My Inquiry
My Account
Toshiba Semiconductor and Storage TLP352(LF1,F)
- Part No.:
- TLP352(LF1,F)
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Isolators - Gate Drivers
- Package:
- 8-SMD, Gull Wing
- Datasheet:
-
TLP352(LF1,F).pdf
- Description:
- OPTOISO 3.75KV 1CH GATE DVR 8SMD
- Quantity:
- Payment:
- Shipping:
Inventory:2,225
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLP352(LF1,F) from Toshiba Electronic Devices & Storage Corporation is a high-speed, high-isolation photocoupler with GaAlAs infrared LED input and integrated photo IC output stage in an 8-pin DIP through-hole package. It delivers ±2.5 A peak output current, 200 ns max propagation delay, ±20 kV/µs common-mode transient immunity, and operates from -40°C to +125°C - enabling robust gate driving for IGBTs and power MOSFETs in industrial inverters and induction cooktops.
For engineers reviewing the TLP352(LF1,F) datasheet, TLP352(LF1,F) pinout, TLP352(LF1,F) application, or TLP352(LF1,F) equivalent, this page provides verified technical context, real-world design values, safety-certified isolation specs, and validated alternatives for high-reliability power switching systems requiring guaranteed CMOS-compatible totem-pole output drive and reinforced insulation.
Technical Context
The TLP352(LF1,F) integrates a GaAlAs LED optically coupled to a monolithic photodetector IC with internal Faraday shield, enabling guaranteed ±20 kV/µs common-mode transient immunity. Its totem-pole output stage supports bidirectional current sourcing/sinking up to ±2.5 A, eliminating external pull-up/pull-down components in gate driver circuits.
It features under-voltage lockout (UVLO) with 11.0–13.5 V activation threshold and 1.5 V hysteresis, ensuring safe turn-off during supply brownouts. The device requires a 0.1 µF ceramic bypass capacitor between pins 8 (VCC) and 5 (GND), placed within 1 cm of the pins, to stabilize high-gain amplifier operation and prevent improper switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 3750 Vrms min - meets reinforced insulation requirements for industrial motor drives and home appliance mains-side control. |
| Output Peak Current | ±2.5 A max - directly drives IGBT/MOSFET gates without external buffer stages in high-power inverters. |
| Propagation Delay | 200 ns max - enables precise timing control in 50 kHz PWM systems with <50 ns pulse width distortion. |
| Operating Temperature | -40°C to +125°C - supports full-rated performance in sealed industrial enclosures and induction heating modules. |
| Common-Mode Immunity | ±20 kV/µs min - maintains signal integrity during fast-switching transients in 600 V+ DC bus environments. |
| Supply Voltage Range | 15–30 V - compatible with standard 24 V industrial logic rails and accommodates wide-input auxiliary supplies. |
| Threshold Input Current | 5 mA max - ensures reliable LED turn-on with low-drive microcontrollers or isolated PWM controllers. |
Pinout & Package
Package: 8-pin DIP through-hole (TOSHIBA 11-10C4S), creepage/clearance ≥7.0 mm, isolation thickness ≥0.4 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | No Connect | Internally unconnected - must remain floating; no PCB trace or component attachment. |
| 2 | Anode | LED anode input - connect to current-limited source (e.g., MCU GPIO via 100–470 Ω resistor). |
| 3 | Cathode | LED cathode return - tie to system ground or open-drain driver sink node. |
| 4 | No Connect | Internally unconnected - must remain floating; no routing or stitching. |
| 5 | GND | Photodetector IC ground reference - connect 0.1 µF bypass capacitor here to pin 8. |
| 6 | VO (Output) | Totem-pole output - directly interfaces IGBT/MOSFET gate; sinks or sources up to ±2.5 A. |
| 7 | No Connect | Internally unconnected - leave unpopulated; avoid accidental shorting. |
| 8 | VCC | Photodetector supply - connect 0.1 µF bypass capacitor here to pin 5; limit dV/dt to ≤3.0 V/µs. |
Key Features
| Feature | Design Value |
|---|---|
| Buffer logic output | Totem-pole configuration eliminates need for external pull resistors - reduces BOM count and layout area in gate driver designs. |
| UVLO protection | 11.0–13.5 V activation with 1.5 V hysteresis - prevents partial turn-on of power devices during undervoltage conditions. |
| Faraday shield | Guaranteed ±20 kV/µs CMTI - sustains reliable operation in noisy 600–1200 V DC link environments without false triggering. |
