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Toshiba Semiconductor and Storage TLP5751(E
- Part No.:
- TLP5751(E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Isolators - Gate Drivers
- Package:
- 6-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
TLP5751(E.pdf
- Description:
- OPTOISO 5KV 1CH GATE DVR 6SO
- Quantity:
- Payment:
- Shipping:
Inventory:1,562
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Product details
Overview
TLP5751(E) from Toshiba Electronic Devices & Storage Corporation is a high-speed, rail-to-rail output photocoupler with integrated photodetector and infrared LED in a 6-pin SO6L package. It delivers ±1.0 A peak output current, 150 ns max propagation delay, and ±35 kV/µs common-mode transient immunity for IGBT/MOSFET gate driving in induction cooktops and industrial inverters.
For engineers reviewing the TLP5751(E) datasheet, TLP5751(E) pinout, TLP5751(E) application, or TLP5751(E) equivalent, this device is selected for reinforced insulation (5000 Vrms), totem-pole logic output, and operation across –40°C to +110°C in safety-certified power conversion systems.
Technical Context
The TLP5751(E) integrates an infrared LED coupled to a high-gain, high-speed photo IC with internal Faraday shield - enabling guaranteed ±35 kV/µs CMTI and rail-to-rail VO swing. Its totem-pole output stage supports direct drive of power semiconductor gates without external buffers.
It operates with 15–30 V supply voltage and requires a 1 µF bypass capacitor between VCC (Pin 6) and GND (Pin 4). Threshold input current is ≤4 mA, and UVLO protection activates at ~12.1 V with 0.7 V hysteresis, ensuring robust start-up and fault recovery in noisy inverter environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Isolation Voltage | 5000 Vrms min - meets reinforced insulation requirements per UL 1577, EN IEC 60747-5-5, and GB4943.1. |
| Output Peak Current | ±1.0 A max - directly drives IGBT/MOSFET gates without external amplification in high-power switching stages. |
| Propagation Delay | 150 ns max - enables precise timing control up to 50 kHz switching frequency in motor and inverter applications. |
| CMTI | ±35 kV/µs min - suppresses false triggering during fast dV/dt transients in high-voltage power circuits. |
| Operating Temperature | –40°C to +110°C - supports deployment in sealed, thermally constrained environments like air conditioner inverters. |
| Supply Voltage Range | 15–30 V - compatible with standard industrial DC bus rails and eliminates need for auxiliary LDO regulation. |
| Threshold Input Current | ≤4 mA - ensures reliable turn-on with low-power MCU GPIO or isolated PWM controllers. |
Pinout & Package
Package: 6-pin SO6L (Toshiba package code 11-4N1A), surface-mount, creepage/clearance ≥8.0 mm, height ≤2.3 mm, weight 0.126 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Anode | LED input anode | Connects to current-limited driver (e.g., MCU GPIO via series resistor); IF ≤20 mA absolute max. |
| 2: N.C. | No connection | Internally unconnected; must remain floating - no routing or soldering required. |
| 3: Cathode | LED input cathode | Reference return path for LED forward current; ties to system ground or driver low-side switch. |
| 4: GND | Detector ground | Return node for output stage and bypass capacitor; must be low-inductance connection to local ground plane. |
| 5: VO (Output) | Logic-level output | Rail-to-rail totem-pole output; sinks or sources up to ±1.0 A for direct gate drive of power devices. |
| 6: VCC | Detector supply | 15–30 V supply input; requires 1 µF ceramic capacitor placed ≤1 cm from Pin 6 to Pin 4 for stability. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail totem-pole output | Enables full-swing VO (0 V to VCC) without external level-shifting, reducing component count in gate driver stages. |
| Internal Faraday shield | Guarantees ±35 kV/µs CMTI - critical for noise immunity in high-dV/dt IGBT half-bridges and inverter legs. |
| UVLO with hysteresis | Activates below ~12.1 V (±0.7 V hysteresis) to prevent erratic output during brown-out or startup conditions. |
| Reinforced insulation | 5000 Vrms isolation and compliance with UL, cUL, VDE (EN IEC 60747-5-5), and CQC standards - simplifies safety certification. |
| Compact SO6L footprint | 50% smaller than legacy 8-pin DIP - saves PCB area in space-constrained home appliance and HVAC control boards. |
Applications
| Induction Cooktop Control | Industrial Motor Inverter |
|---|---|
|
Use Scenario: Isolated gate driving for 10–20 kW resonant half-bridge IGBT modules in consumer induction hobs. IC Role / Device Role / Timing Role: Signal-isolated high-current gate driver providing logic-level input to power stage with precise edge timing. Use Value: ±35 kV/µs CMTI prevents misfiring during rapid load transients; rail-to-rail VO ensures full gate voltage swing for low RDS(on) conduction. |
Use Scenario: Gate drive isolation in 3-phase VFDs for pumps, compressors, and conveyors operating in factory environments. IC Role / Device Role / Timing Role: Reinforced-isolation interface between MCU PWM outputs and IGBT gate terminals in high-noise industrial settings. Use Value: 5000 Vrms isolation and –40°C to +110°C rating support long-term reliability under thermal cycling and EMI stress. |
| Air Conditioner Inverter | MOSFET/IGBT Gate Driver Module |
|
Use Scenario: Compact, thermally efficient gate driver for variable-speed compressor inverters in residential and commercial HVAC units. IC Role / Device Role / Timing Role: High-speed optocoupled driver delivering <150 ns propagation delay to maintain tight dead-time control. Use Value: SO6L package reduces board area by 50% vs. DIP alternatives while maintaining safety clearance for compact outdoor unit designs. |
Use Scenario: Standalone gate driver IC in discrete power modules or hybrid driver boards requiring high peak current and noise immunity. IC Role / Device Role / Timing Role: Direct-drive buffer replacing discrete transistor pairs in medium-power (<5 kW) switching applications. Use Value: ±1.0 A output current eliminates need for external push-pull stages; 4 mA threshold enables low-power controller compatibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photocoupler-based gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLP5752(E) | Dual-channel version with identical specs per channel; higher pin count (8-pin SO8), same SO6L-derived footprint per channel. | Suitable where two independent isolated gate drives are needed on one board (e.g., half-bridge top/bottom). | Select TLP5752(E) only when dual-channel integration reduces layout complexity versus two TLP5751(E) units. |
| ACPL-332J | Lower CMTI (±25 kV/µs), same 6-pin SOIC package, but rated for 2.5 kVrms isolation and narrower temp range (–40°C to +105°C). | Acceptable for cost-sensitive, non-safety-critical 1–3 kW inverters where reinforced insulation is not mandated. | Choose ACPL-332J only if system-level safety certification is not required and thermal margin is >5°C below max operating point. |
Compared with TLP5751(E), TLP5752(E) offers channel integration at the cost of increased package size, while ACPL-332J trades isolation robustness and temperature range for lower cost - making TLP5751(E) the optimal choice for certified, high-reliability inverter gate drive.
