Toshiba Semiconductor and Storage TLP5701(D4-TP4,E
- Part No.:
- TLP5701(D4-TP4,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Isolators - Gate Drivers
- Package:
- 6-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
TLP5701(D4-TP4,E.pdf
- Description:
- OPTOISO 5KV 1CH GATE DVR 6SO
- Quantity:
- Payment:

- Shipping:

Inventory:1,208
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Product details
Overview
TLP5701(D4-TP4,E) from Toshiba Electronic Devices & Storage Corporation is a reinforced-insulation photocoupler with infrared LED input and integrated photo IC output in a 6-pin SO6L package. It delivers ±0.6 A peak output current, 500 ns max propagation delay, ±20 kV/µs common-mode transient immunity, and 5000 Vrms isolation voltage. It serves as a gate driver for small-class IGBTs and power MOSFETs in industrial inverters and induction cooktops.
For engineers reviewing the TLP5701(D4-TP4,E) datasheet, TLP5701(D4-TP4,E) pinout, TLP5701(D4-TP4,E) application, or TLP5701(D4-TP4,E) equivalent, key selection criteria include guaranteed CMOS-compatible totem-pole output, -40°C to +110°C operating range, UVLO protection, 10–30 V supply voltage, and VDE EN IEC 60747-5-5 certification for reinforced insulation.
Technical Context
The TLP5701(D4-TP4,E) integrates an infrared LED optically coupled to a high-gain, high-speed photodetector IC with totem-pole (buffer logic) output stage. Its internal noise shield ensures ±20 kV/µs common-mode transient immunity, critical for noisy power-conversion environments.
It features under-voltage lockout (UVLO) with 8.4 V turn-on and 8.1 V turn-off thresholds, operates from 10–30 V supply, and requires a 0.1 µF bypass capacitor between VCC (Pin 6) and GND (Pin 4). The device is rated for reinforced insulation per EN IEC 60747-5-5 when ordered with D4 option - explicitly confirmed for TLP5701(D4-TP4,E).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 5000 Vrms min - enables reinforced insulation compliance for safety-critical motor drives and home appliances. |
| Output Peak Current | ±0.6 A max - sufficient to directly drive small IGBT/MOSFET gates without external buffer stages. |
| Propagation Delay | tpHL/tpLH ≤ 500 ns - supports switching frequencies up to 25 kHz with tight timing control. |
| Common-Mode Transient Immunity | ±20 kV/µs min - suppresses false triggering in high-dV/dt inverter half-bridges. |
| Operating Temperature | -40°C to +110°C - validated for under-hood and industrial ambient conditions without derating. |
| Supply Voltage Range | 10–30 V - compatible with standard 12 V and 24 V control rails in industrial systems. |
| Threshold Input Current | ≤ 5 mA - ensures reliable turn-on with low-power MCU GPIO or comparator outputs. |
Pinout & Package
Package: 6-pin SO6L (Toshiba package code 11-4N1A), surface-mount, creepage/clearance ≥ 8.0 mm, height ≤ 2.3 mm, weight 0.126 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Anode | LED anode input | Connects to current-limited MCU or driver output; requires ≥6.5 mA for guaranteed turn-on. |
| 2: N.C. | No connection | Internally unconnected; must remain floating - no PCB trace or via allowed. |
| 3: Cathode | LED cathode return | Completes LED forward path; ties to ground or low-side switch node. |
| 4: GND | Detector ground reference | Return for internal photodetector IC and bypass capacitor; must be low-impedance. |
| 5: VO (Output) | Buffered output terminal | Drives gate of IGBT/MOSFET; provides ±0.6 A sink/source into capacitive load. |
| 6: VCC | Detector supply input | 10–30 V supply; requires 0.1 µF ceramic capacitor within 1 cm of Pin 4 and Pin 6. |
Key Features
| Feature | Design Value |
|---|---|
| Reinforced insulation certification | VDE EN IEC 60747-5-5 qualified (D4 option) - meets mandatory safety requirements for Class I equipment in EU and global markets. |
