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Toshiba Semiconductor and Storage TLP3412R(TP,F
- Part No.:
- TLP3412R(TP,F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Solid State Relays (SSR)
- Package:
- 4-SMD (0.108", 2.75mm)
- Datasheet:
-
TLP3412R(TP,F.pdf
- Description:
- SSR RELAY SPST-NO 400MA 0-60V
- Quantity:
- Payment:
- Shipping:
Inventory:4,416
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Product details
Overview
TLP3412R(TP,F from Toshiba Electronic Devices & Storage Corporation is a surface-mount photorelay in VSONR4 package, featuring built-in input resistor, 60 V off-state voltage rating, 400 mA max on-state current, and 1 Ω typical on-resistance - used for battery control, high-speed logic IC testers, and measuring instruments.
For engineers reviewing the TLP3412R(TP,F datasheet, TLP3412R(TP,F pinout, TLP3412R(TP,F application, or TLP3412R(TP,F equivalent, key selection factors include isolation voltage (500 Vrms), low output capacitance (1 pF), fast switching (110 µs turn-on), space-saving 2.8 × 1.5 mm footprint, and integrated input resistor eliminating external components.
Technical Context
The TLP3412R(TP,F integrates a GaAs LED input stage optically coupled to a MOSFET output stage, forming a normally-open (1-Form-A) solid-state relay. Its internal structure short-circuits pins 1–2 (anode/cathode) and pins 3–4 (drain/drain), enabling dual-drain configuration with shared output terminals.
It operates with 3–6 V input forward voltage and supports up to 48 V supply voltage on the output side. The device delivers 1 Ω typical RON at 400 mA, with 55 µs typical turn-off time and <1 nA off-state leakage at 60 V - optimized for low-power, high-isolation signal switching in automated test equipment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Package | VSONR4 (2.8 × 1.5 × 1.3 mm); enables ultra-compact PCB layout for high-density test fixtures. |
| Isolation Voltage | 500 Vrms (min); meets basic insulation requirements for battery monitoring and instrument safety boundaries. |
| OFF-State Voltage | 60 V (min); supports switching of Li-ion battery packs and mid-voltage sensor signal paths. |
| ON-State Resistance | 1 Ω (typ.), 1.5 Ω (max); limits I²R loss to ≤240 mW at 400 mA, reducing thermal load in compact assemblies. |
| Output Capacitance | 1 pF (max); preserves signal integrity in >100 MHz test environments like memory testers. |
| Turn-On Time | 110 µs (typ.), 500 µs (max); enables reliable cycle timing in automated functional test sequences. |
| Input Reverse Current | 10 µA (max) at 5 V; ensures stable LED bias under reverse transients in noisy industrial settings. |
Pinout & Package
VSONR4 package: 4-terminal, non-leaded surface-mount housing with exposed thermal pad (not electrically connected). Pins 1 and 2 are internally shorted as LED anode/cathode pair; pins 3 and 4 are internally shorted as common drain output terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | LED input terminal; requires series current-limiting resistor only if not using internal resistor (TLP3412R includes built-in resistor). |
| 2 | Cathode | LED return path; shorted to Pin 1 internally - used as single-input node with polarity-sensitive drive. |
| 3 | Drain | Output switch terminal; shorted to Pin 4 - provides dual-pad routing flexibility and current sharing in high-reliability layouts. |
| 4 | Drain | Output switch terminal; redundant connection to Pin 3 - improves solder joint reliability and reduces trace inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Built-in input resistor | Eliminates external current-setting resistor, saving ≥1.5 mm² board area and simplifying BOM for high-channel-count testers. |
| Low output capacitance | 1 pF maximum enables minimal signal distortion in high-speed digital test channels up to 100 MHz. |
| Low off-state current | ≤1 nA at 60 V ensures negligible leakage in precision battery voltage monitoring circuits over 10-year service life. |
| VSONR4 footprint | 2.8 × 1.5 mm outline allows placement adjacent to BGA packages or fine-pitch connectors without interference. |
| 500 Vrms isolation | Provides reinforced insulation barrier between control logic (3.3 V/5 V) and 24–48 V test power domains. |
Applications
| Battery Control Systems | High-Speed Logic IC Testers |
|---|---|
|
Use Scenario: Isolated switching of charge/discharge paths in multi-cell Li-ion battery management systems. IC Role / Device Role / Timing Role: Solid-state relay providing galvanic isolation between MCU GPIO and battery FET gate drivers. Use Value: 60 V off-state rating matches 16S pack voltage; 1 Ω RON minimizes heat generation during continuous 400 mA monitoring current flow. |
Use Scenario: Signal path routing and stimulus injection in automated test equipment for ASIC and FPGA validation. IC Role / Device Role / Timing Role: High-isolation, low-capacitance switch enabling clean signal transitions at >10 MHz toggle rates. Use Value: 1 pF COFF and 110 µs tON ensure sub-nanosecond edge fidelity and deterministic timing margins in pattern generators. |
| Measuring Instruments | High-Speed Memory Testers |
|
Use Scenario: Multiplexing analog sensor inputs (e.g., thermocouples, strain gauges) into precision ADC front-ends. IC Role / Device Role / Timing Role: Low-leakage, low-RON analog switch isolating measurement channels from shared reference planes. Use Value: ≤1 nA IOFF prevents offset drift in µV-level measurements; 1.5 Ω max RON avoids gain error in 10 kΩ sensor bridges. |
Use Scenario: Address/data line switching and termination control in DDR4/DDR5 memory interface validation rigs. IC Role / Device Role / Timing Role: Fast, isolated gate driver for impedance-matched transmission line switching at 1.6–6.4 GT/s data rates. Use Value: 55 µs tOFF supports precise pulse-width control in memory command timing; 500 Vrms isolation prevents ground-loop noise coupling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photorelay applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PVG612A | SO-6 package (5.3 × 3.6 mm); 40 V VOFF; 250 mA ION; 1.2 Ω RON; no built-in resistor. | Larger footprint; lower voltage/current rating; requires external input resistor - less suitable for space-constrained battery monitors. | Select when SO-6 compatibility or higher temperature rating (125°C) is prioritized over size and integration. |
| TLP3406S | VSON4 package (2.8 × 1.5 mm); 60 V VOFF; 350 mA ION; 1.3 Ω RON; built-in resistor; 1.5 pF COFF. | Nearly identical form factor and isolation; slightly lower current rating and higher output capacitance - acceptable for slower test fixtures. | Choose for drop-in replacement where 350 mA output suffices and 0.5 pF extra capacitance does not impact signal integrity. |
Compared with PVG612A and TLP3406S, the TLP3412R(TP,F offers the highest on-state current (400 mA) in the smallest footprint with lowest output capacitance (1 pF), making it optimal for high-density, high-speed automated test equipment requiring minimal signal degradation.
