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Toshiba Semiconductor and Storage TLP5701(TP4,E
- Part No.:
- TLP5701(TP4,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Isolators - Gate Drivers
- Package:
- 6-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
TLP5701(TP4,E.pdf
- Description:
- OPTOISO 5KV 1CH GATE DVR 6SO
- Quantity:
- Payment:
- Shipping:
Inventory:490
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Product details
Overview
TLP5701(TP4,E) from Toshiba Electronic Devices & Storage Corporation is a 6-pin SO6L photocoupler integrating an infrared LED optically coupled to a high-gain, high-speed photodetector IC. It delivers ±0.6 A peak output current, 500 ns max propagation delay, and ±20 kV/µs common-mode transient immunity, operating from -40 °C to 110 °C with 10–30 V supply voltage. It serves as a reinforced-insulation gate driver for small-class IGBTs and power MOSFETs in industrial inverters and induction cooktops.
For engineers reviewing the TLP5701(TP4,E) datasheet, TLP5701(TP4,E) pinout, TLP5701(TP4,E) application, or TLP5701(TP4,E) equivalent, this device is selected for high-noise industrial gate drive where certified isolation (5000 Vrms), fast switching, and compact SO6L footprint are mandatory design requirements.
Technical Context
The TLP5701(TP4,E) implements a totem-pole buffer output stage enabling direct drive of power device gates without external amplification. Its internal noise shield and optimized layout guarantee ≥±20 kV/µs CMTI at full temperature range (-40 °C to 110 °C), critical for reliable operation in high-dV/dt motor control environments.
It features under-voltage lockout (UVLO) with 8.4 V turn-on and 8.1 V turn-off thresholds, ensuring safe output disable during insufficient supply conditions. The detector side requires a mandatory 0.1 µF ceramic bypass capacitor between VCC (Pin 6) and GND (Pin 4), placed within 1 cm of the pins to stabilize the high-gain amplifier and prevent mis-switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 5000 Vrms min - enables reinforced insulation compliance per UL 1577, VDE EN IEC 60747-5-5, and GB4943.1. |
| Output Peak Current | ±0.6 A max - directly drives small IGBT/MOSFET gates without external buffers in <10 A systems. |
| Propagation Delay | tpHL/tpLH ≤ 500 ns - supports >200 kHz PWM switching with tight timing control in inverter gate drivers. |
| CMTI | ±20 kV/µs min - suppresses false triggering in high-noise industrial environments with rapid bus transients. |
| Operating Temperature | -40 °C to 110 °C - rated for under-hood and enclosed power electronics applications without derating. |
| Supply Voltage Range | 10–30 V - compatible with standard 12 V and 24 V industrial control rails. |
| Threshold Input Current | ≤5 mA - ensures low-power MCU or FPGA GPIO compatibility without additional current amplification. |
Pinout & Package
Package: 6-pin SO6L (Toshiba package code 11-4N1A), surface-mount, 2.3 mm max height, 8.0 mm min creepage/clearance - optimized for space-constrained industrial PCB layouts requiring safety certification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Anode | LED input anode | Connects to MCU/FPGA output via current-limiting resistor; forward current ≤10 mA typical. |
| 2: N.C. | No connection | Internally unconnected; must remain floating - no routing or soldering required. |
| 3: Cathode | LED input cathode | Return path for LED current; ties to ground or logic low reference. |
| 4: GND | Detector ground reference | System ground for photodetector IC; mandatory connection point for 0.1 µF bypass capacitor. |
| 5: VO (Output) | Buffered output terminal | Drives gate of IGBT/MOSFET; sinks or sources up to ±0.6 A with totem-pole logic-level swing. |
| 6: VCC | Detector supply input | 10–30 V supply for photodetector IC; must be decoupled to Pin 4 with 0.1 µF ceramic capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| Reinforced insulation | 5000 Vrms isolation with VDE EN IEC 60747-5-5, UL 1577, and cUL certification - eliminates need for external isolation components in Class I systems. |
| Totem-pole output | Direct-drive buffer architecture - removes external gate driver ICs, reducing BOM count and layout area in compact inverters. |
| Integrated UVLO | 8.4 V turn-on / 8.1 V hysteresis - prevents partial turn-on of power devices during brown-out, enhancing system safety and reliability. |
| High CMTI | ≥±20 kV/µs - maintains signal integrity across isolation barrier in presence of >1 kV/ns transients common in IGBT switching nodes. |
| Compact SO6L footprint | Surface-mount 6-pin package - 40% smaller board area vs. legacy 8-pin DIP photocouplers while maintaining safety spacing. |
Applications
| Industrial Inverters | IGBT Gate Drivers |
|---|---|
|
Use Scenario: Three-phase motor control in HVAC and pump drives where EMI and bus transients exceed 1 kV/µs. IC Role / Device Role / Timing Role: Isolated gate driver providing logic-level signal translation and robust noise immunity between MCU and IGBT half-bridge. Use Value: Enables stable 20 kHz PWM operation with <500 ns timing skew and no false triggering, even at 110 °C ambient. |
Use Scenario: High-efficiency solar string inverters requiring fast, isolated gate control for 600 V IGBTs. IC Role / Device Role / Timing Role: Primary isolation interface delivering ±0.6 A peak gate current with guaranteed CMTI performance. Use Value: Eliminates need for discrete opto + external driver stages, reducing gate loop inductance and improving switching loss consistency. |
| MOSFET Gate Drivers | Induction Cooktops |
|
Use Scenario: High-frequency resonant converters using 100 V SiC MOSFETs in EV charging and industrial SMPS. IC Role / Device Role / Timing Role: Fast-response isolated driver supporting <500 ns propagation delay and sub-100 ns rise/fall times. Use Value: Maintains precise dead-time control and prevents shoot-through in synchronous rectifier topologies. |
Use Scenario: Domestic induction cooktops with microcontroller-based power regulation and thermal protection. IC Role / Device Role / Timing Role: Safety-isolated interface between low-voltage control logic and high-side power switch drivers. Use Value: Meets IEC 60335-1 reinforced insulation requirements while enabling compact, cost-effective PCB layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photocoupler gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ACPL-332J-500E | SO-6 package, ±0.6 A output, but lower CMTI (15 kV/µs), no integrated UVLO. | Suitable for less noisy 60 Hz line-frequency applications; not recommended for high-dV/dt inverter outputs. | Select when cost sensitivity outweighs CMTI requirement and external UVLO is acceptable. |
| SI8261BD-D-IS | Digital isolator (capacitive), 4 A peak output, 35 kV/µs CMTI, but requires external gate resistor and level-shifting. | Better for high-current SiC/GaN gate driving; lacks integrated LED driver and optical simplicity. | Select when higher peak current and superior CMTI justify added complexity and bill-of-materials increase. |
Compared with ACPL-332J-500E and SI8261BD-D-IS, the TLP5701(TP4,E) offers balanced integration-combining optical simplicity, built-in UVLO, and certified 20 kV/µs CMTI in a single SO6L package-making it optimal for cost- and space-constrained industrial gate drive where regulatory compliance is non-negotiable.
