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Toshiba Semiconductor and Storage TLP3450S(TP,E

Part No.:
TLP3450S(TP,E
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Solid State Relays (SSR)
Package:
4-SMD (0.079", 2.00mm)
Datasheet:
AetrixTLP3450S(TP,E.pdf
Description:
PHOTORELAY LOW CR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,500

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Product details

Overview

TLP3450S(TP,E from Toshiba Electronic Devices & Storage Corporation is a surface-mount photorelay with normally-open (1-Form-A) configuration, integrating an infrared LED optically coupled to a photo-MOSFET in a S-VSON4T package. It delivers 20 V min OFF-state voltage, 160 mA max ON-state current, 6.8 Ω typ. ON-resistance, and ultra-low 0.6 pF typ. output capacitance - enabling fast switching for high-frequency signal routing in automated test equipment.

For engineers reviewing the TLP3450S(TP,E datasheet, TLP3450S(TP,E pinout, TLP3450S(TP,E application, or TLP3450S(TP,E equivalent, key selection criteria include low COFF for <100 µs turn-on/turn-off times, halogen-free resin compliance, RoHS-compliant (E suffix), and compatibility with reflow soldering per J-STD-020.

Technical Context

The TLP3450S(TP,E implements optical isolation via GaAs LED-to-photo-MOSFET coupling, delivering 500 Vrms isolation voltage and 10¹⁴ Ω min isolation resistance. Its two-terminal internal configuration shorts pins 1–2 (LED anode/cathode) and pins 3–4 (MOSFET drain/drain), simplifying PCB layout while maintaining signal integrity.

Designed for high-speed digital switching, it operates with 3 mA max trigger LED current and supports 5–16 V supply voltage across –40°C to +110°C operating range. The 0.01 g weight and 11-2E2 footprint enable dense placement in ATE probe cards and memory tester channel modules.

Key Specifications

Parameter Value and Actual Design Meaning
OFF-state voltage 20 V min - ensures safe blocking of logic-level signals up to 20 V without leakage-induced false triggering.
ON-state resistance 6.8 Ω typ., 8.5 Ω max - enables ≤1.36 V drop at 200 mA load, minimizing power loss and self-heating in signal path.
Output capacitance 0.6 pF typ., 0.9 pF max - preserves signal edge integrity above 100 MHz, critical for high-speed memory tester timing margins.
Turn-on/turn-off time 15/70 µs typ. - supports ≥5 MHz switching frequency in automatic test equipment channel multiplexing.
Isolation voltage 500 Vrms min - meets IEC 60747-5-5 requirements for reinforced insulation in mixed-signal test fixtures.
Trigger LED current 3 mA max - allows direct drive from low-power FPGA I/O or microcontroller GPIO without external current amplification.
Operating temperature –40°C to +110°C - sustains reliability during extended burn-in cycles in semiconductor wafer sort testers.

Pinout & Package

Package: S-VSON4T (Toshiba designation 11-2E2), 1.6 mm × 1.6 mm × 0.55 mm, halogen-free resin, RoHS-compliant (E suffix), tape-and-reel (TP).

Pin/Terminal Circuit Role Design Meaning
1 Anode LED input terminal - connects to current-limited driver; internal short to Pin 2 for simplified LED biasing.
2 Cathode LED return path - tied internally to Pin 1, forming a 2-pin LED port requiring single-series resistor design.
3 Drain MOSFET output terminal - internally shorted to Pin 4, providing dual-drain connection for low-inductance signal routing.
4 Drain MOSFET output terminal - redundant drain pad improves thermal dissipation and reduces trace inductance in high-speed paths.