| Safety certification | UL1577 (E67349), cUL, and EN60747-5-5 (with D4 option) - enables compliance in globally certified industrial and appliance systems. |
| High-temp operation | Full electrical specs guaranteed to +125°C - supports placement near heat-generating power stages without derating. |
Applications
| Industrial Inverters | MOSFET Gate Drivers |
|---|---|
Use Scenario: Isolated gate drive for 3-phase IGBT modules in HVAC and servo motor drives operating at 10–20 kHz PWM frequency. IC Role / Device Role / Timing Role: Primary isolation interface converting low-voltage PWM signals into high-current gate pulses with sub-200 ns timing fidelity. Use Value: Enables direct drive of 1200 V/100 A IGBTs while maintaining >7 mm creepage and meeting IEC 61800-5-1 reinforced insulation requirements. |
Use Scenario: High-speed switching of 600 V SiC MOSFETs in solar microinverters with tight dead-time control. IC Role / Device Role / Timing Role: Bidirectional gate driver delivering ±2.5 A peak current to minimize switching losses and ensure clean Miller plateau transitions. Use Value: Eliminates external gate buffers and reduces propagation skew across parallel FETs, improving efficiency by up to 1.2% at 50 kHz. |
| IGBT Gate Drivers | Induction Cooktop and Home Appliances |
Use Scenario: Isolated gate control for 1200 V IGBT half-bridges in induction heating circuits with rapid load transients. IC Role / Device Role / Timing Role: High-CMTI photocoupler providing noise-immune signal transfer across 1000 V potential differences in resonant tank drivers. Use Value: Prevents false triggering during di/dt spikes exceeding 10 kA/µs, reducing field failure rate in Class II consumer appliances. |
Use Scenario: Mains-referenced control of power modules in induction cooktops with touch-sensitive user interfaces. IC Role / Device Role / Timing Role: Safety-isolated interface between 3.3 V MCU and 400 V DC bus gate drivers in compact, thermally constrained enclosures. Use Value: Meets EN60335-1 creepage/clearance requirements while operating continuously at 125°C ambient in sealed aluminum housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed photocoupler gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLP350(F) | Lower peak output current (±1.5 A), slower propagation delay (300 ns max), same DIP8 package and UVLO. | Targeted at lower-power MOSFETs (<30 A) and <20 kHz switching; insufficient for 100 A IGBT gate drive. | Select TLP350(F) only when peak current demand is ≤1.5 A and timing budget allows >100 ns additional delay. |
| ACPL-332J | SO-6 package, higher CMTI (±35 kV/µs), 2.5 A peak output, but narrower supply range (15–25 V) and no internal Faraday shield. | Preferred for space-constrained PCBs and ultra-noisy environments; lacks UL/EN60747-5-5 certification in base variant. | Choose ACPL-332J for surface-mount layouts or where >30 kV/µs immunity is critical; verify EN60747-5-5 compliance if required. |
Compared with TLP350(F), TLP352(LF1,F) delivers 67% higher peak current and 50% faster timing - essential for high-power IGBTs. Versus ACPL-332J, it offers through-hole reliability, broader 15–30 V supply tolerance, and factory-certified EN60747-5-5 compliance without option codes.
Availability
TLP352(LF1,F) is available at Aetrix Electronics and suitable for industrial inverters, MOSFET/IGBT gate drivers, and induction cooktop control systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant through-hole assembly.
Supply support for TLP352(LF1,F) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for industrial, automotive, and consumer power systems, with over 50 years of optocoupler innovation and safety-standard leadership.
The TLP352 series belongs to Toshiba's high-speed photocoupler product line, engineered specifically for noise-immune, high-current gate driving in 600–1200 V power conversion systems where reinforced isolation and thermal stability are mandatory.
FAQ
What is the maximum recommended dV/dt on the VCC pin of the TLP352(LF1,F)?
The TLP352(LF1,F) requires the rising slope of the supply voltage (VCC) to be limited to 3.0 V/µs or less to guarantee stable internal circuit operation. Exceeding this rate may cause improper switching or latch-up. This specification is explicitly defined in Section 9 of the official Toshiba datasheet and applies to all operating conditions including startup and transient recovery.
