Toshiba Semiconductor and Storage TLP3484(TP,E
- Part No.:
- TLP3484(TP,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Solid State Relays (SSR)
- Package:
- 4-LDFN
- Datasheet:
-
TLP3484(TP,E.pdf
- Description:
- SSR RELAY SPST-NO 200MA 0-400V
- Quantity:
- Payment:

- Shipping:

Inventory:1,740
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Product details
Overview
TLP3484(TP,E from Toshiba Electronic Devices & Storage Corporation is a halogen-free photorelay with normally-open (1-Form-A) configuration, 400 V OFF-state voltage rating, 0.18 A max ON-state current, and 18 Ω typical ON-resistance-designed for high-speed signal switching in automatic test equipment and logic IC testers.
For engineers reviewing the TLP3484(TP,E datasheet, TLP3484(TP,E pinout, TLP3484(TP,E application, or TLP3484(TP,E equivalent, key selection criteria include low 60 pF output capacitance for fast switching, 500 Vrms isolation, P-SON4 package compatibility with high-density PCB layouts, and ESD-sensitive handling requirements.
Technical Context
The TLP3484(TP,E integrates an infrared LED optically coupled to a photo MOSFET, forming a two-terminal device where Pins 1–2 are internally shorted (LED anode/cathode pair) and Pins 3–4 are shorted (MOSFET drain terminals). Its architecture enables galvanic isolation without external biasing of the detector side.
Switching performance is defined by 0.23 ms typical turn-on time and 0.06 ms typical turn-off time at IF = 5 mA and VDD = 20 V, supported by low 60 pF COFF and sub-3 mA trigger LED current-making it suitable for high-frequency AC/DC signal routing in automated test systems requiring minimal signal distortion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| OFF-state voltage | 400 V min - supports safe switching of high-voltage test signals without breakdown |
| ON-state resistance | 18 Ω typ., 35 Ω max - ensures low conduction loss and minimal voltage drop at 0.18 A load |
| Output capacitance (COFF) | 60 pF typ. - enables <1 µs switching transitions for high-speed digital test patterns |
| Trigger LED current | 3 mA max - allows direct drive from low-power logic outputs without external amplification |
| Isolation voltage | 500 Vrms min - provides safety-rated barrier between tester control logic and DUT power domains |
| Package | P-SON4 (11-4Q1) - 2.5 × 2.5 mm surface-mount footprint with exposed thermal pad for compact ATE board layouts |
| Halogen-free | Compliant per Toshiba specification - meets environmental compliance requirements for RoHS-compliant assemblies |
Pinout & Package
The TLP3484(TP,E is housed in a P-SON4 package (Toshiba designation 11-4Q1), measuring 2.5 × 2.5 mm with 0.5 mm pitch and an exposed thermal pad on the bottom. Pins 1–2 form the LED input pair; Pins 3–4 are internally shorted drain terminals of the photo MOSFET output stage.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Positive terminal of integrated infrared LED - requires series current limiting resistor when driven from 3.3 V or 5 V logic |
| 2 | Cathode | Negative terminal of integrated infrared LED - referenced to system ground or negative rail |
| 3 | Drain | High-side switch node - connected internally to Pin 4; used as common output terminal for load connection |
| 4 | Drain | Drain (redundant terminal) - electrically identical to Pin 3; improves current sharing and thermal dissipation in high-reliability ATE fixtures |
Key Features
| Feature | Design Value |
|---|---|
| Normally-open (1-Form-A) configuration | Ensures default-open signal path - eliminates need for external pull-up/pull-down resistors in fail-safe test sequencing |
| Low 60 pF output capacitance | Minimizes signal rise/fall time degradation - preserves integrity of >1 MHz digital test waveforms |
| ESD-sensitive construction | Requires antistatic handling per JESD22-A114 - prevents gate oxide damage during SMT assembly and board handling |
| Halogen-free resin encapsulation | Meets IEC 61249-2-21 standards - supports environmentally compliant manufacturing without compromising flame retardancy |
Applications
| ATE (Automatic Test Equipment) | High-Speed Logic IC Testers |
|---|---|
Use Scenario: Signal path switching between test head channels and DUT pins during parallel functional testing. IC Role / Device Role / Timing Role: Isolated solid-state relay enabling bidirectional AC/DC signal routing without contact wear or bounce. Use Value: 0.23 ms turn-on time and 400 V blocking capability allow reliable switching of 100+ MHz clock signals and supply rails up to ±200 V. | Use Scenario: Multiplexing of stimulus signals to multiple logic gate inputs under real-time pattern generation. IC Role / Device Role / Timing Role: High-speed photorelay acting as a digitally controlled analog switch in pattern generator output stages. Use Value: 60 pF COFF and sub-3 mA IFT enable direct FPGA GPIO control with no level-shifting, reducing test head latency by >15 ns. |
| Measuring Instruments | High-Speed Memory Testers |
Use Scenario: Range selection and signal conditioning path isolation in precision multimeters and source-measure units. IC Role / Device Role / Timing Role: Galvanically isolated switch for selecting voltage/current measurement ranges while maintaining 500 Vrms channel-to-channel isolation. Use Value: 500 Vrms isolation and 10 nA IOFF ensure measurement accuracy remains unaffected by leakage across switched paths. | Use Scenario: Address/data bus switching and termination control during DDR4/DDR5 memory characterization at 3.2 GT/s. IC Role / Device Role / Timing Role: Low-capacitance signal gate synchronizing test pattern delivery to memory die under high-speed timing margins. Use Value: 0.06 ms tOFF and 18 Ω RON minimize skew and insertion loss in differential strobe paths, preserving setup/hold timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photorelay applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLP3482(TP,E | Same P-SON4 package; lower 200 V VOFF rating and higher 50 Ω max RON | Suitable only for ≤200 V test signal routing; not recommended for high-voltage ATE channel switching | Select TLP3482(TP,E only when system VOFF < 200 V and cost sensitivity outweighs speed/isolation needs |
| PS8702-1-AX | Dual-channel SOIC-8; 400 V VOFF but 100 pF COFF and 0.5 ms tON | Provides channel redundancy but sacrifices switching speed and board space efficiency | Choose PS8702-1-AX only when dual independent switches are required and 0.5 ms latency is acceptable |
Compared with TLP3482(TP,E and PS8702-1-AX, the TLP3484(TP,E delivers superior high-speed performance (0.23 ms tON, 60 pF COFF) in the smallest footprint (P-SON4), making it optimal for space-constrained, high-frequency ATE designs where single-pole switching and 400 V isolation are mandatory.