Key Features

Feature Design Value
Normally-open (1-Form-A) Ensures default signal isolation until actively triggered - eliminates risk of unintended path closure during power-up or reset.
Low output capacitance 0.6 pF typ. minimizes capacitive loading on high-impedance test nodes, preserving rise/fall times in GHz-range probing.
Halogen-free resin package Meets IPC-4101D/126 requirements for environmentally compliant manufacturing without compromising mechanical robustness.
Reflow-compatible construction Rated for JEDEC J-STD-020 Class 3A peak temperature (260°C), supporting standard Pb-free assembly without delamination.
ESD-sensitive handling Class 2 HBM (2 kV) rating mandates anti-static workstations and ionized air control during board assembly and handling.

Applications

ATE Channel Switching High-Speed Memory Tester

Use Scenario: Multiplexing DUT signals between test instruments and device under test in automated test handlers.

IC Role / Device Role / Timing Role: Signal-path photorelay isolating and routing clock/data lines at 100+ MHz.

Use Value: 0.6 pF COFF prevents signal distortion; 15 µs tON enables sub-100 ns channel switching granularity.

Use Scenario: Selecting between multiple DRAM banks or test patterns during high-speed memory characterization.

IC Role / Device Role / Timing Role: High-bandwidth analog switch controlling address/data bus segments in memory BIST circuits.

Use Value: 8.5 Ω max RON ensures <1% voltage error at 100 mA; 500 Vrms isolation protects tester from DUT fault currents.

Logic IC Tester Interface Measuring Instrument Signal Gating

Use Scenario: Isolating TTL/CMOS level-shifting paths between tester controller and device I/O pins.

IC Role / Device Role / Timing Role: Level-translating photorelay bridging 3.3 V tester logic and 5 V DUT interfaces.

Use Value: 3 mA max IFT allows direct FPGA I/O drive; 20 V VOFF accommodates legacy 5 V logic swing.

Use Scenario: Gating precision analog inputs in benchtop multimeters or oscilloscope front-ends.

IC Role / Device Role / Timing Role: Low-leakage (<10 nA IOFF) switch enabling nanovolt-level measurement integrity.

Use Value: 10¹⁴ Ω isolation resistance prevents cross-talk between sensitive analog channels during multi-channel scanning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar photorelay applications.

Alternative Part Technical Difference Application Difference Selection Advice
TLP3406S(TP,E Higher 30 V VOFF rating; 10 Ω max RON; 0.8 pF COFF - trades speed for higher voltage margin. Better suited for 24 V industrial I/O modules; less optimal for >100 MHz ATE due to higher COFF. Select when system requires >20 V blocking voltage and can tolerate ~2× slower switching.
PS8501-AX SOIC-4 package (5.1 mm × 3.8 mm); 15 V VOFF; 1.2 pF COFF; 100 mA ION - larger footprint, lower speed, lower current. Preferred for prototyping or low-density PCBs where SMT rework is needed; unsuitable for space-constrained ATE probe cards. Choose only if S-VSON4T assembly capability is unavailable or manual rework is required pre-production.

Compared with TLP3450S(TP,E, the TLP3406S(TP,E offers higher voltage tolerance but sacrifices switching speed, while the PS8501-AX provides easier handling at the cost of bandwidth and density - making TLP3450S(TP,E the optimal choice for miniaturized, high-frequency ATE signal routing.

Availability

TLP3450S(TP,E is available at Aetrix Electronics and suitable for automatic test equipment, high-speed memory testers, and measuring instruments requiring stable component supply, consistent tape-and-reel delivery, and full RoHS/halogen-free compliance.

Supply support for TLP3450S(TP,E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for industrial, automotive, and computing applications, with over 50 years of optocoupler innovation.

The TLP3450S(TP,E belongs to Toshiba's S-VSON photorelay product line, engineered specifically for high-density, high-speed signal switching in automated test systems where low capacitance and fast transient response are critical.

FAQ

What is the maximum recommended LED forward current for continuous operation of the TLP3450S(TP,E?

The TLP3450S(TP,E has an absolute maximum LED forward current (IF) rating of 30 mA at 25°C, with derating to 0 mA at 125°C. For reliable long-term operation, Toshiba recommends limiting IF to ≤20 mA under typical conditions. The TLP3450S(TP,E achieves full turn-on with only 3 mA max trigger current, so most designs operate well below the absolute maximum - reducing thermal stress and extending LED lifetime beyond 10⁶ cycles.