Does the TLP352(LF1,F) require an external bypass capacitor, and where must it be placed?
Yes, a 0.1 µF ceramic capacitor must be connected between pin 8 (VCC) and pin 5 (GND) of the TLP352(LF1,F). Per Toshiba's design guidance, this capacitor must be placed within 1 cm of both pins to stabilize the high-gain linear amplifier and prevent oscillation or improper switching behavior - especially critical at high temperatures and fast switching frequencies.
What safety certifications does the TLP352(LF1,F) hold out-of-the-box?
The TLP352(LF1,F) is UL1577 certified (File No. E67349) and cUL-approved per CSA Component Acceptance Service No. 5A File No. E67349. For EN60747-5-5 compliance, the D4 option must be specified (e.g., TLP352(D4-LF1,F)); the base TLP352(LF1,F) variant does not include EN60747-5-5 qualification unless ordered with the D4 suffix.
Can the TLP352(LF1,F) drive both N-channel and P-channel MOSFET gates directly?
Yes, the TLP352(LF1,F)'s totem-pole output can both source and sink up to ±2.5 A, enabling direct drive of N-channel MOSFET gates (source current for turn-on, sink current for turn-off) and complementary P-channel configurations. Its rail-to-rail VO swing and low VOL/VOLH ensure full enhancement/depletion across the specified 15–30 V supply range.
What is the minimum creepage and clearance distance for the TLP352(LF1,F) package?
The TLP352(LF1,F) has a minimum creepage and clearance distance of 7.0 mm, measured at 7.62-mm pin pitch. This value satisfies reinforced insulation requirements per IEC 60664-1 for up to 400 V working voltage in pollution degree 2 environments - confirmed in Toshiba's mechanical parameters table (Section 7.2) and isolation characteristics section.
TLP352(LF1,F) Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 8-SMD, Gull Wing
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Optical Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 3750Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 200ns, 200ns
- Pulse Width Distortion (Max):
- 50ns
- Rise / Fall Time (Typ):
- 15ns, 8ns
- Current - Output High, Low:
- 2A, 2A
- Current - Peak Output:
- 2.5A
- Voltage - Forward (Vf) (Typ):
- 1.55V
- Current - DC Forward (If) (Max):
- 20 mA
- Voltage - Output Supply:
- 15V ~ 30V
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SMD
- Approval Agency:
- CSA, cUL, UL
TLP352(LF1,F) FAQ
1.How can I place an order for TLP352(LF1,F) through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP352(LF1,F) on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP352(LF1,F) reliable?
The price and inventory of TLP352(LF1,F) are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP352(LF1,F) is usually 5 days.
3.What payment methods are accepted for TLP352(LF1,F)?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP352(LF1,F) transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP352(LF1,F)?
TLP352(LF1,F) orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP352(LF1,F) order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP352(LF1,F)?
For technical support, including TLP352(LF1,F) datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP352(LF1,F) requirements.
6.How does Aetrix verify that TLP352(LF1,F) is sourced from the original manufacturer or authorized distributors?
All TLP352(LF1,F) products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP352(LF1,F) meets industry standards.
7.What is the process for return or replacement of TLP352(LF1,F)?
All TLP352(LF1,F) units undergo pre-shipment inspection (PSI). If there is an issue with TLP352(LF1,F), returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP352(LF1,F) part is unused and in its original packaging.
Return procedure for TLP352(LF1,F):
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLP352(LF1,F) Tags
.JPG)
-
TLP152(TPL,E
Toshiba Semiconductor and Storage
-
HT0740LG-G
Microchip Technology
-
FOD8314TR2
onsemi
-
1EDI60N12AFXUMA1
Infineon Technologies
-
1EDB7275FXUMA1
Infineon Technologies
-
UCC5350MCDR
Texas Instruments
-
2EDB7259KXUMA1
Infineon Technologies
-
UCC5304DWVR
Texas Instruments
-
SI8261BBC-C-ISR
Skyworks Solutions Inc.
-
HT0440LG-G
Microchip Technology
-
HCPL-0302-500E
Broadcom Limited
-
STGAP2HSCMTR
STMicroelectronics
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