Availability
TLP5701(TP4,E) is available at Aetrix Electronics and suitable for industrial inverters, IGBT gate drivers, and induction cooktops requiring stable component supply, long-term lifecycle support, and RoHS-compliant tape-and-reel packaging (1500 pcs/reel).
Supply support for TLP5701(TP4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for industrial, automotive, and consumer applications, with core expertise in power devices, logic ICs, and optoelectronics.
The TLP5701(TP4,E) belongs to Toshiba's photocoupler product line engineered specifically for reinforced-isolation gate driving in high-noise power conversion systems, emphasizing safety certification, thermal robustness, and compact packaging.
FAQ
What is the maximum operating temperature rating for the TLP5701(TP4,E)?
The TLP5701(TP4,E) is rated for continuous operation from -40 °C to +110 °C. This extended temperature range is validated across all key parameters including propagation delay, output current, and CMTI, making it suitable for enclosed industrial environments such as motor drive enclosures and induction cooktop control modules where ambient temperatures exceed 85 °C.
Does the TLP5701(TP4,E) require an external bypass capacitor?
Yes, the TLP5701(TP4,E) requires a 0.1 µF ceramic capacitor connected between Pin 6 (VCC) and Pin 4 (GND). This capacitor must be placed within 1 cm of the pins to stabilize the internal high-gain photodetector amplifier. Omission or improper placement may cause erratic switching behavior or failure to meet specified propagation delay and noise immunity specs.
What safety certifications does the TLP5701(TP4,E) hold?
The TLP5701(TP4,E) is UL-recognized (UL 1577, File No. E67349), cUL-recognized (CSA 5A File No. E67349), VDE-approved (EN IEC 60747-5-5 and EN IEC 62368-1), and CQC-certified (GB4943.1). These approvals confirm its suitability for reinforced insulation in Class I equipment without additional system-level isolation barriers.
Can the TLP5701(TP4,E) drive both IGBTs and MOSFETs directly?
Yes, the TLP5701(TP4,E) delivers ±0.6 A peak output current and operates with 10–30 V supply, enabling direct gate drive of small-class IGBTs (up to ~15 A) and power MOSFETs (up to ~30 A) without external buffer stages. Its totem-pole output structure provides symmetrical sourcing/sinking capability essential for fast, low-loss switching in half-bridge configurations.
What is the purpose of Pin 2 (N.C.) on the TLP5701(TP4,E)?
Pin 2 on the TLP5701(TP4,E) is a no-connect (N.C.) terminal - it is internally unconnected and must remain electrically floating. Routing traces to or soldering this pin violates the device's certified isolation structure and may compromise creepage distance, safety certification, and long-term reliability. PCB layout must leave Pin 2 unconnected.
TLP5701(TP4,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 6-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Optical Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 5000Vrms
- Common Mode Transient Immunity (Min):
- 20kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 500ns, 500ns
- Pulse Width Distortion (Max):
- 350ns
- Rise / Fall Time (Typ):
- 50ns, 50ns
- Current - Output High, Low:
- 400mA, 400mA
- Current - Peak Output:
- 600mA
- Voltage - Forward (Vf) (Typ):
- 1.57V
- Current - DC Forward (If) (Max):
- 25 mA
- Voltage - Output Supply:
- 10V ~ 30V
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -40°C ~ 110°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SO
- Approval Agency:
- CQC, CSA, cUL, UL, VDE
TLP5701(TP4,E FAQ
1.How can I place an order for TLP5701(TP4,E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP5701(TP4,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP5701(TP4,E reliable?
The price and inventory of TLP5701(TP4,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP5701(TP4,E is usually 5 days.
3.What payment methods are accepted for TLP5701(TP4,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP5701(TP4,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP5701(TP4,E?
TLP5701(TP4,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP5701(TP4,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP5701(TP4,E?
For technical support, including TLP5701(TP4,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP5701(TP4,E requirements.
6.How does Aetrix verify that TLP5701(TP4,E is sourced from the original manufacturer or authorized distributors?
All TLP5701(TP4,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP5701(TP4,E meets industry standards.
7.What is the process for return or replacement of TLP5701(TP4,E?
All TLP5701(TP4,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP5701(TP4,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP5701(TP4,E part is unused and in its original packaging.
Return procedure for TLP5701(TP4,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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