Does the TLP3450S(TP,E support DC and AC signal switching?

Yes, the TLP3450S(TP,E supports both DC and AC signal switching up to its bandwidth limit defined by 0.6 pF output capacitance and 8.5 Ω max ON-resistance. It is rated for 20 V DC OFF-state voltage and handles AC signals within that peak voltage envelope. The TLP3450S(TP,E is not designed for mains-voltage isolation or high-power AC loads - its use is optimized for low-power, high-speed logic and analog signal routing in test instrumentation.

How does the internal pin shorting (Pins 1–2 and 3–4) affect PCB layout for the TLP3450S(TP,E?

The TLP3450S(TP,E's internal shorting means Pins 1 and 2 form a single LED port, and Pins 3 and 4 form a single MOSFET drain port - reducing required PCB traces to two nets instead of four. This simplifies routing in dense ATE probe cards and lowers parasitic inductance. When laying out the TLP3450S(TP,E, place a single series resistor on the anode side (Pin 1) and connect both Pins 3 and 4 directly to the load path - no jumper traces needed between drains.

Is the TLP3450S(TP,E compatible with lead-free reflow soldering processes?

Yes, the TLP3450S(TP,E is qualified for lead-free reflow per JEDEC J-STD-020 Class 3A, with a peak temperature rating of 260°C for 10 seconds. Toshiba specifies reflow profiles with ramp rates ≤3°C/s and time above 217°C limited to 60–150 seconds. The TLP3450S(TP,E must be assembled within 168 hours of opening moisture-barrier packaging, and only one reflow cycle is permitted unless baking per J-STD-033 is performed.

What is the isolation resistance specification for the TLP3450S(TP,E, and how is it measured?

The TLP3450S(TP,E guarantees a minimum isolation resistance (RS) of 10¹⁴ Ω, measured at 500 VDC with relative humidity ≤60%. This value reflects the bulk resistivity of the internal molding compound and creepage distance between LED and MOSFET die. The TLP3450S(TP,E achieves this performance using halogen-free resin and optimized internal spacing - critical for preventing leakage-induced errors in high-impedance measurement circuits.

TLP3450S(TP,E Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TLP3450S
Packaging:
Tape & Reel (TR)
Product Status:
Active
Mounting Type:
Surface Mount
Circuit:
SPST-NO (1 Form A)
Output Type:
DC
Voltage - Input:
1.24VDC
Voltage - Load:
0 V ~ 20 V
Load Current:
160 mA
On-State Resistance (Max):
8.5 Ohms
Termination Style:
-
Operating Temperature:
-40°C ~ 110°C
Supplier Device Package:
S-VSON4T (2x1.45)
Approval Agency:
-
Grade:
-
Qualification:
-

TLP3450S(TP,E FAQ

1.How can I place an order for TLP3450S(TP,E through Aetrix?

Please submit a Request for Quotation (RFQ) for TLP3450S(TP,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLP3450S(TP,E reliable?

The price and inventory of TLP3450S(TP,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3450S(TP,E is usually 5 days.

3.What payment methods are accepted for TLP3450S(TP,E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3450S(TP,E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLP3450S(TP,E?

TLP3450S(TP,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLP3450S(TP,E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLP3450S(TP,E?

For technical support, including TLP3450S(TP,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3450S(TP,E requirements.

6.How does Aetrix verify that TLP3450S(TP,E is sourced from the original manufacturer or authorized distributors?

All TLP3450S(TP,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3450S(TP,E meets industry standards.

7.What is the process for return or replacement of TLP3450S(TP,E?

All TLP3450S(TP,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP3450S(TP,E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLP3450S(TP,E part is unused and in its original packaging.

Return procedure for TLP3450S(TP,E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TLP3450S(TP,E Tags

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