Toshiba Semiconductor and Storage TLP5702H(TP4,E
- Part No.:
- TLP5702H(TP4,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Logic Output Optoisolators
- Package:
- 6-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
TLP5702H(TP4,E.pdf
- Description:
- GATE DRIVE COUPLER; HIGH TEMP; R
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
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Product details
Overview
TLP5702H(TP4,E) from Toshiba Electronic Devices & Storage Corporation is a 6-pin SO6L photocoupler integrating an infrared LED and high-speed photodetector IC for isolated gate driving of IGBTs and power MOSFETs. It delivers ±2.5 A peak output current, 200 ns max propagation delay, ±50 kV/µs common-mode transient immunity, 5000 Vrms isolation voltage, and operates from -40°C to +125°C in PV inverters and industrial motor drives.
For engineers reviewing the TLP5702H(TP4,E) datasheet, TLP5702H(TP4,E) pinout, TLP5702H(TP4,E) application, or TLP5702H(TP4,E) equivalent, this device serves as a reinforced-insulation, buffer-output optocoupler optimized for high-noise, high-voltage gate drive where compact size, fast switching, and certified safety compliance are critical selection criteria.
Technical Context
The TLP5702H(TP4,E) implements a totem-pole output stage with internal noise shielding to achieve guaranteed ±50 kV/µs CMTI at up to 125°C ambient. Its input LED is optically coupled to a high-gain photodetector IC that drives a push-pull output capable of sourcing/sinking ±2.5 A peak into gate loads.
It requires a 0.1 µF bypass capacitor between VCC (Pin 6) and GND (Pin 4), supports 15–30 V supply, and features UVLO with 11.0 V turn-on and 9.5 V turn-off thresholds. The device meets UL 1577, CSA Component Acceptance, and EN IEC 60747-5-5 (with D4 option) for reinforced insulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Type | Buffer logic (totem-pole) enabling direct connection to IGBT/MOSFET gates without external pull-up/down resistors |
| Peak Output Current | ±2.5 A max - sufficient to rapidly charge/discharge gate capacitance of medium-power devices |
| Propagation Delay | tpHL/tpLH ≤ 200 ns - enables high-frequency PWM operation up to 50 kHz with minimal timing skew |
| CMTI | ±50 kV/µs min - maintains signal integrity during fast dV/dt transients in inverter half-bridges |
| Isolation Voltage | 5000 Vrms min - certified for reinforced insulation per UL, CSA, and VDE standards |
| Operating Temp | -40°C to +125°C - supports deployment in under-hood automotive inverters and industrial enclosures |
| Supply Voltage | 15–30 V - compatible with standard gate driver supply rails and tolerant of rail droop |
Pinout & Package
Package: SO6L (TOSHIBA designation 11-4N1A), surface-mount, 6-pin, creepage/clearance ≥ 8.0 mm, height ≤ 2.3 mm, weight 0.126 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | LED anode input - connect to microcontroller GPIO or driver via current-limiting resistor |
| 2 | N.C. | No internal connection - must remain unconnected; no routing or copper fill required |
| 3 | Cathode | LED cathode return - tie to ground or low-side switch emitter/source |
| 4 | GND | Photodetector IC ground reference - connect directly to 0.1 µF bypass capacitor negative terminal |
| 5 | VO (Output) | Push-pull output - directly drives gate of N-channel IGBT or MOSFET; open-drain behavior not supported |
| 6 | VCC | Positive supply for photodetector IC - connect 0.1 µF ceramic capacitor to Pin 4 within 1 cm |
Key Features
| Feature | Design Value |
|---|---|
| Reinforced Insulation | 5000 Vrms isolation with UL/cUL/VDE/GB certification - eliminates need for external isolation barriers in safety-critical systems |
| High CMTI Shielding | Internal noise shield guarantees ±50 kV/µs immunity - prevents false triggering in high-dV/dt inverter legs |
| UVLO Protection | 11.0 V turn-on / 9.5 V turn-off hysteresis - blocks output until gate supply stabilizes, preventing partial turn-on damage |
| Compact SO6L Footprint | Smaller and thinner than legacy 8-pin DIP - saves PCB area in space-constrained PV and appliance inverters |