| Totem-pole output stage | Buffer logic architecture eliminates need for external pull-up/pull-down resistors - reduces BOM count and layout area. |
| Integrated UVLO protection | 8.4 V turn-on / 8.1 V hysteresis - prevents erratic gate drive during brown-out or soft-start conditions. |
| High CMTI performance | ±20 kV/µs minimum - maintains signal integrity across isolation barrier in fast-switching SiC/GaN inverter designs. |
| Compact SO6L footprint | Smaller and thinner than legacy 8-pin DIP - saves >40% board area while maintaining creepage distance. |
Applications
| Industrial Inverters | IGBT Gate Drivers |
|---|---|
|
Use Scenario: Isolated gate drive in 3-phase AC motor drives for HVAC and pumps. IC Role / Device Role / Timing Role: Signal-level isolation and power-stage gate control with precise edge timing. Use Value: Enables safe, compact inverter design meeting IEC 61800-5-1 reinforced insulation requirements without external level shifters. |
Use Scenario: Driving discrete 600 V IGBTs in solar string inverters and UPS systems. IC Role / Device Role / Timing Role: High-current totem-pole output directly switches IGBT gates at ≤25 kHz. Use Value: Eliminates external gate driver ICs and associated passive components, reducing system cost and failure points. |
| MOSFET Gate Drivers | Induction Cooktops |
|
Use Scenario: Half-bridge synchronous rectification in high-efficiency DC-DC converters. IC Role / Device Role / Timing Role: Fast, matched rise/fall time output ensures shoot-through prevention. Use Value: 500 ns max propagation delay and <80 ns pulse width distortion support ZVS/ZCS topologies. |
Use Scenario: Isolated control of resonant power stage in domestic induction heating modules. IC Role / Device Role / Timing Role: Noise-immune interface between microcontroller and high-side gate driver. Use Value: ±20 kV/µs CMTI prevents misfiring during EMI-rich cooking cycles, improving reliability and EMC pass rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photocoupler gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ACPL-332J-500E | SO-6 package, ±0.6 A output, but only UL/cUL certified (no VDE EN IEC 60747-5-5); 1000 Vrms isolation. | Lacks reinforced insulation certification required for EU industrial equipment; suitable only for basic isolation needs. | Select only if VDE certification is not mandated and lower isolation voltage suffices. |
| SI8261BBC-C-ISR | Digital isolator (SiO₂-based), 4 A peak output, 5 kVrms isolation, but requires external gate resistor and level-shifting logic. | Higher drive strength but adds complexity; lacks integrated UVLO and analog-compatible input threshold. | Prefer when >0.6 A drive or higher CMTI (>35 kV/µs) is needed, accepting added design overhead. |
Compared with ACPL-332J-500E and SI8261BBC-C-ISR, the TLP5701(D4-TP4,E) uniquely combines VDE-reinforced insulation, integrated UVLO, and plug-and-play totem-pole drive in a single SO6L package - simplifying certification and reducing bill-of-materials for cost-sensitive industrial inverters.
Availability
TLP5701(D4-TP4,E) is available at Aetrix Electronics and suitable for industrial inverters, IGBT gate drivers, MOSFET gate drivers, induction cooktops, and home appliance power controls requiring stable component supply, long-term lifecycle assurance, and full safety-compliance documentation.
Supply support for TLP5701(D4-TP4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor components for industrial, automotive, and consumer applications, with emphasis on safety-certified isolation and power management solutions.
The TLP5701 series belongs to Toshiba's photocoupler product line engineered specifically for robust, certified gate driving in high-noise power conversion systems - prioritizing reinforced insulation, high CMTI, and simplified system integration.
FAQ
What safety certifications apply to the TLP5701(D4-TP4,E)?
