-rated signal gate managing interlock signals, power enable lines, and DUT communication channels. Use Value: UL 1577 recognition and 20 V VOFF rating support safe, standards-compliant integration into Class I and II ATE chassis architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photorelay applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PVG612A | Higher COFF (2.5 pF typ.), lower VOFF (12 V), same USOP-4 footprint | Optimized for general-purpose industrial I/O rather than RF-grade ATE signal routing | Select when cost sensitivity outweighs RF bandwidth requirements and UL certification is not mandated |
| PS8501-AX | Higher ION (500 mA), slower tOFF (300 µs typ.), larger SOIC-4 package | Better suited for power-switching roles in programmable load banks and power supply sequencing | Prefer when higher current capacity is required and board space permits SOIC-4 layout |
Compared with PVG612A and PS8501-AX, the TLP3350(TP15,F) delivers superior RF signal integrity due to its 0.8 pF COFF and 1000 Vrms isolation, making it uniquely suitable for high-speed ATE where channel crosstalk and safety compliance are non-negotiable.
Availability
TLP3350(TP15,F) is available at Aetrix Electronics and suitable for high-speed memory testers, RF measuring instruments, and automatic test equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TLP3350(TP15,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics for industrial, automotive, and test equipment markets.
The TLP3350(TP15,F) belongs to Toshiba's photorelay product line, engineered specifically for high-frequency signal switching in automated test systems where low capacitance, fast timing, and safety isolation are mandatory.
FAQ
What is the maximum recommended operating temperature for the TLP3350(TP15,F)?
The TLP3350(TP15,F) has a specified operating temperature range of –40 °C to +85 °C. This range applies to ambient conditions during normal operation and aligns with industrial ATE environments. Derating of ON-state current begins above 25 °C at –2.0 mA/°C, and junction temperature must remain ≤125 °C. Thermal design for the TLP3350(TP15,F) should account for PCB copper area and airflow in densely packed tester modules.
Does the TLP3350(TP15,F) support direct microcontroller GPIO drive?
Yes, the TLP3350(TP15,F) supports direct drive from standard 3.3 V or 5 V microcontroller GPIOs because its maximum trigger LED current is only 3 mA. With a typical forward voltage of 1.15 V at 10 mA, even a 3.3 V MCU output can deliver sufficient current through a simple series resistor (e.g., 680 Ω for ~3.3 mA). No external transistor buffer is needed for most logic-level control applications involving the TLP3350(TP15,F).
What safety certifications does the TLP3350(TP15,F) hold?
The TLP3350(TP15,F) is UL-recognized under UL 1577 (File No. E67349) with a minimum isolation voltage of 1000 Vrms. It meets the dielectric withstand and insulation resistance requirements for reinforced insulation in measurement and control equipment. The device is not certified to IEC 60747-5-5 or VDE 0884-11, so designs requiring those standards must verify compliance separately. All safety-related testing for the TLP3350(TP15,F) was performed per UL 1577 Annex G.
How is the dual-drain configuration (Pins 3 and 4) used in PCB layout for the TLP3350(TP15,F)?
Pins 3 and 4 of the TLP3350(TP15,F) are internally shorted drain terminals and must be connected to the same net on the PCB - typically the switched signal path or load return. This dual-pin arrangement lowers effective RDS(on) and improves thermal dissipation. Layout best practice is to route both pins to a shared copper pour with ≥2 oz copper and thermal vias to inner layers, especially when operating near the 200 mA maximum continuous current rating of the TLP3350(TP15,F).
Can the TLP3350(TP15,F) switch AC signals?
The TLP3350(TP15,F) is a unidirectional photorelay optimized for DC and pulsed DC switching. Its MOSFET output lacks intrinsic body diode symmetry and is not rated for bidirectional AC conduction. While it may pass small AC signals below 20 V peak-to-peak with minimal distortion due to low COFF, Toshiba does not specify or guarantee AC switching performance. For true AC signal routing, a complementary photorelay pair or dedicated AC phototriac such as the TLP3906 should be used instead of the TLP3350(TP15,F).
TLP3350(TP15,F) Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TLP3350
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Mounting Type:
- Surface Mount
- Circuit:
- SPST-NO (1 Form A)
- Output Type:
- AC, DC
- Voltage - Input:
- 1.15VDC
- Voltage - Load:
- 0 V ~ 20 V
- Load Current:
- 200 mA
- On-State Resistance (Max):
- 5 Ohms
- Termination Style:
- SMD (SMT) Tab
- Operating Temperature:
- -40°C ~ 85°C
- Supplier Device Package:
- 4-USOP
- Approval Agency:
- UL
- Grade:
- -
- Qualification:
- -
TLP3350(TP15,F) FAQ
1.How can I place an order for TLP3350(TP15,F) through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP3350(TP15,F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP3350(TP15,F) reliable?
The price and inventory of TLP3350(TP15,F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3350(TP15,F) is usually 5 days.
3.What payment methods are accepted for TLP3350(TP15,F)?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3350(TP15,F) transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP3350(TP15,F)?
TLP3350(TP15,F) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP3350(TP15,F) order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP3350(TP15,F)?
For technical support, including TLP3350(TP15,F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3350(TP15,F) requirements.
6.How does Aetrix verify that TLP3350(TP15,F) is sourced from the original manufacturer or authorized distributors?
All TLP3350(TP15,F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3350(TP15,F) meets industry standards.
7.What is the process for return or replacement of TLP3350(TP15,F)?
All TLP3350(TP15,F) units undergo pre-shipment inspection (PSI). If there is an issue with TLP3350(TP15,F), returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP3350(TP15,F) part is unused and in its original packaging.
Return procedure for TLP3350(TP15,F):
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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