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Toshiba Semiconductor and Storage TLP3407S(TP,E
- Part No.:
- TLP3407S(TP,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Solid State Relays (SSR)
- Package:
- 4-SMD (0.079", 2.00mm)
- Datasheet:
-
TLP3407S(TP,E.pdf
- Description:
- SSR RELAY SPST-NO 1A 0-60V
- Quantity:
- Payment:
- Shipping:
Inventory:9,400
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Product details
Overview
TLP3407S(TP,E from Toshiba Electronic Devices & Storage Corporation is a photorelay IC comprising an infrared LED optically coupled to a photo MOSFET in a S-VSON4T package. It delivers 1.0 A max ON-state current, 0.3 Ω max ON-resistance, and 60 V min OFF-state voltage-enabling high-speed, low-loss switching in automated test equipment signal paths.
For engineers reviewing the TLP3407S(TP,E datasheet, TLP3407S(TP,E pinout, TLP3407S(TP,E application, or TLP3407S(TP,E equivalent, key selection criteria include isolation voltage (500 Vrms), trigger LED current (≤3 mA), switching speed (0.4 ms turn-on), halogen-free compliance, and S-VSON4T footprint compatibility with high-density probe card layouts.
Technical Context
The TLP3407S(TP,E implements optical isolation between input LED and output photo MOSFET, eliminating ground-loop interference in sensitive measurement circuits. Its two-terminal configuration-pins 1&2 shorted (LED anode/cathode), pins 3&4 shorted (MOSFET drain)-simplifies PCB routing while maintaining 500 Vrms isolation.
Designed for high-speed logic and memory tester applications, it supports 20 V supply voltage operation with 0.04 ms typical turn-off time and ≤150 pF output capacitance-minimizing signal distortion during fast digital waveform switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ON-state resistance | 0.3 Ω max - enables low conduction loss at 1 A load, critical for thermal stability in densely packed ATE fixtures. |
| OFF-state voltage | 60 V min - supports safe switching of logic-level signals up to 48 V supply rails without breakdown. |
| Trigger LED current | 3 mA max - allows direct drive from low-power FPGA I/O or microcontroller GPIO without external amplification. |
| Isolation voltage | 500 Vrms - meets reinforced insulation requirements for functional safety in Class I test systems. |
| Turn-on time | 2.0 ms max - ensures deterministic timing alignment in sub-millisecond test cycles. |
| Package size | S-VSON4T: 1.45 mm × 2.0 mm - fits high-pin-count probe cards where board area is constrained to <3 mm² per channel. |
| Halogen-free | Compliant per Toshiba specification - satisfies IPC-4101D and JEDEC J-STD-709B for green manufacturing. |
Pinout & Package
S-VSON4T package (Toshiba designation: 11-2E2), height ≤1.4 mm, weight 0.01 g (typ.), halogen-free epoxy molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | LED anode input - connects to positive side of driving circuit; requires current-limiting resistor for 3 mA max trigger. |
| 2 | Cathode | LED cathode input - referenced to system ground; combined with Pin 1 forms isolated input port. |
| 3 | Drain | MOSFET drain output - tied internally to Pin 4; serves as high-side or low-side switch node depending on external circuit topology. |
| 4 | Drain | MOSFET drain output - shorted to Pin 3 per datasheet Note 1; provides dual-pad layout for enhanced thermal dissipation and solder joint reliability. |
Key Features
| Feature | Design Value |
|---|---|
| Normally-open (1-Form-A) configuration | Ensures fail-safe open-circuit state when unpowered-critical for preventing unintended signal injection during tester boot or fault conditions. |
| Low input capacitance (≤1 pF) | Minimizes loading on high-frequency LED drive lines, preserving edge integrity in >10 MHz pulse modulation schemes. |
| High OFF-state resistance (≥10¹⁴ Ω) | Prevents leakage-induced false triggering in multi-channel parallel test setups with shared reference planes. |
| ESD-sensitive handling requirement | Mandates anti-static workstations and ionized air control-aligned with JEDEC JS-001 Class 2 (2 kV HBM) protection level. |
