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Toshiba Semiconductor and Storage TLP5751(D4-TP,E

Part No.:
TLP5751(D4-TP,E
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Isolators - Gate Drivers
Package:
6-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixTLP5751(D4-TP,E.pdf
Description:
OPTOISO 5KV 1CH GATE DVR 6SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,810

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Product details

Overview

TLP5751(D4-TP,E from Toshiba Electronic Devices & Storage Corporation is a reinforced-insulation photocoupler with integrated high-speed photodetector and totem-pole output stage, designed for gate driving IGBTs and MOSFETs in high-noise industrial inverters. It delivers ±1.0 A peak output current, 150 ns max propagation delay, ±35 kV/µs common-mode transient immunity, and operates across -40°C to +110°C in 6-pin SO6L package.

For engineers reviewing the TLP5751(D4-TP,E datasheet, TLP5751(D4-TP,E pinout, TLP5751(D4-TP,E application, or TLP5751(D4-TP,E equivalent, this device is selected for high-reliability isolated gate drive where rail-to-rail output, UVLO protection, and VDE-compliant reinforced insulation (EN IEC 60747-5-5) are required in induction cooktops, air conditioner inverters, and industrial motor drives.

Technical Context

The TLP5751(D4-TP,E integrates an infrared LED input stage with a monolithic photo IC detector featuring internal Faraday shielding and a totem-pole buffer output. Its logic-level truth table enables direct interface with microcontroller GPIOs without external level-shifting.

It implements under-voltage lockout (UVLO) with 12.1 V turn-on and 11.1 V turn-off thresholds, supports 15–30 V supply range, and requires a mandatory 1 µF ceramic bypass capacitor between VCC (Pin 6) and GND (Pin 4) placed within 1 cm of the pins to stabilize high-gain amplifier operation and ensure reliable switching.

Key Specifications

ParameterValue and Actual Design Meaning
Isolation Voltage5000 Vrms min - meets reinforced insulation requirements per UL 1577, VDE EN IEC 60747-5-5, and CQC GB4943.1
Output Peak Current±1.0 A max - drives high-gate-charge IGBTs/MOSFETs directly without external buffers
Propagation Delay150 ns max - enables >50 kHz switching in inverter applications with tight timing control
CMTI±35 kV/µs min - suppresses false triggering in high-dV/dt motor drive environments
Supply Voltage Range15–30 V - compatible with standard industrial gate driver supply rails
Operating Temperature-40°C to +110°C - qualified for under-hood and enclosed inverter module use
Threshold Input Current4 mA max - ensures low-power MCU compatibility with margin for aging and temperature drift

Pinout & Package

Package: 6-pin SO6L (Toshiba package code 11-4N1A), surface-mount, creepage/clearance ≥8.0 mm, isolation thickness ≥0.4 mm, height ≤2.3 mm, weight 0.126 g (typ.).

Pin/TerminalCircuit RoleDesign Meaning
1: AnodeLED input anodeConnects to MCU GPIO or driver through current-limiting resistor; forward voltage 1.45–1.70 V @10 mA
2: N.C.No connectionInternally unconnected; must remain floating - no PCB trace or solder mask bridge
3: CathodeLED input cathodeReturn path for LED current; reverse voltage rating 5 V max
4: GNDDetector ground referenceReference for output stage and UVLO circuit; requires 1 µF bypass capacitor to Pin 6
5: VO (Output)Buffered output terminalRail-to-rail totem-pole output; sinks or sources up to ±1.0 A; logic-high = VCC – 0.2 V typ.
6: VCCDetector supply inputPower input for photodetector and output stage; UVLO active below 12.1 V; must be decoupled to Pin 4

Key Features

FeatureDesign Value
Rail-to-rail totem-pole outputEnables full-swing gate drive without external pull-up/pull-down resistors, reducing component count and layout area
Integrated Faraday shieldGuarantees ±35 kV/µs CMTI performance - critical for noise immunity in 600–1200 V inverter half-bridges
Under-voltage lockout (UVLO)Prevents partial turn-on of power devices by disabling output when VCC drops below 11.1 V (hysteresis 1.0 V)
Reinforced insulation certificationVDE EN IEC 60747-5-5 compliance (Option D4) verified - eliminates need for external isolation barriers in safety-critical designs
Compact SO6L footprint50 % smaller than legacy 8-pin DIP - saves PCB space in densely packed inverter control boards

Applications

Induction Cooktop ControlAir Conditioner Inverter

Use Scenario: Isolated gate drive for IGBT half-bridge in resonant inverter powering induction heating coil.