Availability
TLP3484(TP,E is available at Aetrix Electronics and suitable for automatic test equipment, high-speed logic IC testers, and measuring instruments requiring stable component supply, long-term lifecycle support, and RoHS-compliant procurement.
Supply support for TLP3484(TP,E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and optoelectronics for industrial, automotive, and test equipment markets.
The TLP3484(TP,E belongs to Toshiba's photorelay product line, engineered specifically for high-speed, high-isolation signal switching in automated test systems where mechanical relay wear and electromagnetic interference must be eliminated.
FAQ
What is the maximum continuous ON-state current rating for the TLP3484(TP,E?
The TLP3484(TP,E has a maximum continuous ON-state current rating of 0.18 A at Ta = 25 °C. Derating applies above 25 °C at –1.8 mA/°C, limiting usable current to approximately 0.12 A at 85 °C ambient. This rating ensures stable conduction in ATE load switching without thermal runaway, provided PCB copper area and airflow meet Toshiba's recommended land pattern guidelines.
Does the TLP3484(TP,E require an external gate resistor or bias network?
No, the TLP3484(TP,E does not require external gate biasing or resistors on the output side because it is a self-contained photo MOSFET structure with integrated LED driver and detector. Only a series current-limiting resistor on the LED input (Pins 1–2) is needed-typically 220 Ω for 5 V drive at 3 mA IFT-to ensure reliable triggering without exceeding absolute maximum ratings.
What is the meaning of "(TP,E" in the full part number TLP3484(TP,E?
The suffix "(TP,E" in TLP3484(TP,E specifies tape-and-reel packaging (TP) and RoHS-compliant, halogen-free resin (E). TP indicates 1500-piece reels per JEDEC standard, while E confirms compliance with EU Directive 2011/65/EU and Toshiba's halogen-free material specification-critical for environmentally regulated production lines using the TLP3484(TP,E.
Can the TLP3484(TP,E be used in AC signal switching applications?
Yes, the TLP3484(TP,E supports AC signal switching due to its bidirectional output structure and 400 V peak OFF-state voltage rating. It can switch sine, square, or arbitrary waveforms up to 400 Vpk, provided RMS voltage remains within 500 Vrms isolation limits and frequency stays below the bandwidth limit imposed by 60 pF COFF and 0.23 ms tON-verified in Toshiba's Fig. 12.11 and switching time test circuit.
Is the P-SON4 package of the TLP3484(TP,E compatible with standard reflow soldering profiles?
Yes, the TLP3484(TP,E's P-SON4 package is qualified for lead-free reflow soldering per J-STD-020, with peak temperature up to 260 °C for ≤10 seconds. Toshiba specifies two reflow cycles maximum, with first reflow completed within 168 hours of moisture-proof bag opening. The 20 mg unit weight and exposed thermal pad require precise stencil design and nitrogen-assisted reflow to ensure void-free solder joints and thermal reliability.
TLP3484(TP,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TLP3484
- Packaging:
- Bulk
- Product Status:
- Active
- Mounting Type:
- Surface Mount
- Circuit:
- SPST-NO (1 Form A)
- Output Type:
- AC, DC
- Voltage - Input:
- 1.2VDC
- Voltage - Load:
- 0 V ~ 400 V
- Load Current:
- 180 mA
- On-State Resistance (Max):
- 35 Ohms
- Termination Style:
- -
- Operating Temperature:
- -40°C ~ 110°C
- Supplier Device Package:
- S-VSON4T (3.4x2.1)
- Approval Agency:
- -
- Grade:
- -
- Qualification:
- -
TLP3484(TP,E FAQ
1.How can I place an order for TLP3484(TP,E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP3484(TP,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP3484(TP,E reliable?
The price and inventory of TLP3484(TP,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP3484(TP,E is usually 5 days.
3.What payment methods are accepted for TLP3484(TP,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP3484(TP,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP3484(TP,E?
TLP3484(TP,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP3484(TP,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP3484(TP,E?
For technical support, including TLP3484(TP,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP3484(TP,E requirements.
6.How does Aetrix verify that TLP3484(TP,E is sourced from the original manufacturer or authorized distributors?
All TLP3484(TP,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP3484(TP,E meets industry standards.
7.What is the process for return or replacement of TLP3484(TP,E?
All TLP3484(TP,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP3484(TP,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP3484(TP,E part is unused and in its original packaging.
Return procedure for TLP3484(TP,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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