Availability
TLP3412R(TP,F is available at Aetrix Electronics and suitable for battery control systems, high-speed logic IC testers, and measuring instruments requiring stable component supply, RoHS-compliant packaging, and tape-and-reel delivery in 3000-piece reels.
Supply support for TLP3412R(TP,F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics for industrial, automotive, and consumer applications.
The TLP3412R(TP,F belongs to Toshiba's photorelay product line, engineered specifically for high-isolation, low-capacitance signal switching in automated test equipment and precision instrumentation.
FAQ
What is the function of the built-in input resistor in the TLP3412R(TP,F?
The built-in input resistor in the TLP3412R(TP,F sets the LED forward current without requiring an external resistor, reducing component count and PCB area. It enables direct connection to standard logic outputs (e.g., 3.3 V or 5 V GPIO) while maintaining safe LED operation within absolute maximum ratings - a key advantage in high-channel-density test systems where board space is constrained.
Does the TLP3412R(TP,F support bidirectional signal switching?
No, the TLP3412R(TP,F is a unidirectional, normally-open (1-Form-A) photorelay with MOSFET output architecture. Its drain-source channel conducts only in one direction, and it lacks body diode symmetry or gate control for reverse conduction. For bidirectional analog switching, discrete solutions or dedicated analog switches must be used instead of the TLP3412R(TP,F.
What is the maximum operating temperature for continuous use of the TLP3412R(TP,F?
The TLP3412R(TP,F has a specified operating temperature range of –40 °C to +110 °C. However, its recommended operating conditions limit continuous use to ≤85 °C ambient temperature when delivering 400 mA on-state current, due to thermal derating (–4 mA/°C above 25 °C). Exceeding this requires thermal analysis per Toshiba's Reliability Handbook to ensure long-term stability.
Can the TLP3412R(TP,F replace mechanical relays in battery disconnect applications?
Yes, the TLP3412R(TP,F is suitable for low-power battery disconnect functions where 400 mA switching and 60 V off-state voltage meet system requirements. Its solid-state construction eliminates contact wear and bounce, enabling millions of cycles versus thousands for electromechanical relays. However, it is not rated for fault-current interruption - external fusing or protection circuitry remains essential in the TLP3412R(TP,F-based design.
How is isolation verified for the TLP3412R(TP,F during manufacturing?
Toshiba subjects each TLP3412R(TP,F unit to 100% production testing for isolation voltage (500 Vrms AC, 60 s) and isolation resistance (≥1014 Ω at 500 VDC). These tests confirm dielectric integrity between input and output sides per JEDEC JESD22-A114. The TLP3412R(TP,F also undergoes partial discharge screening to detect latent defects that could compromise isolation performance over time.
TLP3412R(TP,F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TLP3412R
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Mounting Type:
- Surface Mount
- Circuit:
- SPST-NO (1 Form A)
- Output Type:
- AC, DC
- Voltage - Input:
- 1.8VDC
- Voltage - Load:
- 0 V ~ 60 V
- Load Current:
- 400 mA
- On-State Resistance (Max):
- 1.5 Ohms
- Termination Style:
- SMD (SMT) Tab
- Operating Temperature:
- -40°C ~ 110°C
- Supplier Device Package:
- 4-VSONR (1.45x2.75)
- Approval Agency:
- -
- Grade:
- -
- Qualification:
- -
TLP3412R(TP,F FAQ
1.How can I place an order for TLP3412R(TP,F through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP3412R(TP,F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP3412R(TP,F reliable?
The price and inventory of TLP3412R(TP,F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3412R(TP,F is usually 5 days.
3.What payment methods are accepted for TLP3412R(TP,F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3412R(TP,F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP3412R(TP,F?
TLP3412R(TP,F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP3412R(TP,F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP3412R(TP,F?
For technical support, including TLP3412R(TP,F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3412R(TP,F requirements.
6.How does Aetrix verify that TLP3412R(TP,F is sourced from the original manufacturer or authorized distributors?
All TLP3412R(TP,F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3412R(TP,F meets industry standards.
7.What is the process for return or replacement of TLP3412R(TP,F?
All TLP3412R(TP,F units undergo pre-shipment inspection (PSI). If there is an issue with TLP3412R(TP,F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP3412R(TP,F part is unused and in its original packaging.
Return procedure for TLP3412R(TP,F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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