Toshiba Semiconductor and Storage TLP3419(TP,F)

Overview

TLP3419(TP,F) from Toshiba Electronic Devices & Storage Corporation is a surface-mount, normally-open photorelay integrating an infrared LED optically coupled to a photo-MOSFET in a VSON 4-pin package. It delivers 80 V min OFF-state voltage, 200 mA max ON-state current, 6 Ω typ ON-resistance, 6.5 pF typ output capacitance, and 500 Vrms isolation - enabling high-speed switching in LCD testers and ATE systems.

For engineers reviewing the TLP3419(TP,F) datasheet, TLP3419(TP,F) pinout, TLP3419(TP,F) application, or TLP3419(TP,F) equivalent, key selection criteria include low-output-capacitance signal routing, high-voltage isolation for tester channel protection, thermal derating compliance up to 85°C operating temperature, and reflow-solderable VSON packaging with dual-drain configuration.

Technical Context

The TLP3419(TP,F) implements optical isolation via GaAs LED–photo-MOSFET coupling, eliminating galvanic paths while supporting DC-to-100 MHz signal switching. Its two-terminal internal structure shorts pins 1–2 (LED anode/cathode) and pins 3–4 (MOSFET drains), simplifying PCB layout but requiring external source/sink control of the output path.

Switching performance is defined by 90 µs typ turn-on and 40 µs typ turn-off times under RL = 200 Ω, VDD = 20 V, IF = 5 mA conditions. The device operates within −40°C to +110°C storage and −40°C to +85°C operating ranges, with absolute maximum ratings including 30 mA LED forward current and 200 mA pulsed ON-state current (100 ms, 10% duty).

Key Specifications

Pinout & Package

Package: VSON (Toshiba designation 11-2D1A), 4-pin, non-leaded, surface-mount, 10 mg typical weight. Dimensions per Toshiba drawing - compatible with standard reflow profiles (peak 260°C, ≤10 s per lead).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar photorelay applications.

Compared with TLP3419(TP,F), TLP3406(TP,F) trades 40 V lower withstand voltage for lower unit cost, while PS7141-AL-AX offers superior voltage rating at the expense of larger footprint and slower switching - making TLP3419(TP,F) optimal for space-constrained, high-frequency ATE channel designs demanding balanced performance.

Availability

TLP3419(TP,F) is available at Aetrix Electronics and suitable for automatic test equipment (ATE), LCD panel testers, and high-speed memory testers requiring stable component supply, MSL-3 handling compliance, and RoHS-compliant tape-and-reel delivery.

Supply support for TLP3419(TP,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics for industrial, automotive, and consumer applications.

The TLP3419(TP,F) belongs to Toshiba's photorelay product line, engineered specifically for high-speed, high-isolation signal switching in automated test and instrumentation systems where low capacitance and compact VSON packaging are critical.

FAQ

What is the maximum continuous ON-state current rating for the TLP3419(TP,F)?

The TLP3419(TP,F) has a maximum continuous ON-state current rating of 200 mA at Ta ≤ 25°C, derating linearly to 0 mA at 125°C per ∆ION/∆Ta = −2 mA/°C. This rating assumes proper PCB copper area for thermal dissipation and applies only when VDD ≤ 64 V and pulse duty cycle remains below 10%. Exceeding this limit risks irreversible MOSFET degradation in the TLP3419(TP,F).

Does the TLP3419(TP,F) support direct drive from a 3.3 V microcontroller GPIO?

Yes - the TLP3419(TP,F) requires only ≤3 mA trigger LED current, allowing direct connection to a 3.3 V MCU GPIO via a 1 kΩ series resistor (ensuring IF ≈ 2.6 mA at VF ≈ 1.27 V). No external transistor buffer is needed, simplifying control circuitry for the TLP3419(TP,F) in embedded ATE controllers.

How is the dual-drain configuration (Pins 3 and 4) used in the TLP3419(TP,F)?

Pins 3 and 4 of the TLP3419(TP,F) are internally shorted drain terminals of the photo-MOSFET, intended for parallel PCB routing to reduce effective ON-resistance and improve thermal spreading. Both pins must be connected to the same net - splitting them across separate traces invalidates the 6 Ω typ RON specification and may cause uneven current sharing in the TLP3419(TP,F).

What is the moisture sensitivity level (MSL) of the TLP3419(TP,F), and how does it affect handling?

The TLP3419(TP,F) is rated MSL 3 per JEDEC J-STD-020, meaning it must be assembled within 168 hours of tape opening at ≤30°C/70% RH, or baked at 60±5°C for 64–72 hours if exposed beyond that window. Failure to comply risks popcorning or delamination during reflow - a critical constraint for high-yield manufacturing of boards using the TLP3419(TP,F).

Can the TLP3419(TP,F) replace mechanical relays in high-cycle test equipment?

Yes - the TLP3419(TP,F) supports >10⁶ switching cycles with no contact wear, unlike electromechanical relays. Its 90/40 µs switching times enable ≥10 kHz operation, and its solid-state construction eliminates bounce, arcing, and coil drive complexity. For high-cycle ATE applications, the TLP3419(TP,F) delivers superior lifetime and repeatability versus mechanical alternatives.