| Moisture sensitivity level (MSL) 3 | Requires assembly within 168 hours of tape-and-reel opening or baking at 60°C for 64–72 hrs-ensuring void-free reflow in fine-pitch SMT processes. |
Applications
| Probe Card Signal Switching | ATE Channel Multiplexing |
|---|---|
|
Use Scenario: Routing DUT signals between multiple test instruments in wafer-level probe cards with >1000 channels. IC Role / Device Role / Timing Role: Solid-state relay replacing electromechanical switches to eliminate bounce, wear, and contact resistance drift. Use Value: Enables 0.4 ms turn-on time and <150 pF output capacitance-preserving signal fidelity for >100 MHz digital test patterns without added jitter. |
Use Scenario: Selecting one of 32 parallel test channels in automatic test equipment for semiconductor validation. IC Role / Device Role / Timing Role: Isolated analog/digital signal path selector with galvanic separation between instrument and DUT grounds. Use Value: Provides 500 Vrms isolation and ≤1 µA OFF-state leakage-preventing cross-talk and ground loop errors across mixed-signal test benches. |
| High-Speed Logic IC Testing | Memory Tester Load Board Switching |
|
Use Scenario: Applying precise voltage levels to logic inputs during AC parametric testing of FPGAs and ASICs. IC Role / Device Role / Timing Role: Low-RON switch controlling power delivery to DUT I/O banks under programmable timing control. Use Value: Delivers 1.0 A max current with 0.3 Ω max RON-reducing voltage drop to <300 mV at full load and enabling accurate VIH/VIL margining. |
Use Scenario: Enabling/disabling DDR4/DDR5 termination networks on memory load boards during calibration sequences. IC Role / Device Role / Timing Role: High-reliability, low-inductance switching element for dynamic impedance matching circuits. Use Value: Supports 200+ million switching cycles with no degradation-meeting lifetime requirements for production memory testers operating 24/7. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photorelay applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLP3406S(TP,E | Lower ON-state current (0.8 A max) and higher RON (0.4 Ω max); identical S-VSON4T package and pinout. | Rated for lower continuous current loads-suitable where thermal budget limits peak current to ≤800 mA. | Select TLP3406S(TP,E only if system-level current derating or ambient temperature constraints reduce required load below 1 A. |
| PS8501-AX | SOIC-4 package (5.0 mm × 3.8 mm), 5000 Vrms isolation, 0.5 A max current, 0.5 Ω max RON. | Larger footprint and slower switching (tON = 3 ms typ.)-used where board space permits and ultra-high isolation dominates over speed. | Choose PS8501-AX when reinforced isolation (>3.75 kV) is mandatory and S-VSON4T density is not required. |
Compared with TLP3407S(TP,E, the TLP3406S(TP,E offers identical form factor but reduced current capability, while PS8501-AX trades compactness and speed for higher isolation and legacy SOIC compatibility-making TLP3407S(TP,E optimal for space-constrained, high-throughput ATE designs demanding 1 A switching at minimal RON.
Availability
TLP3407S(TP,E is available at Aetrix Electronics and suitable for probe card manufacturing, automatic test equipment (ATE) production, and high-speed memory tester development requiring stable component supply, consistent MSL-3 handling, and halogen-free compliance.
Supply support for TLP3407S(TP,E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics with focus on industrial reliability and automotive-grade quality.
The TLP3407S(TP,E belongs to Toshiba's photorelay product line engineered specifically for high-speed, high-density automated test systems-emphasizing low RON, fast switching, and miniature S-VSON packaging.
FAQ
What is the maximum continuous current rating for the TLP3407S(TP,E?
The TLP3407S(TP,E has a maximum continuous ON-state current rating of 1.0 A at Ta = 25°C, with derating to 0 A at Ta ≥ 100°C per the absolute maximum ratings table. This rating applies when both drain terminals (Pins 3 and 4) are used in parallel, as specified in Note 1 of the datasheet. The TLP3407S(TP,E must be mounted on a PCB with adequate copper area to maintain junction temperature within limits under sustained load.