Availability
TLP5751(E) is available at Aetrix Electronics and suitable for induction cooktop control, industrial motor inverter design, and air conditioner inverter development requiring stable component supply, long lifecycle support, and traceable sourcing.
Supply support for TLP5751(E) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor components, including power devices, logic ICs, and optoelectronics, with global manufacturing and quality certifications.
The TLP5751(E) belongs to Toshiba's high-speed photocoupler product line, engineered specifically for reinforced-isolation gate driving in energy-efficient inverters and home appliances demanding safety, noise immunity, and compact packaging.
FAQ
What is the maximum recommended operating temperature for the TLP5751(E)?
The TLP5751(E) is rated for continuous operation from –40°C to +110°C. This extended range supports deployment in sealed, thermally challenging environments such as induction cooktop control boards and outdoor HVAC inverter units. Derating is not required within this range, but thermal design must ensure junction temperature remains ≤125°C under worst-case load and ambient conditions.
Does the TLP5751(E) require an external bypass capacitor?
Yes - a 1 µF ceramic capacitor must be placed between Pin 6 (VCC) and Pin 4 (GND), located within 1 cm of both pins. This capacitor stabilizes the internal high-gain amplifier and prevents oscillation or improper switching. Omission results in unreliable output behavior, especially under fast transient loads typical in IGBT gate drive applications.
What safety certifications does the TLP5751(E) hold?
The TLP5751(E) is UL-recognized (UL 1577, File No. E67349), cUL-recognized (CSA 5A File No. E67349), VDE-approved (EN IEC 60747-5-5 and EN IEC 62368-1), and CQC-approved (GB4943.1). These certifications confirm compliance with reinforced insulation requirements for end-equipment safety certification in North America, Europe, China, and Japan.
Can the TLP5751(E) drive both MOSFETs and IGBTs directly?
Yes - the TLP5751(E) delivers ±1.0 A peak output current and rail-to-rail VO swing, enabling direct gate drive of medium-power MOSFETs and IGBTs used in induction cooktops, HVAC inverters, and industrial motor drives. Its 150 ns max propagation delay supports switching frequencies up to 50 kHz without timing skew issues.
What is the function of Pin 2 (N.C.) on the TLP5751(E)?
Pin 2 is a no-connect terminal - internally unconnected and electrically isolated. It must remain unconnected on the PCB: no trace routing, no soldering, and no tie to ground or any other net. This pin exists for mechanical symmetry and package compatibility; violating its N.C. status may compromise isolation integrity or cause parametric drift.
TLP5751(E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 6-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- Optical Coupling
- Number of Channels:
- 1
- Voltage - Isolation:
- 5000Vrms
- Common Mode Transient Immunity (Min):
- 35kV/µs
- Propagation Delay tpLH / tpHL (Max):
- 150ns, 150ns
- Pulse Width Distortion (Max):
- 50ns
- Rise / Fall Time (Typ):
- 15ns, 8ns
- Current - Output High, Low:
- 1A, 1A
- Current - Peak Output:
- 1A
- Voltage - Forward (Vf) (Typ):
- 1.55V
- Current - DC Forward (If) (Max):
- 20 mA
- Voltage - Output Supply:
- 15V ~ 30V
- Grade:
- -
- Qualification:
- -
- Operating Temperature:
- -40°C ~ 110°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SO
- Approval Agency:
- CQC, CSA, cUL, UL
TLP5751(E FAQ
1.How can I place an order for TLP5751(E through Aetrix?
Please submit a Request for Quotation (RFQ) for TLP5751(E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLP5751(E reliable?
The price and inventory of TLP5751(E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLP5751(E is usually 5 days.
3.What payment methods are accepted for TLP5751(E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLP5751(E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLP5751(E?
TLP5751(E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLP5751(E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLP5751(E?
For technical support, including TLP5751(E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLP5751(E requirements.
6.How does Aetrix verify that TLP5751(E is sourced from the original manufacturer or authorized distributors?
All TLP5751(E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLP5751(E meets industry standards.
7.What is the process for return or replacement of TLP5751(E?
All TLP5751(E units undergo pre-shipment inspection (PSI). If there is an issue with TLP5751(E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLP5751(E part is unused and in its original packaging.
Return procedure for TLP5751(E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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