IC Role / Device Role / Timing Role: High-speed signal isolator with rail-to-rail output directly driving IGBT gates at 20–50 kHz switching frequency.

Use Value: ±35 kV/µs CMTI prevents false triggering during rapid dV/dt transients across IGBT collector-emitter; 150 ns delay ensures precise dead-time control.

Use Scenario: Gate driving SiC MOSFETs in variable-speed compressor inverter modules operating at elevated ambient temperatures.

IC Role / Device Role / Timing Role: Reinforced-isolation gate driver enabling safe MCU-to-power-stage interface in compact, sealed outdoor units.

Use Value: -40°C to +110°C rating and VDE-certified reinforced insulation allow deployment in thermally constrained outdoor condenser enclosures without derating.

Industrial Motor DriveMOSFET-Based UPS

Use Scenario: Driving high-side and low-side N-channel MOSFETs in three-phase inverter stacks for servo and pump drives.

IC Role / Device Role / Timing Role: Logic-compatible photocoupler providing galvanic isolation and fast edge response for PWM gate signals.

Use Value: 4 mA max threshold current ensures compatibility with 3.3 V/5 V MCUs; ±1.0 A output current supports gate charge requirements of 100 nC+ MOSFETs.

Use Scenario: Isolating gate control signals between DSP controller and power stage in online double-conversion UPS systems.

IC Role / Device Role / Timing Role: Safety-certified signal isolator meeting reinforced insulation requirements for Class I equipment per EN 62368-1.

Use Value: 5000 Vrms isolation voltage and EN IEC 60747-5-5 (D4 option) compliance satisfy regulatory testing for medical-grade and telecom UPS applications.

Equivalent & Alternatives

The following parts are listed as comparable options for similar gate driver photocoupler applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ACPL-332J-000ESO-6 package, ±2.5 A output, 100 ns max propagation delay, 3750 Vrms isolation, no integrated Faraday shieldLacks VDE-reinforced insulation certification; requires external CMTI enhancement for high-noise invertersSelect when higher peak current and faster switching are prioritized over regulatory certification and CMTI robustness
SI8271BD-D-ISSi-based digital isolator, 4 A output, 200 ns propagation delay, 5000 Vrms isolation, integrated DC-DC converterNo LED aging concerns but requires external power supply filtering; not a photocoupler architectureSelect when long-term LED degradation stability is not required and system-level BOM simplification via integrated isolated supply is preferred

Compared with ACPL-332J-000E and SI8271BD-D-IS, the TLP5751(D4-TP,E provides certified reinforced insulation and guaranteed ±35 kV/µs CMTI in a proven photocoupler architecture - making it optimal for safety-critical, high-noise industrial inverters where regulatory approval and field reliability are non-negotiable.

Availability

TLP5751(D4-TP,E is available at Aetrix Electronics and suitable for induction cooktops, air conditioner inverters, and industrial motor drives requiring stable component supply, long-lifecycle support, and VDE-compliant reinforced insulation.

Supply support for TLP5751(D4-TP,E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and optoelectronics for industrial, automotive, and consumer applications.

The TLP5751 series belongs to Toshiba's high-reliability photocoupler product line, engineered specifically for isolated gate driving in high-voltage, high-noise inverter systems where safety certification, CMTI robustness, and thermal stability are essential.

FAQ

What is the purpose of the 1 µF capacitor required for TLP5751(D4-TP,E?

The 1 µF ceramic capacitor between Pin 6 (VCC) and Pin 4 (GND) stabilizes the internal high-gain linear amplifier in the TLP5751(D4-TP,E photodetector. Without it, the device may exhibit oscillation or improper switching due to supply rail instability. Toshiba specifies placement within 1 cm of the pins to minimize inductance and ensure effective high-frequency decoupling across the -40°C to +110°C operating range.