| Wide Temp Range | Rated for continuous operation from -40°C to +125°C - suitable for under-hood and sealed industrial environments |
Applications
| Photovoltaic Inverters | Industrial Motor Drives |
|---|---|
Use Scenario: Isolated gate drive for string-level DC-AC conversion in residential and commercial solar inverters. IC Role / Device Role / Timing Role: Provides reinforced-isolation, high-CMTI gate control for IGBTs in H-bridge and multilevel topologies. Use Value: Enables compact, certified designs meeting IEC 62109 and UL 1741 SB requirements without external isolation components. | Use Scenario: Gate driving in variable-frequency drives for pumps, fans, and compressors in factory automation. IC Role / Device Role / Timing Role: Delivers fast, noise-immune switching signals to 600–1200 V IGBT modules in three-phase inverters. Use Value: Maintains reliable operation under EMI-heavy factory floor conditions with ±50 kV/µs CMTI margin. |
| Induction Cooktops | Air Conditioner Inverters |
Use Scenario: Driving half-bridge IGBTs in resonant tank circuits for high-efficiency cooking coil excitation. IC Role / Device Role / Timing Role: Acts as isolated level-shifter and gate driver with precise timing control for ZVS/ZCS operation. Use Value: Supports >20 kHz switching with <200 ns delay matching across channels to minimize shoot-through risk. | Use Scenario: Controlling compressor and fan inverter stages in split-system and ducted HVAC units. IC Role / Device Role / Timing Role: Provides robust gate drive for 650 V IGBTs operating in high-temperature, high-humidity indoor environments. Use Value: Sustains full performance at 125°C ambient, eliminating thermal derating in sealed outdoor condenser units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photocoupler gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLP5702(LF4,E) | Same die, lead-formed package (11-4N101A) instead of tape-and-reel SO6L; identical electrical specs and ratings | Designed for through-hole or manual prototyping; incompatible with automated SMT placement | Select when hand-soldering or using wave soldering; not suitable for high-volume SMT lines |
| ACPL-332J-000E | Lower peak output (±2.0 A), higher propagation delay (300 ns max), same 5000 Vrms isolation and -40°C to +105°C range | Rated only to +105°C - unsuitable for 125°C industrial or automotive under-hood use cases | Choose only if ambient temperature stays below 105°C and lower drive strength is acceptable |
Compared with TLP5702H(TP4,E), the TLP5702(LF4,E) offers identical performance in a different mechanical form factor, while the ACPL-332J-000E trades 25% lower peak current and 50% slower switching for broader distributor availability - making TLP5702H(TP4,E) the optimal choice for thermally demanding, high-speed gate drive applications requiring full 125°C operation and ±2.5 A capability.
Availability
TLP5702H(TP4,E) is available at Aetrix Electronics and suitable for photovoltaic power conditioning systems, industrial motor drives, and home appliance inverters requiring stable component supply, long-term lifecycle support, and certified reinforced insulation.
Supply support for TLP5702H(TP4,E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics for industrial, automotive, and consumer applications.
The TLP5702H(TP4,E) belongs to Toshiba's high-speed, high-isolation photocoupler product line, engineered specifically for noise-immune gate driving in high-voltage power conversion systems where safety certification and thermal robustness are mandatory.
FAQ
What is the maximum recommended operating temperature for the TLP5702H(TP4,E)?
The TLP5702H(TP4,E) is rated for continuous operation from -40°C to +125°C. This maximum junction temperature rating is validated per its absolute maximum ratings table and confirmed in the Recommended Operating Conditions section. Operation beyond 125°C ambient risks exceeding the 150°C absolute maximum junction temperature and may cause irreversible degradation. Thermal design must ensure adequate heatsinking or airflow to maintain Tj ≤ 150°C under worst-case load conditions.