The TLP5701(D4-TP4,E) carries VDE approval per EN IEC 60747-5-5 and EN IEC 62368-1 for reinforced insulation, plus UL 1577 and cUL recognition. The "D4" suffix explicitly denotes qualification to the VDE standard - confirmed in Toshiba's ordering guide and datasheet Section 17. This makes TLP5701(D4-TP4,E) suitable for Class I equipment requiring certified reinforced insulation in EU and global markets.
Does the TLP5701(D4-TP4,E) require an external bypass capacitor?
Yes - a 0.1 µF ceramic capacitor must be placed between Pin 6 (VCC) and Pin 4 (GND), located within 1 cm of both pins. This is mandatory per Toshiba's Recommended Operating Conditions (Section 9) to stabilize the high-gain photodetector amplifier. Omitting it risks improper switching, oscillation, or latch-up. The TLP5701(D4-TP4,E) does not function reliably without this capacitor.
What is the maximum recommended operating temperature for the TLP5701(D4-TP4,E)?
The TLP5701(D4-TP4,E) is fully specified and guaranteed over -40°C to +110°C ambient temperature (Section 2, General). Absolute maximum junction temperature is 125°C, and thermal derating begins above 95°C per Absolute Maximum Ratings (Section 8). For continuous operation in industrial environments, TLP5701(D4-TP4,E) maintains all electrical parameters including ±20 kV/µs CMTI and ±0.6 A output up to +110°C.
Can the TLP5701(D4-TP4,E) drive a 1200 V IGBT directly?
No - the TLP5701(D4-TP4,E) is optimized for small-class IGBTs and power MOSFETs, with ±0.6 A peak output current and 35 V absolute max output voltage (VO). It is not rated for direct drive of 1200 V IGBTs, which typically require >2 A peak gate current and higher Miller clamping robustness. Use TLP5701(D4-TP4,E) only with IGBTs rated ≤600 V and gate charge ≤150 nC, as validated in Toshiba's application examples.
What is the purpose of Pin 2 (N.C.) on the TLP5701(D4-TP4,E)?
Pin 2 on the TLP5701(D4-TP4,E) is a no-connect terminal - internally unconnected and electrically isolated. It must remain unconnected on the PCB: no trace, via, solder mask opening, or copper pour may contact Pin 2. This is explicitly stated in the Pin Assignment diagram (Section 5) and ensures proper creepage distance and isolation integrity. Bridging or routing to Pin 2 voids safety certification.
TLP5701(D4-TP4,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 6-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Optical Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 5000Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 500ns, 500ns
- Pulse Width Distortion (Max):
- 350ns
- Rise / Fall Time (Typ):
- 50ns, 50ns
- Current - Output High, Low:
- 400mA, 400mA
- Current - Peak Output:
- 600mA
- Voltage - Forward (Vf) (Typ):
- 1.57V
- Current - DC Forward (If) (Max):
- 25 mA
- Voltage - Output Supply:
- 10V ~ 30V
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -40°C ~ 110°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SO
- Approval Agency:
- CQC, CSA, cUL, UL, VDE
TLP5701(D4-TP4,E FAQ
1.How can I place an order for TLP5701(D4-TP4,E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP5701(D4-TP4,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP5701(D4-TP4,E reliable?
The price and inventory of TLP5701(D4-TP4,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP5701(D4-TP4,E is usually 5 days.
3.What payment methods are accepted for TLP5701(D4-TP4,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP5701(D4-TP4,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP5701(D4-TP4,E?
TLP5701(D4-TP4,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP5701(D4-TP4,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP5701(D4-TP4,E?
For technical support, including TLP5701(D4-TP4,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP5701(D4-TP4,E requirements.
6.How does Aetrix verify that TLP5701(D4-TP4,E is sourced from the original manufacturer or authorized distributors?
All TLP5701(D4-TP4,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP5701(D4-TP4,E meets industry standards.
7.What is the process for return or replacement of TLP5701(D4-TP4,E?
All TLP5701(D4-TP4,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP5701(D4-TP4,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP5701(D4-TP4,E part is unused and in its original packaging.
Return procedure for TLP5701(D4-TP4,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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