Does TLP5751(D4-TP,E support both high-side and low-side gate driving?

Yes, the TLP5751(D4-TP,E supports both configurations via its rail-to-rail totem-pole output. When used for high-side driving, it interfaces with bootstrap or isolated DC-DC supplies; for low-side, it connects directly to ground-referenced gate circuits. Its ±1.0 A peak output current and logic-compatible input threshold (≤4 mA) enable flexible integration into half-bridge and three-phase inverter topologies without additional buffering.

What safety certifications apply to TLP5751(D4-TP,E specifically?

The "D4" suffix in TLP5751(D4-TP,E explicitly denotes qualification to EN IEC 60747-5-5 for reinforced insulation. It also carries UL 1577 recognition (File E67349), cUL CSA Component Acceptance (File E67349), and CQC GB4943.1 approval for Japan and Thailand factories - all verified for the exact TLP5751(D4-TP,E ordering variant, not just the base TLP5751 family.

How does the UVLO function in TLP5751(D4-TP,E protect power devices?

The TLP5751(D4-TP,E incorporates an internal under-voltage lockout that disables the output stage when VCC falls below 11.1 V (turn-off) and re-enables it above 12.1 V (turn-on), providing 1.0 V hysteresis. This prevents partial turn-on of IGBTs or MOSFETs during brownout conditions - eliminating shoot-through risk and ensuring clean, full-enhancement gate drive only when supply integrity is confirmed.

Can TLP5751(D4-TP,E replace older 8-pin DIP photocouplers without PCB redesign?

No - the TLP5751(D4-TP,E uses a 6-pin SO6L package (Toshiba 11-4N1A), which has different pin pitch, footprint, and land pattern than legacy 8-pin DIP packages. While it offers 50 % smaller mounting area, direct replacement requires PCB layout revision. Refer to Toshiba's Fig. 15.1 for exact land pattern dimensions and soldering profile requirements for reflow compatibility.

TLP5751(D4-TP,E Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
6-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Optical Coupling
Number of Channels:
1
Voltage - Isolation:
5000Vrms
Common Mode Transient Immunity (Min):
35kV/µs
Propagation Delay tpLH / tpHL (Max):
150ns, 150ns
Pulse Width Distortion (Max):
50ns
Rise / Fall Time (Typ):
15ns, 8ns
Current - Output High, Low:
1A, 1A
Current - Peak Output:
1A
Voltage - Forward (Vf) (Typ):
1.55V
Current - DC Forward (If) (Max):
20 mA
Voltage - Output Supply:
15V ~ 30V
Grade:
-
Qualification:
-
Operating Temperature:
-40°C ~ 110°C
Mounting Type:
Surface Mount
Supplier Device Package:
6-SO
Approval Agency:
CQC, CSA, cUL, UL, VDE

TLP5751(D4-TP,E FAQ

1.How can I place an order for TLP5751(D4-TP,E through Aetrix?

Please submit a Request for Quotation (RFQ) for TLP5751(D4-TP,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLP5751(D4-TP,E reliable?

The price and inventory of TLP5751(D4-TP,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP5751(D4-TP,E is usually 5 days.

3.What payment methods are accepted for TLP5751(D4-TP,E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP5751(D4-TP,E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLP5751(D4-TP,E?

TLP5751(D4-TP,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLP5751(D4-TP,E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLP5751(D4-TP,E?

For technical support, including TLP5751(D4-TP,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP5751(D4-TP,E requirements.

6.How does Aetrix verify that TLP5751(D4-TP,E is sourced from the original manufacturer or authorized distributors?

All TLP5751(D4-TP,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP5751(D4-TP,E meets industry standards.

7.What is the process for return or replacement of TLP5751(D4-TP,E?

All TLP5751(D4-TP,E units undergo pre-shipment inspection (PSI). If there is an issue with TLP5751(D4-TP,E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLP5751(D4-TP,E part is unused and in its original packaging.

Return procedure for TLP5751(D4-TP,E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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