Does the TLP3407S(TP,E support bidirectional signal switching?
No, the TLP3407S(TP,E is a unidirectional, normally-open photorelay with asymmetrical MOSFET structure optimized for source-to-drain conduction only. Its internal photo MOSFET lacks body diode symmetry and is not rated for reverse voltage blocking beyond 60 V OFF-state. For bidirectional AC signal switching, discrete back-to-back MOSFET configurations or dedicated bidirectional photorelays such as the TLP3906 must be used instead of the TLP3407S(TP,E.
What is the recommended LED drive circuit for reliable triggering of the TLP3407S(TP,E?
A constant-current LED drive delivering 3 mA max at 1.26 V typical forward voltage is recommended for the TLP3407S(TP,E. A series resistor of 2.2 kΩ is suitable when driven from a 5 V logic rail (IF = (5 V − 1.26 V)/2.2 kΩ ≈ 1.7 mA). Pulse-width modulation up to 10 kHz is supported, but duty cycle must remain ≤50% to avoid exceeding average IF derating limits. The TLP3407S(TP,E does not require external gate resistors due to integrated photo-diode array drive.
How does the S-VSON4T package of the TLP3407S(TP,E affect thermal performance?
The S-VSON4T package of the TLP3407S(TP,E uses exposed drain pads (Pins 3 and 4) as primary thermal paths, enabling junction-to-board thermal resistance of 120°C/W when mounted on 1-inch² 2-oz copper. With 1.0 A current and 0.3 Ω RON, power dissipation reaches 300 mW-requiring at least 2 cm² of inner-layer copper pour beneath the device to maintain Tj < 125°C at 85°C ambient. The TLP3407S(TP,E datasheet specifies no thermal pad connection to VSS or GND, so thermal vias must connect directly to solid copper planes.
Is the TLP3407S(TP,E RoHS compliant and lead-free?
Yes, the TLP3407S(TP,E is RoHS compliant (Directive 2011/65/EU) and lead-free, as indicated by the "E" suffix in the ordering code per Toshiba's documentation. The device uses matte tin-plated Cu leads and halogen-free molding compound meeting JEDEC J-STD-709B. Lead finish is Sn (tin) with Ni barrier layer, qualified for Pb-free reflow per J-STD-020D. The TLP3407S(TP,E certificate of compliance is available upon request from Aetrix Electronics or Toshiba's official portal.
TLP3407S(TP,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TLP3407S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Mounting Type:
- Surface Mount
- Circuit:
- SPST-NO (1 Form A)
- Output Type:
- AC, DC
- Voltage - Input:
- 1.26VDC
- Voltage - Load:
- 0 V ~ 60 V
- Load Current:
- 1 A
- On-State Resistance (Max):
- 300 mOhms
- Termination Style:
- SMD (SMT) Tab
- Operating Temperature:
- -40°C ~ 110°C
- Supplier Device Package:
- 4-S-VSON
- Approval Agency:
- -
- Grade:
- -
- Qualification:
- -
TLP3407S(TP,E FAQ
1.How can I place an order for TLP3407S(TP,E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP3407S(TP,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP3407S(TP,E reliable?
The price and inventory of TLP3407S(TP,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3407S(TP,E is usually 5 days.
3.What payment methods are accepted for TLP3407S(TP,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3407S(TP,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP3407S(TP,E?
TLP3407S(TP,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP3407S(TP,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP3407S(TP,E?
For technical support, including TLP3407S(TP,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3407S(TP,E requirements.
6.How does Aetrix verify that TLP3407S(TP,E is sourced from the original manufacturer or authorized distributors?
All TLP3407S(TP,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3407S(TP,E meets industry standards.
7.What is the process for return or replacement of TLP3407S(TP,E?
All TLP3407S(TP,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP3407S(TP,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP3407S(TP,E part is unused and in its original packaging.
Return procedure for TLP3407S(TP,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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