Does the TLP5702H(TP4,E) require an external bypass capacitor?
Yes, the TLP5702H(TP4,E) requires a 0.1 µF ceramic bypass capacitor connected between Pin 6 (VCC) and Pin 4 (GND). This is explicitly mandated in Section 6 ("Internal Circuit") and Section 9 ("Recommended Operating Conditions") of the datasheet to stabilize the high-gain photodetector IC and prevent oscillation or improper switching. The capacitor must be placed within 1 cm of the pins; failure to install it will result in unreliable output behavior, especially at high frequencies or under load.
What safety certifications does the TLP5702H(TP4,E) hold?
The TLP5702H(TP4,E) is UL-recognized (UL 1577, File No. E67349), cUL-recognized (CSA Component Acceptance Service No. 5A, File No. E67349), and VDE-approved for EN IEC 60747-5-5 and EN IEC 62368-1 - but only when ordered with the D4 option (e.g., TLP5702H(D4-TP4,E)). The base TLP5702H(TP4,E) carries UL/cUL certification and meets reinforced insulation requirements per GB4943.1 in China and Thailand factories.
Can the TLP5702H(TP4,E) drive both IGBTs and MOSFETs?
Yes, the TLP5702H(TP4,E) is explicitly designed for small-to-medium-class IGBT and power MOSFET gate driving, as stated in Section 2 ("General"). Its ±2.5 A peak output current, 200 ns propagation delay, and totem-pole output architecture enable direct connection to the gate terminals of both device types without external buffers. Application notes confirm successful use with 600 V and 1200 V IGBTs and 650 V MOSFETs in inverter half-bridges.
What is the function of Pin 2 on the TLP5702H(TP4,E)?
Pin 2 on the TLP5702H(TP4,E) is designated N.C. (No Connection) and has no internal bond wire or circuit connection. It must remain electrically floating - no PCB trace, copper pour, or component should be attached to it. This is confirmed in Section 5 ("Pin Assignment") and Section 8 ("Absolute Maximum Ratings") Note 4, which states Pins 1, 2, and 3 are shorted together only in the context of two-terminal isolation testing, not functional operation.
TLP5702H(TP4,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 6-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Number of Channels:
- 1
- Inputs - Side 1/Side 2:
- 1/0
- Voltage - Isolation:
- 5000Vrms
- Common Mode Transient Immunity (Min):
- 50kV/µs
- Input Type:
- DC
- Output Type:
- Push-Pull, Totem Pole
- Current - Output / Channel:
- -
- Data Rate:
- -
- Propagation Delay tpLH / tpHL (Max):
- 200ns, 200ns
- Rise / Fall Time (Typ):
- 37ns, 50ns
- Voltage - Forward (Vf) (Typ):
- 1.55V
- Current - DC Forward (If) (Max):
- 20mA
- Voltage - Supply:
- 15V ~ 30V
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SO
TLP5702H(TP4,E FAQ
1.How can I place an order for TLP5702H(TP4,E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP5702H(TP4,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP5702H(TP4,E reliable?
The price and inventory of TLP5702H(TP4,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP5702H(TP4,E is usually 5 days.
3.What payment methods are accepted for TLP5702H(TP4,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP5702H(TP4,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP5702H(TP4,E?
TLP5702H(TP4,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP5702H(TP4,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP5702H(TP4,E?
For technical support, including TLP5702H(TP4,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP5702H(TP4,E requirements.
6.How does Aetrix verify that TLP5702H(TP4,E is sourced from the original manufacturer or authorized distributors?
All TLP5702H(TP4,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP5702H(TP4,E meets industry standards.
7.What is the process for return or replacement of TLP5702H(TP4,E?
All TLP5702H(TP4,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP5702H(TP4,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP5702H(TP4,E part is unused and in its original packaging.
Return procedure for TLP5702H(TP4,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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